MMA8653FCR1


3-axis 10-bit digital MEMS accelerometer, +/-2g/4g/8g, I2C, 7uA low-power, DFN-10 (2x2mm), -40~85C, Obsolete

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Manufacturer Part:

MMA8653FCR1

Package:

DFN-10 (2 x 2 x 1.0 mm), Case 2162

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Description

The MMA8653FCR1 from NXP Semiconductors is a 3-axis, 10-bit digital MEMS accelerometer in a compact DFN-10 (2x2x1mm) package. It features dynamically selectable full-scale ranges of plus/minus 2g, plus/minus 4g, and plus/minus 8g with 1 mg/LSB sensitivity and low noise of 150 micro-g per root-Hz. The device communicates via I2C (7-bit address 0x1D) supporting standard mode (100 kHz) and fast mode (400 kHz), with output data rates from 1.56 Hz to 800 Hz. Embedded functions include configurable motion detection, freefall detection, and portrait/landscape orientation detection, all accessible through two programmable interrupt pins (INT1, INT2). The Auto-Wake/Sleep feature automatically changes ODR based on activity, enabling ultra-low 7 micro-amp current consumption in low-power mode. Supply voltage: 1.95V to 3.6V; I2C interface voltage: 1.62V to 3.6V. Operating temperature: -40C to 85C. Status: Obsolete (NXP recommends FXLS8974CF as replacement). RoHS3, EAR99.

The MMA8653FCR1 from NXP Semiconductors is an intelligent, low-power, 3-axis capacitive MEMS accelerometer with 10-bit resolution, housed in an ultra-compact DFN-10 package measuring just 2 x 2 x 1.0 mm. The device is designed for consumer electronics and industrial sensing applications requiring motion, tilt, and orientation detection with minimal power consumption and board footprint.

The accelerometer features three dynamically selectable full-scale ranges: plus/minus 2g (sensitivity 256 LSB/g), plus/minus 4g (128 LSB/g), and plus/minus 8g (64 LSB/g), all with 1 mg/LSB high sensitivity and low noise of 150 micro-g per root-Hz independent of resolution. The 10-bit ADC provides digital output accessible through an I2C serial interface at standard (100 kHz) or fast mode (400 kHz) data rates, with programmable output data rates from 1.56 Hz to 800 Hz.

The device is packed with embedded intelligent functions that offload the host processor: motion/freefall detection, portrait/landscape orientation detection with 15-degree hysteresis, and configurable auto-wake/sleep state transitions. Two programmable interrupt pins (INT1, INT2) can be configured for any combination of embedded functions, enabling the accelerometer to monitor inertial events while remaining in a low-power mode during periods of inactivity. The auto-wake feature automatically increases the ODR when motion is detected and reduces it during inactivity, achieving an ultra-low 7 micro-amp current consumption in low-power mode.

The device operates with separate supply domains: VDD (1.95V to 3.6V) for the analog/sensor section and VDDIO (1.62V to 3.6V) for the digital I2C interface, enabling direct connection to 1.8V, 2.5V, or 3.3V microcontrollers without level shifters. The BYP pin provides connection for the internal regulator bypass capacitor. The I2C slave address is 0x1D (write: 0x3A, read: 0x3B).

The R1 suffix denotes tape and reel packaging with 3,000 units per reel. Note: NXP has discontinued this product (End of Life) and recommends the FXLS8974CF as a replacement. The device is RoHS3 compliant, MSL Level 1 (unlimited), and classified as EAR99.

The MMA8653FCR1 operates as a capacitive MEMS accelerometer, converting mechanical acceleration into digital output through a transducer, signal conditioning, and analog-to-digital conversion pipeline.

Capacitive Sensing Element: The core sensing mechanism uses a micro-electromechanical system (MEMS) structure consisting of a proof mass suspended by silicon springs above fixed electrodes. When acceleration is applied along any axis, the proof mass deflects proportionally, changing the capacitance between the proof mass and the fixed electrodes. The device contains three independent capacitive half-bridges, one for each axis (X, Y, Z), each producing a differential capacitance change proportional to the applied acceleration.

Signal Conditioning: The capacitance changes are converted to voltage signals by a capacitance-to-voltage (C-V) converter using a switched-capacitor architecture. The voltage signals then pass through a programmable gain amplifier (PGA) that sets the full-scale range: plus/minus 2g, plus/minus 4g, or plus/minus 8g. Higher gain increases sensitivity but reduces the maximum measurable acceleration range.

Analog-to-Digital Conversion: The conditioned analog signals are digitized by a 10-bit successive approximation register (SAR) ADC. The ADC operates at an oversampled rate, and the digital output is decimated to the user-selected output data rate (ODR) ranging from 1.56 Hz to 800 Hz. The 10-bit resolution provides 1,024 discrete levels, yielding 1 mg/LSB sensitivity at the plus/minus 2g range.

Digital Signal Processing: The digitized acceleration data passes through a digital filter chain that includes both low-pass and high-pass filtering options. The high-pass filter removes the DC gravity component, enabling detection of dynamic acceleration events (motion, shock) without the static 1g gravity offset. The filtered data is stored in output registers accessible via the I2C interface.

Embedded Functions: The integrated state machines implement motion detection by comparing acceleration magnitude against programmable thresholds, freefall detection by checking if all-axis magnitude drops below a threshold, and orientation detection by analyzing the angle of the gravity vector relative to the device axes. These functions operate autonomously without host processor intervention, generating interrupts only when configured conditions are met.

Auto-Wake/Sleep: The power management state machine monitors accelerometer data and automatically transitions between active (high ODR) and sleep (low ODR) modes. When motion exceeding a configurable threshold is detected, the device wakes to a higher ODR for precise measurement. During periods of inactivity, the device sleeps at a lower ODR, reducing current consumption to as low as 7 micro-amps while still monitoring for wake events.

Pin Name Type Description
1 VDD Power Device power supply (1.95V to 3.6V); connect 0.1uF and 1uF decoupling capacitors as close as possible to pin; powers the analog/sensor section
2 SCL Input I2C serial clock; open-drain, requires external pullup resistor to VDDIO; supports 100 kHz standard mode and 400 kHz fast mode; not tolerant above VDDIO+0.3V
3 INT1 Output Configurable interrupt output 1; can be mapped to any combination of embedded functions (motion, freefall, orientation, data ready, auto-wake/sleep); active state polarity programmable
4 BYP Output Internal regulator output bypass; connect a 0.1uF capacitor from BYP to GND for internal voltage regulator stability; do not connect external loads
5 INT2 Output Configurable interrupt output 2; independent from INT1; same mapping capabilities; enables monitoring two event categories on separate pins
6 GND Power Ground; connect to system ground plane
7 GND Power Ground; connect to system ground plane
8 VDDIO Power Digital interface power supply (1.62V to 3.6V); sets the I2C and interrupt pin voltage levels; can differ from VDD for mixed-voltage systems; connect 0.1uF decoupling capacitor
9 GND Power Ground; connect to system ground plane
10 SDA I/O I2C serial data; open-drain bidirectional, requires external pullup resistor to VDDIO; data latched on SCL rising edge; not tolerant above VDDIO+0.3V
Application Description
Screen Orientation Portrait/landscape detection with 15-degree hysteresis; automatic display rotation in smartphones and tablets; embedded orientation engine eliminates host processing overhead
Freefall Protection Detects freefall condition (all-axis magnitude below threshold); used in HDD head parking, laptop drop protection, and drone crash detection; configurable threshold and timing
Wearable Motion Sensing 7uA low-power mode enables continuous motion monitoring in smartwatches and fitness trackers; auto-wake/sleep extends battery life; step counting and activity recognition
Industrial Vibration Monitoring 800 Hz maximum ODR captures vibration signatures; high-pass filter removes gravity DC offset for pure dynamic acceleration analysis; predictive maintenance applications
IoT Inertial Wake-up Auto-wake generates interrupt on motion detection while sleeping at 7uA; ideal for battery-powered IoT sensors that only need to report when moved or disturbed
Model Manufacturer Compatibility Key Difference
FXLS8974CF NXP Recommended Replacement 12-bit resolution (vs 10-bit); same I2C interface; different register map; requires software migration; NXP official replacement recommendation
MMA8451QR1 NXP Functionally Similar 14-bit resolution; larger QFN-16 package (3x3mm); same I2C interface with address 0x1D; additional embedded functions; higher power consumption
LIS2DH12TR ST Functionally Similar 12-bit resolution; DFN-12 (2x2mm); SPI/I2C interface; similar power profile; different register map; ST product line
ADXL362BCCZ ADI Functionally Similar 12-bit; SPI-only interface; ultra-low 270nA motion-activated wake-up; larger LGA-16 (3.25×3.1mm); different application focus
BMA456 Bosch Functionally Similar 16-bit; LGA-12 (2x2mm); I2C/SPI; built-in step counter and activity recognition; different feature set
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We have obtained a number of professional certifications and built our own professional testing laboratory.This ensures that every product we deliver to our customers meets the highest quality requirements.We conduct tests in strict accordance with procedures to ensure stable product quality and accurate parameters.To guarantee genuine original parts, we also cooperate with reliable third-party testing institutions for strict quality inspection.We always attach great importance to quality and fully comply with industry standards, relevant regulations, and ISO 9001:2015 requirements.

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All electronic components we source from our partnered supply chains go through strict incoming inspections.Through careful testing, we ensure everything delivered to customers is genuine original parts and meets quality requirements.In addition, we keep complete inspection records to make the entire supply chain process clear and traceable.

Certification
We have obtained a number of professional certifications and built our own professional testing laboratory.This ensures that every product we deliver to our customers meets the highest quality requirements.We conduct tests in strict accordance with procedures to ensure stable product quality and accurate parameters.To guarantee genuine original parts, we also cooperate with reliable third-party testing institutions for strict quality inspection.We always attach great importance to quality and fully comply with industry standards, relevant regulations, and ISO 9001:2015 requirements.

Service & Packaging

All electronic components we source from our partnered supply chains go through strict incoming inspections.Through careful testing, we ensure everything delivered to customers is genuine original parts and meets quality requirements.In addition, we keep complete inspection records to make the entire supply chain process clear and traceable.

Certification
We have obtained a number of professional certifications and built our own professional testing laboratory.This ensures that every product we deliver to our customers meets the highest quality requirements.We conduct tests in strict accordance with procedures to ensure stable product quality and accurate parameters.To guarantee genuine original parts, we also cooperate with reliable third-party testing institutions for strict quality inspection.We always attach great importance to quality and fully comply with industry standards, relevant regulations, and ISO 9001:2015 requirements.