TXS0102DCUR


2-bit bi-dir level shifter, 1.65-3.6V A / 2.3-5.5V B, 24Mbps push-pull, auto-direction, VSSOP-8, -40~85°C

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Manufacturer Part:

TXS0102DCUR

Package:

VSSOP-8 (DCU) (2.3 x 2.0 x 0.9 mm, 0.5mm pitch)

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Description

The TXS0102DCUR from Texas Instruments is a 2-bit bidirectional voltage-level translator for open-drain and push-pull applications in an 8-pin VSSOP (DCU) package. It supports A-port voltages from 1.65 V to 3.6 V (VCCA) and B-port voltages from 2.3 V to 5.5 V (VCCB), enabling translation between 1.8-V, 2.5-V, 3.3-V, and 5-V logic nodes without direction control. Maximum data rates are 24 Mbps (push-pull) and 2 Mbps (open-drain). Features include VCC isolation, partial-power-down Ioff support, no power-supply sequencing requirement, and ESD protection up to 8-kV HBM on the B port. Operating temperature range is -40°C to +85°C.

The TXS0102DCUR is a 2-bit bidirectional voltage-level translator from Texas Instruments designed for mixed-voltage systems where I²C, UART, GPIO, or other digital signals must cross between different voltage domains. It requires no direction-control signal — each channel automatically senses and translates in both directions, simplifying board design.

The A port operates from 1.65 V to 3.6 V (tracking VCCA), and the B port operates from 2.3 V to 5.5 V (tracking VCCB), with the constraint VCCA ≤ VCCB. This covers all common logic voltage combinations: 1.8 V-to-3.3 V, 1.8 V-to-5 V, 3.3 V-to-5 V, and 2.5 V-to-3.3 V.

The TXS architecture uses passive pass-transistor switches with edge-rate accelerators. For open-drain buses (I²C, SMBus), the pass-FET provides a low-impedance path and the one-shot accelerator briefly turns on a strong pull-up to speed rising edges, achieving up to 2 Mbps. For push-pull signals (UART, SPI, GPIO), the accelerator provides fast edges up to 24 Mbps.

The VCC isolation feature ensures that if either VCCA or VCCB is at GND, both ports enter a high-impedance state, preventing back-feeding. The Ioff circuitry supports partial-power-down mode, allowing one side to be powered down while the other remains active without leakage. No power-supply sequencing is required — either rail can ramp first.

ESD protection is asymmetric: the A port provides 2.5-kV HBM, while the B port (facing the higher-voltage, often external-facing side) provides 8-kV HBM. The OE pin, when pulled low, places all I/Os in high-impedance state with reduced quiescent current. The VSSOP-8 (DCU) package occupies only 4.6 mm² of board area, making it ideal for space-constrained portable designs.

**Pass-FET Switch Core:** Each channel consists of an N-channel pass transistor connecting the A and B sides. The pass-FET gate is biased at a voltage between VCCA and VCCB, allowing bidirectional current flow when either side drives low. The on-resistance is approximately 10 Ω, providing a low-impedance path for DC and low-frequency signals.

**Edge-Rate Accelerator:** One-shot circuits on each side detect falling edges and briefly turn on a strong pull-down (≈ 30 mA for ~30 ns) to accelerate the transition. For rising edges on open-drain buses, the accelerator briefly turns on a strong pull-up to overcome the weak external pull-up resistor. This enables 2 Mbps on I²C at 3.3-V/5-V translation.

**Auto-Direction Detection:** The TXS translator has no explicit direction control. The pass-FET inherently allows either side to drive the bus low. When neither side is driving, the external pull-up resistors (for open-drain) or the driving device (for push-pull) pull the line high through the pass-FET. This transparent operation eliminates the need for a DIR pin.

**VCC Isolation and Ioff:** When either supply is at GND, an internal circuit detects the condition and opens the pass-FET, placing both I/Os in high-impedance. The Ioff feature ensures that no leakage current flows from the powered side to the unpowered side, which is critical for hot-swap and battery-backup applications.

Pin Name Type Description
1 VCCA P A-port supply (1.65-3.6V); powers A-side I/O buffers and OE input logic; bypass with 0.1µF ceramic to GND
2 A1 I/O Channel 1 A-port I/O; voltage referenced to VCCA; connects to low-voltage side of signal
3 A2 I/O Channel 2 A-port I/O; voltage referenced to VCCA
4 GND G Ground; connect to PCB ground plane
5 B2 I/O Channel 2 B-port I/O; voltage referenced to VCCB; connects to high-voltage side of signal
6 B1 I/O Channel 1 B-port I/O; voltage referenced to VCCB
7 VCCB P B-port supply (2.3-5.5V); powers B-side I/O buffers; must be ≥ VCCA; bypass with 0.1µF ceramic to GND
8 OE I Output enable (active high); referenced to VCCA; tie to GND via pull-down resistor for safe power-up; internal pull-up to VCCA; pull low to disable all I/Os (Hi-Z)
Application Description
I²C/SMBus Level Shifting Bridge 1.8V or 3.3V MCU I²C bus to 5V peripheral; auto-direction handles bidirectional SDA without DIR pin; 2Mbps supports 1MHz Fast-mode Plus; pull-up resistors on both sides set idle-high levels
UART Cross-Voltage Communication Translate 3.3V MCU UART TX/RX to 5V GPS module or cellular modem; push-pull mode supports 24Mbps; OE pin allows MCU to tri-state bus for shared UART lines
GPIO Voltage Adapter Interface 1.8V SoC GPIOs to 3.3V or 5V sensors and displays; both channels independently handle mixed open-drain and push-pull signals; VCC isolation protects SoC when peripheral power is off
Model Manufacturer Compatibility Key Difference
TXS0102DCTT TI Pin-Compatible, Same Die SSOP-8 package (2.95×2.80mm vs VSSOP 2.3×2.0mm); same electrical specs; use when SSOP footprint preferred
TXS0108EPW TI Functional Upgrade, 8-bit 8-channel version; TSSOP-20; same VCCA/VCCB ranges; auto-direction; use when more channels needed in single package
PCA9306DCUR TI Functional Equivalent 2-bit bidirectional; VSSOP-8; open-drain only (no push-pull); requires external pull-ups; use for I²C-only applications
SN74LVC1T45DBVR TI Competitive Alternative 1-bit with DIR pin (direction control); SOT-23-6; 200Mbps; requires direction signal; use for high-speed unidirectional translation
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All electronic components we source from our partnered supply chains go through strict incoming inspections.Through careful testing, we ensure everything delivered to customers is genuine original parts and meets quality requirements.In addition, we keep complete inspection records to make the entire supply chain process clear and traceable.

Certification
We have obtained a number of professional certifications and built our own professional testing laboratory.This ensures that every product we deliver to our customers meets the highest quality requirements.We conduct tests in strict accordance with procedures to ensure stable product quality and accurate parameters.To guarantee genuine original parts, we also cooperate with reliable third-party testing institutions for strict quality inspection.We always attach great importance to quality and fully comply with industry standards, relevant regulations, and ISO 9001:2015 requirements.

Service & Packaging

All electronic components we source from our partnered supply chains go through strict incoming inspections.Through careful testing, we ensure everything delivered to customers is genuine original parts and meets quality requirements.In addition, we keep complete inspection records to make the entire supply chain process clear and traceable.

Certification
We have obtained a number of professional certifications and built our own professional testing laboratory.This ensures that every product we deliver to our customers meets the highest quality requirements.We conduct tests in strict accordance with procedures to ensure stable product quality and accurate parameters.To guarantee genuine original parts, we also cooperate with reliable third-party testing institutions for strict quality inspection.We always attach great importance to quality and fully comply with industry standards, relevant regulations, and ISO 9001:2015 requirements.