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74HC573PW


八位 D 型透明锁存器,3 态输出,LE 和 OE 控制,2-6V,TSSOP-20,-40~125C,I/O 位于总线接口的对侧

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制造商零件:

74HC573PW

包装:

TSSOP-20 (SOT360-1) (6.4 x 4.4 x 1.2 mm)

品牌:
产品类别:
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说明

Nexperia 的 74HC573PW 是一款八路 D 型透明锁存器,具有 3 态输出,采用 TSSOP-20 封装 (SOT360-1,6.4 x 4.4 mm)。它具有 8 个 D 型锁存器,带有锁存使能 (LE) 和输出使能 (OE) 控制功能。当 LE 为高电平时,锁存器是透明的 - D 输入端的数据直接显示在 Q 输出端。当 LE 为低电平时,D 输入端在高电平到低电平转换时的数据被锁存并保持在输出端。OE 输入(低电平有效)控制三态输出:当 OE 为高电平时,无论 LE 或 D 输入状态如何,所有输出都处于高阻抗状态;OE 不会影响内部锁存状态。电源电压:2.0V 至 6.0V(74HC),4.5V 至 5.5V(74HCT)。传播延迟:14ns typ(4.5V 时)。输出驱动+/-7.8mA。静态电源电流:6.0V 时最大 80uA。输入和输出位于封装的相对侧,简化了微处理器总线接口的 PCB 布线。ESD:HBM 超过 2000V,CDM 超过 1000V。工作温度:-40C 至 +125C。有源产品,符合 RoHS 规范。.

Nexperia 的 74HC573PW 是一款八位(8 位)D 型透明锁存器,具有 3 态输出,采用 20 引脚 TSSOP 封装。它是数字系统设计中应用最广泛的总线锁存器器件之一,尤其适用于微处理器和微控制器的地址/数据总线解复用。.

74HC573 在功能上与 74HC373 完全相同,但引脚布局不同,所有数据输入都位于封装的一侧,而所有输出都位于封装的另一侧。这种直通式引脚布局大大简化了面向总线设计的 PCB 布局,数据总线从左到右(或从上到下)流经锁存器。相比之下,74HC373 的输入和输出交错排列,使得总线布线更加复杂。.

该器件提供两种控制功能:锁存使能(LE)和输出使能(OE)。LE 引脚控制锁存器是透明(将输入数据传递到输出)还是保持(锁存最后一个数据)。OE 引脚控制输出是激活(驱动总线)还是处于高阻抗状态(与总线断开)。这两个控制独立运行:OE 只影响输出缓冲器,而不影响内部锁存状态,因此即使输出被禁用,锁存数据也会保留。.

透明锁存器操作:当 LE 为高电平时,每个 D 输入直接通过各自的锁存器到达相应的 Q 输出。之所以说锁存器是 ‘透明 ’的,是因为输出跟随输入,只有传播延迟(VCC=4.5V 时约为 14ns)。该模式在微处理器用有效数据驱动地址/数据总线时使用。当 LE 从高电平转换到低电平时,下降沿时 D 输入端的数据被捕获(锁存)并保持在 Q 输出端。然后,锁存器变得不透明--D 输入端的变化不再影响 Q 输出,直到 LE 再次变为高电平。.

三态输出控制:OE 引脚控制输出缓冲器,与锁存状态无关。当 OE 为低电平(激活)时,输出用锁存数据驱动总线。当 OE 为高电平时,所有输出都进入高阻抗(Hi-Z)状态,从而有效地断开器件与总线的连接。这样,多个器件就可以共享一条公共输出总线,而不会发生争用。即使输出被禁用,内部锁存器也会继续保持数据,因此当 OE 再次变为低电平时,数据立即可用。.

微处理器总线解复用:74HC573 的主要应用是解复用许多微处理器和微控制器使用的地址/数据组合总线。在这些系统中,相同的物理引脚在不同的时钟相位上同时传输地址和数据信息。74HC573 在地址阶段捕获地址(LE=高电平,然后 LE 变为低电平以锁存),当总线转换到数据阶段时,锁存的地址在输出端保持稳定。这样,当数据总线可用于读/写操作时,系统可使用地址进行存储器解码。.

74HC573 也常用作输出端口扩展器。微控制器通过驱动 D 输入和 LE 脉冲将数据写入锁存器。然后,锁存数据驱动外部外设(LED、继电器、显示器),与微控制器总线状态无关。OE 引脚可根据需要启用/禁用端口输出。.

74HC 变体的工作电压范围为 2.0V 至 6.0V,采用 CMOS 输入电平,而 74HCT 变体的工作电压范围为 4.5V 至 5.5V,采用 TTL 兼容输入电平。当与 5V TTL 或 CMOS 逻辑连接时,HCT 变体是首选,而 HC 变体则用于低电压应用。.

所有输入端上的输入钳位二极管可通过限流电阻与超过 VCC 的电压连接。在混合电压系统中,输入信号可能来自更高的电压域,这一特性非常有用。根据 JESD 78 二级 B 类标准,闩锁性能超过 100mA,可确保在恶劣的电气环境中可靠运行。.

74HC573PW 作为 8 个独立的 D 型透明锁存器运行,具有通用控制输入和 3 态输出缓冲器。.

透明锁存单元:8 个锁存单元中的每个单元都由一个数据输入端 (D)、一个传输门、一个反馈反相器和一个输出缓冲器组成。当 LE 为高电平时,传输门将 D 输入连接到锁存器节点,反馈反相器保持逻辑电平。输出缓冲器根据锁存节点的值驱动 Q 输出。在这种透明状态下,Q 输出跟随 D 输入,传播延迟由传输门和输出缓冲器延迟决定(VCC=4.5V 时约为 14ns)。.

锁存操作:当 LE 从高电平转换为低电平时,传输门打开,断开 D 输入与锁存节点的连接。然后,反馈反相器在锁存节点无限期地保持最后一个逻辑电平(只要保持供电)。Q 输出继续驱动锁存值。关键的时序参数是数据设置时间(tsu,通常为 3-5ns):D 输入必须在 LE 下降沿之前至少稳定 tsu,以确保正确的数据捕获。数据保持时间(th)通常在 LE 下降沿后 1-2ns 内。.

三态输出缓冲器:每个输出缓冲器由一对互补 MOSFET(P 沟道上拉和 N 沟道下拉)组成,可通过 OE 控制启用或禁用。当 OE 为低电平(输出启用)时,缓冲器正常工作,根据锁存数据驱动输出高电平或低电平。当 OE 为高电平(输出禁用)时,两个 MOSFET 均关闭,输出处于高阻抗状态。Hi-Z 状态下的输出阻抗通常大于 1 欧姆,可有效断开器件与总线的连接。OE 控制不会影响内部锁存节点 - 无论处于何种 OE 状态,锁存数据都会保留。.

控制独立:LE 和 OE 控制完全独立。这意味着:(1) 锁存器可在输出禁用(OE=高)时进行更新(LE 拨动),从而允许器件在启用输出前预先加载数据。(2) 输出可以禁用(OE=高),同时锁存器保留当前数据,允许其他设备驱动总线。(3) 如果需要,两种控制可同时操作,但必须注意满足数据捕获的时序要求。.

直通式引脚布局:TSSOP-20 封装的引脚排列方式是,所有数据输入(D0-D7)位于一侧(引脚 2-9),所有数据输出(Q0-Q7)位于另一侧(引脚 12-19)。控制引脚(OE 位于引脚 1,LE 位于引脚 11)和电源引脚(VCC 位于引脚 20,GND 位于引脚 10)位于两端。这种直通式布局使器件可以放置在两条总线之间,并将布线复杂度降到最低--输入总线从一侧进入,输出总线从另一侧输出,而控制信号则来自两端。.

CMOS 实现:该器件采用硅门 CMOS 技术,具有互补的 N 沟道和 P 沟道 MOSFET。CMOS 实现提供了:(1) 几乎零静态功耗(只有在输入稳定和器件不开关时才有漏电流);(2) 轨至轨输出摆幅(VOL 接近 0V,VOH 接近 VCC);(3) 对称输出驱动能力(VCC=4.5V 时+/-7.8mA 源电流和灌电流);(4) 宽输入阈值带来的高抗噪能力(HC 变体的 VCC 约为 30-70%)。.

避免总线争用:当多个三态设备共享一条公共总线时,任何时候都只能有一个设备驱动总线。当两个或更多器件试图同时将总线驱动到不同的逻辑电平时,就会发生总线争用,从而导致电流过大,损坏输出缓冲器。系统设计人员必须确保总线上所有设备的 OE 信号是互斥的。一种常用的技术是使用解码器(如 74HC238)来生成 OE 信号,确保每次只启用一个器件。.

针脚 名称 类型 说明
1 OE 输入 输出启用输入;低电平有效;低电平 = 输出启用(驱动总线);高电平 = 输出处于高阻抗状态;OE 不影响内部锁存器状态;可用于断开设备与共享总线的连接而不丢失锁存数据
2 D0 输入 数据输入 0;LE 为高电平时数据进入锁存器;LE 从高电平到低电平转换时捕获数据
3 D1 输入 数据输入 1
4 D2 输入 数据输入 2
5 D3 输入 数据输入 3
6 D4 输入 数据输入 4
7 D5 输入 数据输入 5
8 D6 输入 数据输入 6
9 D7 输入 数据输入 7
10 接地 电源 接地(0V)
11 LE 输入 锁存器使能输入;高电平有效;高电平 = 锁存透明数据(Q 跟随 D);低电平 = 锁存最后一个数据;在 LE 的高电平到低电平转换时捕获数据;必须满足设置和保持时间要求才能可靠捕获数据
12 Q7 输出 三态锁存器输出 7;当 OE 为低电平时驱动总线;当 OE 为高电平时为高阻抗
13 Q6 输出 三态锁存器输出 6
14 Q5 输出 三态锁存器输出 5
15 Q4 输出 三态锁存器输出 4
16 Q3 输出 三态锁存器输出 3
17 Q2 输出 三态锁存器输出 2
18 Q1 输出 三态锁存器输出 1
19 Q0 输出 三态锁存器输出 0
20 VCC 电源 电源电压;74HC573 为 2.0V 至 6.0V;74HCT573 为 4.5V 至 5.5V;用 0.1uF 陶瓷电容器与接地端解耦
应用 说明
微处理器地址锁存器 解复用地址/数据组合总线;在 ALE(地址锁存使能)脉冲期间捕获地址;锁存的地址驱动存储器和 I/O 解码器,而数据总线可用于读/写操作;74HC573 直通引脚简化了地址总线布线
输出端口扩展 向微控制器添加 8 条并行输出线;从数据总线向 D 输入写入数据;脉冲 LE 捕获数据;输出驱动 LED、继电器、显示器或其他外设;OE 启用/禁用端口;锁存数据,无需 CPU 干预
输入端口缓冲 通过 74HC573 缓冲 8 条输入线,OE 由地址解码器控制;输入数据在 LE 上捕获并保持,供微控制器通过数据总线读取;三态输出允许多个输入端口共享同一数据总线
内存写入数据锁存器 从共享总线上捕获写入数据并保持稳定,适用于速度较慢的内存设备;LE 在写入选通下降沿捕获数据;输出驱动内存数据输入;OE 调为低电平,以始终启用输出;确保整个内存写入周期的数据稳定性
LED 显示器复用 为多路 LED 显示器保存数位或段落数据;一个 74HC573 可锁存段落数据,另一个可锁存数位选择数据;两者均由微控制器控制;3 态输出可启用/禁用多路循环中的单个显示器
模型 制造商 兼容性 主要区别
74HC373PW Nexperia 功能相同,引脚不同 逻辑功能相同,但采用交错式 I/O 引脚布局(非直通式);采用相同的 TSSOP-20 封装;在首选交错式引脚布局或在现有设计中替换 74HC373 时使用;由于采用直通式布局,新设计通常首选 74HC573
74HCT573PW Nexperia TTL 级变体 与 74HC573PW 相同,但具有 TTL 兼容输入阈值(VIL=0.8V,VIH=2.0V);工作电压仅为 4.5V-5.5V;用于连接 5V TTL 或 NMOS 逻辑;引脚和封装相同
74HC573D Nexperia 同为 SO-20 封装 采用 SO-20 封装(7.5 毫米体宽),功能相同;占地面积较大,但易于手工焊接;引脚布局相同;当 TSSOP 太小而无法组装时使用
74HC273PW Nexperia 边缘触发变体 八进制 D 型触发式触发器,采用边缘触发(时钟)操作,而非透明锁存器;相同的 TSSOP-20 引脚布局,用 CLK 代替 LE;在时钟上升沿捕获数据;需要边缘触发操作时使用
SN74HC573PW TI 功能等同 Texas Instruments 的相同功能;TSSOP-20 的相同引脚输出;相同的电气特性;不同的制造商;用作第二个信号源
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5. Local Pickup in Shenzhen

Local pickup service is available for customers in Shenzhen and surrounding areas:
  • Address: Room 2919, Guoli Building, Huaqiang North, Futian District, Shenzhen, Guangdong Province, China
  • Business Hours: 09:00 – 18:00, Monday to Friday. Closed on weekends and official public holidays.
  • Notice: Please make an appointment via email or communication tools one day in advance, and present your order information upon pickup.

Contact Information

Email: info@materialparts.com

Tel / WhatsApp: +86 13760382860

服务与包装

Materialparts is a professional electronic component supplier based in Shenzhen, China, with over 20 years of global trading experience. We integrate component procurement, quality inspection, technical support, customized packaging, and global delivery services to provide one-stop supply chain solutions. Our business covers industrial control, automotive electronics, consumer electronics, medical devices and other industries. We always adhere to genuine sources, stable supply and considerate after-sales service.

Core Services

1. One-stop Sourcing & BOM Support

We specialize in a full range of passive and active electronic components, including SMD resistors, power resistors, connectors, aviation connectors, LED beads, flexible circuit boards, printed circuit boards, and integrated circuits. Our professional team provides BOM list consolidation, component matching, and alternative model recommendation services. We support sample orders, small-batch trial production, and mass production orders with flexible MOQs to meet diverse procurement needs.

2. Genuine Product Guarantee & Full-process Quality Inspection

All products are sourced from official authorized channels and are 100% original genuine parts. Every batch of goods undergoes strict full-process quality inspection before delivery, with complete batch records and traceability documents provided. Our products comply with AEC-Q standards for automotive electronics and high-reliability specifications for medical devices. We eliminate counterfeits, refurbished parts and defective products from the source to secure your project production.

3. Fast Quotation & Order Processing

Our customer service team responds promptly to inquiries and quotation requests. All in-stock orders will be processed within one working day. We provide stocking reservation services for long-term cooperative customers, effectively solving problems such as component shortages and unstable supply chains.

4. Professional Technical Support

Our senior engineer team provides free technical consultation, model selection guidance and original manufacturer datasheets. We assist customers in solving problems related to product R&D, circuit design and component application, providing reliable technical support for project progress.

5. Sourcing for Special Components

Relying on our global supply chain network, we professionally source scarce components, obsolete parts and customized special components to efficiently solve your procurement difficulties.

6. Global Logistics & Document Services

We cooperate with mainstream international logistics providers including DHL, FedEx, UPS and TNT to achieve fast global delivery. We can provide complete export documents such as customs declaration files, commercial invoices and packing lists to ensure smooth customs clearance for international shipments. Local pickup is also available for customers in Shenzhen, China.

Professional Packaging Standards

Electronic components are sensitive to static electricity, collision, moisture and dust. We adopt industry-standard anti-static packaging solutions to fully ensure the integrity of goods during transportation and storage.

1. General Packaging Specifications

  • All components are packed separately to avoid damage caused by friction and collision;
  • Shockproof buffer materials are added for fragile products to ensure transportation safety;
  • Each package is clearly marked with part number, quantity, batch number and specifications for easy inventory counting and management.

2. Classified Professional Packaging

  • Anti-static Packaging: Static-sensitive components such as chips, circuit boards and sensors are packaged with anti-static bags, shielding boxes and conductive foam in strict accordance with international anti-static standards to prevent static damage.
  • Vacuum Moisture-proof Packaging: Moisture-sensitive components are vacuum-sealed with desiccants to isolate humid air, suitable for ocean transportation and long-term storage.
  • Original Factory Packaging: Integrated circuits of brands such as NXP are delivered with original reels, trays or tubes by default, retaining complete original packaging and adapting to automated SMT production lines.
  • Discrete Device Packaging: Discrete devices such as SMD resistors, power resistors and LEDs are quantitatively and classifiedly packaged with accurate quantity and clear marking.
  • Connector / Aviation Connector Packaging: Hard outer packaging is adopted to prevent pin bending and structural deformation.

3. Custom Packaging Services

We provide value-added services including personalized packaging, custom labeling and re-reeling according to customer requirements, fully matching your production and warehouse management standards.

Contact Information

For service consultation or packaging customization, please feel free to contact us:
Email: info@materialparts.com
Tel / WhatsApp: +86 13760382860
Address: Room 2919, Guoli Building, Huaqiang North, Futian District, Shenzhen, Guangdong, China
 

Online Inquiry Form

Support Excel, PDF, CSV format files for full BOM list quotation

Submit your component procurement and custom packaging needs via the form below. We will provide a detailed quotation and professional solution within 1–8 working hours.