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EP4CE30F23I7N

Cyclone IV E FPGA, 28848 LE, 594 Kbit RAM, 66 multipliers, 4 PLLs, 328 I/O, 484-FBGA

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Manufacturer Part：

EP4CE30F23I7N

Package：

484-FBGA (23 x 23 mm)

Description

Product Overview

The EP4CE30F23I7N is a Cyclone IV E series FPGA manufactured by Intel (formerly Altera), featuring 28,848 logic elements, 594 Kbit of embedded memory, 66 embedded 18×18 multipliers, and 4 PLLs. Housed in a 484-ball FBGA package (23 mm x 23 mm), it delivers cost-optimized programmable logic for mid-density applications in communications, industrial, and consumer electronics.

Key Specifications

Logic Elements	28,848
Embedded Memory	594 Kbit (66 M9K blocks)
Embedded Multipliers (18×18)	66
PLLs	4
Maximum User I/O	328
Core Voltage	1.15 V to 1.25 V
I/O Voltage Support	1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, 3.3 V
Package	484-FBGA (23 x 23 mm)
Operating Temperature	-40°C to +100°C (Industrial)
Speed Grade	I7
Configuration	SRAM-based (external flash required)

Features

Cost-optimized Cyclone IV E architecture with low static power consumption
66 M9K embedded memory blocks supporting dual-port RAM, ROM, and FIFO
66 embedded 18×18 hardware multipliers for DSP acceleration (FIR, FFT)
4 PLLs with clock multiplication, division, and phase shifting
Support for LVDS, RSDS, and differential SSTL I/O standards
On-chip termination (OCT) for signal integrity
Compatible with Intel Quartus Prime design software
Hot-socketing support and power-down mode

Applications

Protocol bridging and interface conversion in communication systems
Industrial control and automation logic acceleration
Automotive ADAS and infotainment signal processing
Medical imaging and diagnostic equipment
Test and measurement instruments (oscilloscopes, logic analyzers)
Consumer electronics multimedia processing

Product Introduction:EP4CE30F23I7N Product Introduction

The EP4CE30F23I7N is a member of the Intel Cyclone IV E FPGA family, delivering 28,848 logic elements with cost-optimized performance for mid-density applications. The device integrates 66 M9K embedded memory blocks (594 Kbit total), 66 embedded 18×18 hardware multipliers for DSP-intensive operations, and 4 phase-locked loops (PLLs) for flexible clock management. With up to 328 user I/O pins and support for multiple I/O voltage standards (1.2V to 3.3V), it offers versatile connectivity for diverse system designs. The SRAM-based configuration architecture enables in-system reprogramming, while the industrial temperature range (-40°C to +100°C) ensures reliable operation in harsh environments. Design support is provided through Intel Quartus Prime software, ModelSim simulation, and SignalTap II embedded logic analysis.

Working Principle:EP4CE30F23I7N Working Principle

The EP4CE30F23I7N operates on a SRAM-based FPGA architecture consisting of three primary subsystems: (1) Logic Array — The core fabric is organized into Logic Array Blocks (LABs), each containing 16 Logic Elements (LEs). Each LE includes a 4-input look-up table (LUT), a programmable register, and carry chain logic for efficient arithmetic implementation. (2) Embedded Memory — 66 M9K memory blocks provide dual-port SRAM that can be configured as RAM, ROM, FIFO buffers, or shift registers, each block offering 9,216 bits of storage with independent read and write ports. (3) Clock Network — A hierarchical clock structure with 4 PLLs distributes low-skew clock signals across the device. Each PLL supports clock multiplication, division, and programmable phase shifting. The device configures from external flash (EPCS/EPCQ) upon power-up, loading the SRAM configuration data to define the logic function.

Pin Description:EP4CE30F23I7N Pin Definition and Functions

Pin Group	Function	Voltage	Description
VCCINT	Core Power	1.2 V	Internal logic core supply voltage
VCCIO	I/O Bank Power	1.2-3.3 V	Per-bank I/O supply, 8 independent banks
GND	Ground	0 V	Common ground reference
I/O Pins	User I/O	VCCIO	Up to 328 general-purpose I/O with programmable standards
CLK	Dedicated Clock	VCCIO	Global clock input pins with low-skew distribution
CONF_DONE	Configuration Status	VCCIO	Indicates successful device configuration
nCONFIG	Configuration Control	VCCIO	Active-low reset for device reconfiguration
DCLK	Configuration Clock	VCCIO	Serial configuration clock input
DATA0	Configuration Data	VCCIO	Serial configuration data input
JTAG (TCK/TMS/TDI/TDO)	Debug/Programming	VCCIO	IEEE 1149.1 JTAG boundary scan interface

Application Scenarios:In which products and applications isEP4CE30F23I7N used

Protocol bridging and data path conversion in routers, switches, and base stations
Industrial automation: real-time logic control, motor drive feedback loops, sensor fusion
Automotive: ADAS signal preprocessing, infotainment display controllers, sensor module integration
Medical imaging: front-end signal filtering, data acquisition, and image processing pipelines
Test and measurement: high-speed data capture, pattern generation, and digital logic analysis

Alternative Models:What chips are recommended as replacements for EP4CE30F23I7N

Manufacturer	Part Number	Package	Notes
Intel/Altera	EP4CE40F23I7N	484-FBGA	Higher density, 39,600 LE, pin-compatible
Intel/Altera	EP4CE22F17I7N	256-FBGA	Lower density, 22,320 LE, smaller package
Xilinx	XC6SLX25-2FTG256C	256-BGA	Spartan-6, 24,051 LE, similar mid-range
Xilinx	XC7A35T-1CPG236C	236-BGA	Artix-7, 33,280 LE, newer architecture
Lattice	LFE3-35EA-6FN484C	484-BGA	ECP3, 33,000 LE, comparable density
Intel/Altera	10M30DAF484C6GES	484-BGA	MAX 10, 30,208 LE, non-volatile config