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10M08SCE144I7G

MAX 10 FPGA with 8000 LEs, 378Kbit RAM, 101 I/O, 144-EQFP, instant-on flash config

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Manufacturer Part：

10M08SCE144I7G

Package：

144-EQFP Exposed Pad (20 x 20 x 1.55mm)

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Description

Product Overview

The 10M08SCE144I7G from Intel is a MAX 10 FPGA featuring 8000 logic elements, 378 Kbits of embedded memory, and 101 I/O pins in a 144-EQFP (20x20mm) package. Built on 55nm TSMC embedded flash process, it offers instant-on configuration with integrated dual configuration flash memory and supports industrial temperature range.

Key Specifications

Logic Elements 8,000
LABs/CLBs 500
Total RAM Bits 387,072 (378 Kbits)
User Flash Memory Yes
Maximum I/O 101
Core Voltage 1.2V (1.15-1.25V)
I/O Supply Voltage 2.85V to 3.465V
Speed Grade -I7 (Industrial)
Operating Temperature -40 to 100 C (TJ)
Package 144-EQFP (20x20mm, Exposed Pad)

Features

  • 55nm TSMC embedded flash technology for instant-on configuration
  • Integrated dual configuration flash memory (configuration in less than 10ms)
  • On-chip ADC available in select variants
  • User flash memory (UFM) for non-volatile storage
  • Support for Nios II soft processor core

Applications

  • Industrial control and automation
  • Automotive infotainment systems
  • Communication protocol bridging
  • Video and image processing
  • Custom logic and glue logic replacement

The 10M08SCE144I7G is a member of Intel’s MAX 10 FPGA family, built on 55nm TSMC embedded flash technology. With 8000 logic elements, 378 Kbits of embedded M9K memory blocks, and up to 101 user I/O pins, it provides a cost-effective solution for designs requiring both programmable logic and non-volatile configuration storage. The integrated dual configuration flash memory enables instant-on operation with configuration times under 10ms, eliminating the need for external configuration devices. The industrial-grade -I7 speed grade supports operation from -40 to 100 C junction temperature.

The 10M08SCE144I7G operates as a flash-based FPGA combining programmable logic with non-volatile configuration storage. **Configuration Subsystem**: Unlike SRAM-based FPGAs that require external configuration devices, MAX 10 stores its configuration bitstream in on-chip flash memory. The dual-flash architecture allows background programming of one flash sector while the device operates from the other, enabling live updates. Configuration completes in under 10ms after power-up. **Logic Subsystem**: 500 Logic Array Blocks (LABs) each contain 10 Logic Elements (LEs) with 4-input look-up tables (LUTs), carry chains, and register packing. LABs are interconnected through a multi-level routing hierarchy. **Memory Subsystem**: M9K embedded memory blocks support single-port, dual-port, ROM, and FIFO configurations. User Flash Memory (UFM) provides non-volatile storage for calibration data, serial numbers, or user parameters. **I/O Subsystem**: Programmable I/O elements support multiple I/O standards including 3.3V, 2.5V, and 1.8V LVCMOS/LVTTL.

Pin Group Name Description
Power VCCINT 1.2V core supply
Power VCCIO1-8 I/O bank supply (2.85-3.465V)
Power VCCA Analog supply for PLL/ADC
Ground GND Ground reference
Config TMS/TCK/TDI/TDO JTAG configuration interface
Config nCONFIG/nSTATUS/CONF_DONE Configuration control pins
Clock CLK0-CLK3 Dedicated global clock inputs
I/O IO_0 to IO_100 101 general-purpose I/O pins
Thermal Exposed Pad Thermal pad, connect to GND
  • Industrial Control: Custom protocol bridging between legacy interfaces and modern communication standards
  • Automotive: Infotainment system logic integration with instant-on capability for fast boot requirements
  • Communication: Multi-protocol bridging between I2C, SPI, UART, and parallel interfaces
  • Video Processing: Low-resolution video scaling and format conversion with integrated memory buffers
  • Glue Logic: Replacement of discrete CPLDs and custom ASICs with reprogrammable flash-based logic
Model Manufacturer Key Difference
10M08SAE144C8G Intel Commercial grade, -C8 speed, non-ADC version
EPM2210F324I5N Intel MAX II CPLD, 2210 LEs, flash-based
ICE40HX1K-VQ100 Lattice iCE40, 1280 LEs, SPI flash config
ECP5-12E5TN144I Lattice ECP5, 12K LUTs, DDR3 support
XC6SLX9-2TQG144I Xilinx Spartan-6, 9152 logic cells, SRAM-based
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Quality Assurance

Quality is the core foundation of our long-term global cooperation. With over 20 years of experience in the electronic component industry, Materialparts has built a strict and standardized quality management system covering component sourcing, incoming inspection, full-batch testing, packaging and delivery. We are committed to delivering 100% genuine, high-reliability electronic components for industrial control, automotive electronics, consumer electronics and medical device industries, and fully safeguarding your production and R&D projects.

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Tel / WhatsApp: +86 13760382860
Address: Room 2919, Guoli Building, Huaqiang North, Futian District, Shenzhen, Guangdong, China

 

Shipping & Payment

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  • Address: Room 2919, Guoli Building, Huaqiang North, Futian District, Shenzhen, Guangdong Province, China
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Contact Information

Email: info@materialparts.com

Tel / WhatsApp: +86 13760382860

Service & Packaging

Materialparts is a professional electronic component supplier based in Shenzhen, China, with over 20 years of global trading experience. We integrate component procurement, quality inspection, technical support, customized packaging, and global delivery services to provide one-stop supply chain solutions. Our business covers industrial control, automotive electronics, consumer electronics, medical devices and other industries. We always adhere to genuine sources, stable supply and considerate after-sales service.

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2. Genuine Product Guarantee & Full-process Quality Inspection

All products are sourced from official authorized channels and are 100% original genuine parts. Every batch of goods undergoes strict full-process quality inspection before delivery, with complete batch records and traceability documents provided. Our products comply with AEC-Q standards for automotive electronics and high-reliability specifications for medical devices. We eliminate counterfeits, refurbished parts and defective products from the source to secure your project production.

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Professional Packaging Standards

Electronic components are sensitive to static electricity, collision, moisture and dust. We adopt industry-standard anti-static packaging solutions to fully ensure the integrity of goods during transportation and storage.

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  • Connector / Aviation Connector Packaging: Hard outer packaging is adopted to prevent pin bending and structural deformation.

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We provide value-added services including personalized packaging, custom labeling and re-reeling according to customer requirements, fully matching your production and warehouse management standards.

Contact Information

For service consultation or packaging customization, please feel free to contact us:
Email: info@materialparts.com
Tel / WhatsApp: +86 13760382860
Address: Room 2919, Guoli Building, Huaqiang North, Futian District, Shenzhen, Guangdong, China
 

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