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MT60B1G16HC-52B:G

美光 16Gb DDR5 SDRAM 内存芯片

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制造商零件：

MT60B1G16HC-52B:G

包装：

FBGA

说明

MT60B1G16HC-52B:G is a high-speed 16Gb (2GB) DDR5 SDRAM component from Micron, configured as ×16 bit width, operating at 5200 MT/s (DDR5-5200). Designed for high-performance computing, it features advanced signal integrity, on-chip reliability, and low-power operation, ideal for UDIMM, SODIMM, RDIMM, and server memory modules.

制造商: Micron Technology
部件编号: MT60B1G16HC-52B:G
Density: 16Gb (1G × 16)
Memory Type: DDR5 SDRAM
Speed Grade: DDR5-5200 (5200 MT/s)
CAS Latency: CL-52
包装: 102-ball VFBGA (7.5 × 14.0 × 1.0 mm)
Voltage: VDD/VDDQ = 1.1V; VPP = 1.8V
Operating Temp: 0°C to +95°C
Revision: Die Rev G

16n-bit prefetch architecture for high bandwidth
16 internal banks (4 groups × 4 banks) for parallel access
On-chip ECC (Error Correction Code) with error scrubbing
DFE (Decision Feedback Equalization) & ODT (On-Die Termination)
Write CRC, Data Mask (DM), CA training, DQ VREF training
Auto-refresh: 32ms (≤85°C) / 16ms (85–95°C)
Multi-Purpose Command (MPC), Power Down, MPSM (Multi-Port Sleep Mode)
RoHS Compliant, Green Package

Desktop / Laptop / Workstation Memory (UDIMM/SODIMM)
Server & Cloud Computing Platforms
High-Performance Embedded Systems
Networking & Accelerator Cards

产品介绍：MT60B1G16HC-52B:G 产品介绍

MT60B1G16HC-52B:G is a 1Gb×16 DDR5 SDRAM memory chip from Micron, with a data rate up to 5200MT/s. It adopts 1.1V low-voltage design, integrates on-die ECC, ODT and high-speed signal training functions, featuring high stability, low power consumption and large bandwidth. The device is packaged in FBGA, suitable for industrial control, embedded equipment, IoT terminals, consumer electronics and other high-performance memory application scenarios.

工作原理：MT60B1G16HC-52B:G 工作原理

工作原理（200 字以内）

引脚说明：MT60B1G16HC-52B:G 引脚定义和功能

MT60B1G16HC-52B:G is a 102-ball FBGA packaged DDR5 SDRAM. Pins are grouped into power, clock, command/address, data, control, and test categories, with key definitions and functions as below.

1. Power Pins

引脚名称	功能
VDD	Core power (1.1V, nominal)
VDDQ	I/O power (1.1V, nominal)
VPP	Activation power (1.8V, nominal)
VSS	Ground (core)
VSSQ	Ground (I/O)

2. Clock Pins

引脚名称	功能
CK_t / CK_c	Differential clock (true/complement); synchronizes all operations

3. Command/Address (CA) Pins

引脚名称	功能
CA0–CA13	Command/address inputs; carry addresses, commands, and bank/BA signals
CS_n	Chip select (active LOW); enables/disables the device
CA_ODT	ODT control input; configures on-die termination

4. Data Pins

引脚名称	功能
DQ0–DQ15	16-bit data I/O; transmits/receives data
DQS_t / DQS_c	Differential data strobe (true/complement); aligns data sampling
DM_n / TDQS	Data mask (write) / TDQS (read); masks invalid data

5. Control & Status Pins

引脚名称	功能
RESET_n	Reset (active LOW); initializes the device
ALERT_n	Alert (active LOW); indicates errors (e.g., ECC)
ZQ	Calibration pin; for ODT and driver strength calibration
MIR	Mirror pin; configures address mirroring

6. Test & Reserved Pins

引脚名称	功能
TEN	Test enable; enters test mode
DNU	Do not use; leave unconnected

主要说明

Differential Signaling: CK/CK_c and DQS/DQS_c use differential pairs for noise immunity at 5200MT/s.
On-die Termination (ODT): Controlled via CA_ODT and ZQ calibration to optimize signal integrity.
16-bit Interface: DQ0–DQ15 enable high-bandwidth data transfer for DDR5-5200.

Application Scenarios:In which products and applications isMT60B1G16HC-52B:G 中古

This MT60B1G16HC-52B:G is a Micron DDR5 1G×16 high-speed SDRAM memory chip with 5200MT/s bandwidth, low power consumption and industrial-grade stability. It is widely adopted in the following product and application fields:

Embedded Industrial Control Equipment

Industrial motherboards, industrial touch screens, PLC control systems, industrial gateway and edge computing terminals.
Consumer Electronic Products

Smart TV, high-end set-top boxes, smart home central control hosts, and multimedia playback devices.
Network Communication Devices

5G small base stations, routers, optical modems, network switches and communication transmission equipment.
AIoT & Artificial Intelligence Hardware

Edge AI computing boxes, intelligent recognition terminals, vision analysis equipment and IoT intelligent terminals.
Automotive & Smart Cockpit

Vehicle central control screen, car navigation, smart cockpit host and on-board multimedia system (supporting wide temperature stable operation).
Medical & Precision Instrumentation

Medical diagnostic equipment, laboratory analytical instruments and high-precision testing instruments that require high stability and high bandwidth memory.

Alternative Models:What chips are recommended as replacements for MT60B1G16HC-52B:G

Below are pin-to-pin compatible, performance-matched, and upgraded alternatives for the Micron MT60B1G16HC-52B:G (16Gb, 1G×16, DDR5-5200, 102-ball FBGA) suitable as drop-in replacements or upgrades.

1. Micron Direct Replacements (Same Form/Fit/Function)

部件编号	Key Specs	兼容性	Remarks
MT60B1G16HC-52B:H	16Gb, 1G×16, DDR5-5200, 102-ball FBGA, Die Rev H	Full pin-to-pin	Updated die revision, better stability, production statusMicron Technology
MT60B1G16HC-56B:G	16Gb, 1G×16, DDR5-5600 (faster), 102-ball FBGA	Pin-compatible	Higher speed grade, same package, easy upgrade
MT60B1G16HD-64B:H	16Gb, 1G×16, DDR5-6400, 102-ball FBGA	Pin-compatible	Top-speed Micron alternative, JEDEC-compliant

2. Micron Equivalent Density (Different Width, Same Capacity)

部件编号	Key Specs	Use Case
MT60B2G8HB-52B:G	16Gb, 2G×8, DDR5-5200, 82-ball FBGA	Same density, ×8 width, smaller package (for board redesign)美光科技

3. Cross-Brand Compatible Alternatives (DDR5-5200, 1G×16, 102-ball FBGA)

品牌	部件编号	Key Specs	兼容性
三星	K4L1G165ZM-HC52	16Gb, 1G×16, DDR5-5200, 102-ball FBGA	JEDEC-compliant, pin-compatible
SK Hynix	H5AN1G6NCJ-VKC	16Gb, 1G×16, DDR5-5200, 102-ball FBGA	Industrial-grade, low power, compatible

4. Key Selection Notes

Drop-in Swap: Prefer MT60B1G16HC-52B:H (same speed, updated die) for zero redesignMicron Technology.
性能升级: Choose MT60B1G16HC-56B:G (DDR5-5600) for higher bandwidth without layout changes.
Cross-Brand: Samsung/SK Hynix parts offer equivalent specs and are JEDEC-compliant for broad compatibility.

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MT60B1G16HC-52B:G

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包装：

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说明

1. Power Pins

2. Clock Pins

3. Command/Address (CA) Pins

4. Data Pins

5. Control & Status Pins

6. Test & Reserved Pins

主要说明

1. Micron Direct Replacements (Same Form/Fit/Function)

2. Micron Equivalent Density (Different Width, Same Capacity)

3. Cross-Brand Compatible Alternatives (DDR5-5200, 1G×16, 102-ball FBGA)

4. Key Selection Notes

推荐部件

有效库存

制造商零件：

包装：

品牌：

产品类别：

您可能感兴趣的其他建议.

说明

1. Power Pins

2. Clock Pins

3. Command/Address (CA) Pins

4. Data Pins

5. Control & Status Pins

6. Test & Reserved Pins

主要说明

1. Micron Direct Replacements (Same Form/Fit/Function)

2. Micron Equivalent Density (Different Width, Same Capacity)

3. Cross-Brand Compatible Alternatives (DDR5-5200, 1G×16, 102-ball FBGA)

4. Key Selection Notes

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