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MT60B1G16HC-52B:G


Micron 16Gb DDR5 SDRAM memory chip

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MT60B1G16HC-52B:G

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FBGA

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Description

MT60B1G16HC-52B:G is a high-speed 16Gb (2GB) DDR5 SDRAM component from Micron, configured as ×16 bit width, operating at 5200 MT/s (DDR5-5200). Designed for high-performance computing, it features advanced signal integrity, on-chip reliability, and low-power operation, ideal for UDIMM, SODIMM, RDIMM, and server memory modules.

  • Manufacturer: Micron Technology
  • Part Number: MT60B1G16HC-52B:G
  • Density: 16Gb (1G × 16)
  • Memory Type: DDR5 SDRAM
  • Speed Grade: DDR5-5200 (5200 MT/s)
  • CAS Latency: CL-52
  • Package: 102-ball VFBGA (7.5 × 14.0 × 1.0 mm)
  • Voltage: VDD/VDDQ = 1.1V; VPP = 1.8V
  • Operating Temp: 0°C to +95°C
  • Revision: Die Rev G

  • 16n-bit prefetch architecture for high bandwidth
  • 16 internal banks (4 groups × 4 banks) for parallel access
  • On-chip ECC (Error Correction Code) with error scrubbing
  • DFE (Decision Feedback Equalization) & ODT (On-Die Termination)
  • Write CRC, Data Mask (DM), CA training, DQ VREF training
  • Auto-refresh: 32ms (≤85°C) / 16ms (85–95°C)
  • Multi-Purpose Command (MPC), Power Down, MPSM (Multi-Port Sleep Mode)
  • RoHS Compliant, Green Package

  • Desktop / Laptop / Workstation Memory (UDIMM/SODIMM)
  • Server & Cloud Computing Platforms
  • High-Performance Embedded Systems
  • Networking & Accelerator Cards

MT60B1G16HC-52B:G is a 1Gb×16 DDR5 SDRAM memory chip from Micron, with a data rate up to 5200MT/s. It adopts 1.1V low-voltage design, integrates on-die ECC, ODT and high-speed signal training functions, featuring high stability, low power consumption and large bandwidth. The device is packaged in FBGA, suitable for industrial control, embedded equipment, IoT terminals, consumer electronics and other high-performance memory application scenarios.

Working Principle(Within 200 Words)

MT60B1G16HC-52B:G is a 102-ball FBGA packaged DDR5 SDRAM. Pins are grouped into power, clock, command/address, data, control, and test categories, with key definitions and functions as below.

1. Power Pins

Pin Name Function
VDD Core power (1.1V, nominal)
VDDQ I/O power (1.1V, nominal)
VPP Activation power (1.8V, nominal)
VSS Ground (core)
VSSQ Ground (I/O)

2. Clock Pins

Pin Name Function
CK_t / CK_c Differential clock (true/complement); synchronizes all operations

3. Command/Address (CA) Pins

Pin Name Function
CA0–CA13 Command/address inputs; carry addresses, commands, and bank/BA signals
CS_n Chip select (active LOW); enables/disables the device
CA_ODT ODT control input; configures on-die termination

4. Data Pins

Pin Name Function
DQ0–DQ15 16-bit data I/O; transmits/receives data
DQS_t / DQS_c Differential data strobe (true/complement); aligns data sampling
DM_n / TDQS Data mask (write) / TDQS (read); masks invalid data

5. Control & Status Pins

Pin Name Function
RESET_n Reset (active LOW); initializes the device
ALERT_n Alert (active LOW); indicates errors (e.g., ECC)
ZQ Calibration pin; for ODT and driver strength calibration
MIR Mirror pin; configures address mirroring

6. Test & Reserved Pins

Pin Name Function
TEN Test enable; enters test mode
DNU Do not use; leave unconnected

Key Notes

  • Differential Signaling: CK/CK_c and DQS/DQS_c use differential pairs for noise immunity at 5200MT/s.
  • On-die Termination (ODT): Controlled via CA_ODT and ZQ calibration to optimize signal integrity.
  • 16-bit Interface: DQ0–DQ15 enable high-bandwidth data transfer for DDR5-5200.
This MT60B1G16HC-52B:G is a Micron DDR5 1G×16 high-speed SDRAM memory chip with 5200MT/s bandwidth, low power consumption and industrial-grade stability. It is widely adopted in the following product and application fields:
  1. Embedded Industrial Control Equipment

    Industrial motherboards, industrial touch screens, PLC control systems, industrial gateway and edge computing terminals.

  2. Consumer Electronic Products

    Smart TV, high-end set-top boxes, smart home central control hosts, and multimedia playback devices.

  3. Network Communication Devices

    5G small base stations, routers, optical modems, network switches and communication transmission equipment.

  4. AIoT & Artificial Intelligence Hardware

    Edge AI computing boxes, intelligent recognition terminals, vision analysis equipment and IoT intelligent terminals.

  5. Automotive & Smart Cockpit

    Vehicle central control screen, car navigation, smart cockpit host and on-board multimedia system (supporting wide temperature stable operation).

  6. Medical & Precision Instrumentation

    Medical diagnostic equipment, laboratory analytical instruments and high-precision testing instruments that require high stability and high bandwidth memory.

Below are pin-to-pin compatible, performance-matched, and upgraded alternatives for the Micron MT60B1G16HC-52B:G (16Gb, 1G×16, DDR5-5200, 102-ball FBGA) suitable as drop-in replacements or upgrades.

1. Micron Direct Replacements (Same Form/Fit/Function)

Part Number Key Specs Compatibility Remarks
MT60B1G16HC-52B:H 16Gb, 1G×16, DDR5-5200, 102-ball FBGA, Die Rev H Full pin-to-pin Updated die revision, better stability, production statusMicron Technology
MT60B1G16HC-56B:G 16Gb, 1G×16, DDR5-5600 (faster), 102-ball FBGA Pin-compatible Higher speed grade, same package, easy upgrade
MT60B1G16HD-64B:H 16Gb, 1G×16, DDR5-6400, 102-ball FBGA Pin-compatible Top-speed Micron alternative, JEDEC-compliant

2. Micron Equivalent Density (Different Width, Same Capacity)

Part Number Key Specs Use Case
MT60B2G8HB-52B:G 16Gb, 2G×8, DDR5-5200, 82-ball FBGA Same density, ×8 width, smaller package (for board redesign)美光科技

3. Cross-Brand Compatible Alternatives (DDR5-5200, 1G×16, 102-ball FBGA)

Brand Part Number Key Specs Compatibility
Samsung K4L1G165ZM-HC52 16Gb, 1G×16, DDR5-5200, 102-ball FBGA JEDEC-compliant, pin-compatible
SK Hynix H5AN1G6NCJ-VKC 16Gb, 1G×16, DDR5-5200, 102-ball FBGA Industrial-grade, low power, compatible

4. Key Selection Notes

  • Drop-in Swap: Prefer MT60B1G16HC-52B:H (same speed, updated die) for zero redesignMicron Technology.
  • Performance Upgrade: Choose MT60B1G16HC-56B:G (DDR5-5600) for higher bandwidth without layout changes.
  • Cross-Brand: Samsung/SK Hynix parts offer equivalent specs and are JEDEC-compliant for broad compatibility.
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Certification
We have obtained a number of professional certifications and built our own professional testing laboratory.This ensures that every product we deliver to our customers meets the highest quality requirements.We conduct tests in strict accordance with procedures to ensure stable product quality and accurate parameters.To guarantee genuine original parts, we also cooperate with reliable third-party testing institutions for strict quality inspection.We always attach great importance to quality and fully comply with industry standards, relevant regulations, and ISO 9001:2015 requirements.

Service & Packaging

All electronic components we source from our partnered supply chains go through strict incoming inspections.Through careful testing, we ensure everything delivered to customers is genuine original parts and meets quality requirements.In addition, we keep complete inspection records to make the entire supply chain process clear and traceable.

Certification
We have obtained a number of professional certifications and built our own professional testing laboratory.This ensures that every product we deliver to our customers meets the highest quality requirements.We conduct tests in strict accordance with procedures to ensure stable product quality and accurate parameters.To guarantee genuine original parts, we also cooperate with reliable third-party testing institutions for strict quality inspection.We always attach great importance to quality and fully comply with industry standards, relevant regulations, and ISO 9001:2015 requirements.