产品概览
The ESP32-PICO-V3 from Espressif Systems is a System-in-Package (SiP) that integrates a 240MHz dual-core Xtensa LX6 MCU with 4MB SPI Flash, 520KB SRAM, 2.4GHz Wi-Fi 802.11 b/g/n, and Bluetooth 5.0 LE into a single 7x7mm QFN package. All passive components including the crystal oscillator are integrated, simplifying PCB design to minimal external components.
主要规格
- Type: System-in-Package (SiP) with Wi-Fi and Bluetooth
- Manufacturer: Espressif Systems
- CPU: 240MHz dual-core Xtensa LX6 MCU
- Flash: 4MB SPI Flash (embedded in package)
- SRAM: 520KB
- Wi-Fi: 802.11 b/g/n, 2.4GHz, up to 150Mbps
- Bluetooth: 5.0 LE, Bluetooth mesh
- GPIO: 34 pins
- ADC: 12-bit, up to 18 channels
- DAC: 2x 8-bit
- Touch Sensors: 10
- Temperature Sensor: 1
- Interfaces: 4xSPI, 2xI2C, 2xI2S, 3xUART
- Other: PWM, SD/SDIO, TWAI, IR
- Package: 7x7mm QFN (0.4mm pitch), 49 pins
- Operating Voltage: 3.0V to 3.6V
- Operating Temp: -40C to +85C
- Deep Sleep: ~10uA
- RoHS: Compliant
特点
- Complete Wi-Fi+BT SiP in tiny 7x7mm QFN package
- 4MB integrated SPI Flash eliminates external Flash
- Integrated crystal oscillator and all passives
- 240MHz dual-core for demanding IoT applications
- Bluetooth 5.0 LE with mesh networking support
- Ultra-low 10uA deep sleep current for battery operation
- 34 GPIO with rich peripheral set
应用
- IoT gateways and smart home hubs
- Wearable devices and health monitors
- Industrial wireless sensor networks
- Smart lighting and building automation
- Portable battery-powered IoT devices
- Voice-enabled AI edge devices