W25Q256FVFIG


256Mbit SPI NOR Flash, Quad SPI 104MHz, 50MB/s, 4KB sector, 3/4-byte addr, SOIC-16, -40~85°C, OBSOLETE

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Manufacturer Part:

W25Q256FVFIG

Package:

SOIC-16 (300-mil, 10.3 x 7.5 x 2.35 mm, 1.27mm pitch)

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Description

The W25Q256FVFIG from Winbond is a 256-Mbit (32-MByte) SPI NOR Flash memory in a 16-pin SOIC-300 package. It supports standard SPI, Dual SPI, and Quad SPI interfaces with clock frequencies up to 104 MHz, achieving equivalent rates of 208 MHz (Dual I/O) and 416 MHz (Quad I/O) for 50-MB/s continuous data transfer. The device operates from 2.7 V to 3.6 V with 4-mA active current and less than 1-µA power-down current. Memory is organized as 131,072 pages of 256 bytes with 4-KB sector, 32-KB/64-KB block, and chip erase options. Features include 3/4-byte addressing, QPI mode, suspend/resume, security registers with OTP lock, 64-bit unique ID, and SFDP. Note: this FV generation is discontinued; the JV series is the recommended replacement.

The W25Q256FVFIG is a 256-Mbit (32-MByte) serial NOR Flash memory from Winbond’s SpiFlash family, housed in a 16-pin SOIC-300 package with an additional /RESET pin. It provides high-density non-volatile storage for code shadowing, execute-in-place (XIP), and data logging applications.

The device supports four SPI modes: standard SPI (1-bit serial), Dual Output SPI, Dual I/O SPI, and Quad I/O SPI. At 104 MHz clock, Quad I/O achieves an effective 416 MHz data rate (50 MB/s), outperforming many parallel Flash memories while using only 6 pins. The QPI (Quad Peripheral Interface) mode enables all four data pins for both command and address phases, reducing instruction overhead to just 8 clock cycles for true XIP operation.

The 256-Mbit density requires 3-byte or 4-byte addressing. The device supports both modes for backward compatibility (3-byte) and full address space access (4-byte). The 16-pin SOIC package provides a dedicated /RESET pin (pin 9) that is not available on 8-pin packages, enabling hardware reset without SPI commands.

Memory organization includes 131,072 programmable pages of 256 bytes, 8,192 erasable 4-KB sectors, and 512 erasable 64-KB blocks. The 4-KB sector size supports fine-grained data management. Erase/program suspend and resume allows interrupting a long erase operation to read or program a different area, reducing system latency.

Security features include software/hardware write protection, power-supply lock-down, individual sector/block protection, three 256-byte security registers with OTP locks, a 64-bit unique serial number, and an SFDP (Serial Flash Discoverable Parameters) register for auto-detection.

The W25Q256FVFIG is part of the FV generation which is now discontinued. Winbond recommends migrating to the W25Q256JV series (JVFIQ or JVFIM suffixes), which offers the same functionality with improved performance and continued production support.

**SPI Interface:** The W25Q256FV uses a standard SPI interface with /CS (chip select), CLK (serial clock), DI/IO0 (data in), DO/IO1 (data out), /WP/IO2, and /HOLD/IO3 pins. In standard SPI mode, DI carries command/address/data and DO returns data. In Quad SPI mode, all four I/O pins carry address and data in parallel, quadrupling throughput. QPI mode extends quad operation to the command phase as well.

**3/4-Byte Addressing:** The 256-Mbit density exceeds the 128-Mbit boundary of 24-bit (3-byte) addressing. The device defaults to 3-byte addressing for compatibility and can switch to 4-byte addressing via the Enter 4-Byte Address Mode instruction. In 3-byte mode, only the lower 128 Mbit is accessible. In 4-byte mode, all 256 Mbit is accessible with a 32-bit address.

**Page Program and Erase:** Programming loads up to 256 bytes into an internal buffer, then writes the entire page in approximately 3 ms (typical). Sectors (4 KB) erase in approximately 400 ms, blocks (32/64 KB) in 800 ms/2 s, and the entire chip in approximately 200 s. The suspend/resume feature allows reading from non-suspended areas during long erase operations.

**Status and Protection:** Two status registers (SR1, SR2) control write protection, quad enable, and address mode. Block protect bits in SR1 define protected address ranges. The SR2 Quad Enable bit must be set before using Quad SPI instructions. Write protection can be enhanced with the /WP pin (active low) which locks the status register when asserted.

Pin Name Type Description
1 /CS I Chip select (active low); must be driven high between commands; internal pull-up; going high terminates partial commands
2 DO/IO1 I/O Data output in standard SPI; I/O1 in Dual/Quad SPI; serial data out during read operations
3 /WP/IO2 I/O Write protect (active low) in standard SPI; I/O2 in Quad SPI; when SR2 bit 1=0, /WP low locks status register bits
4 GND G Ground
5 DI/IO0 I/O Data input in standard SPI; I/O0 in Dual/Quad SPI; serial command/address/data input
6 CLK I Serial clock; all shifts and sampling occur on CLK edges; polarity and phase per SPI mode 0 or 3
7 /HOLD/IO3 I/O Hold (active low) pauses serial communication without deselecting; I/O3 in Quad SPI; allows sharing SPI bus with other devices
8 VCC P Supply voltage 2.7-3.6V; bypass with 0.1µF ceramic to GND close to pin
9 /RESET I Hardware reset (active low); resets internal state machine and volatile registers; does not affect non-volatile data; unique to SOIC-16 package
10 GND G Ground (additional); connect to PCB ground plane
11-16 NC No connect; leave floating or tie to GND; no internal connection
Application Description
Embedded System XIP Boot Flash Store MCU/SoC firmware for execute-in-place boot; Quad I/O at 104MHz provides 50MB/s read throughput; QPI mode minimizes instruction overhead; /RESET pin enables hardware watchdog reset; 4KB sectors support OTA firmware updates with A/B partitioning
Data Logging Storage Log sensor data in 32MB non-volatile array; 4KB sector erase supports circular buffer with fine granularity; suspend/resume allows read-back during active logging; 100K erase cycles provide years of operation with wear leveling
FPGA Configuration Flash Store FPGA bitstream for master SPI configuration; 256Mbit supports large FPGAs; Quad SPI reduces configuration time; /RESET synchronizes with FPGA INIT pin; SOIC-16 footprint compatible with standard PCB assembly
Model Manufacturer Compatibility Key Difference
W25Q256JVFIQ Winbond Pin-Compatible Direct Sub JV generation (current production); same SOIC-16 pinout; same 256Mbit density; improved erase performance; recommended migration path from FV
W25Q256JVFIM Winbond Pin-Compatible Direct Sub JV generation in WSON-8x6mm package; smaller footprint; no /RESET pin; same SPI/QSPI interface; use for space-constrained designs
MX25L25635FMI-10G Macronix Pin-Compatible Alternative 256Mbit SPI NOR Flash; SOIC-16; 104MHz; similar feature set; Macronix second source; use for supply chain diversification
S25FL256LAGMFI01 Infineon Functional Equivalent 256Mbit SPI NOR; SOIC-16; 108MHz; different sector architecture (uniform 256KB); use when Infineon preferred vendor
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Certification
We have obtained a number of professional certifications and built our own professional testing laboratory.This ensures that every product we deliver to our customers meets the highest quality requirements.We conduct tests in strict accordance with procedures to ensure stable product quality and accurate parameters.To guarantee genuine original parts, we also cooperate with reliable third-party testing institutions for strict quality inspection.We always attach great importance to quality and fully comply with industry standards, relevant regulations, and ISO 9001:2015 requirements.

Shipping & Payment

All electronic components we source from our partnered supply chains go through strict incoming inspections.Through careful testing, we ensure everything delivered to customers is genuine original parts and meets quality requirements.In addition, we keep complete inspection records to make the entire supply chain process clear and traceable.

Certification
We have obtained a number of professional certifications and built our own professional testing laboratory.This ensures that every product we deliver to our customers meets the highest quality requirements.We conduct tests in strict accordance with procedures to ensure stable product quality and accurate parameters.To guarantee genuine original parts, we also cooperate with reliable third-party testing institutions for strict quality inspection.We always attach great importance to quality and fully comply with industry standards, relevant regulations, and ISO 9001:2015 requirements.

Service & Packaging

All electronic components we source from our partnered supply chains go through strict incoming inspections.Through careful testing, we ensure everything delivered to customers is genuine original parts and meets quality requirements.In addition, we keep complete inspection records to make the entire supply chain process clear and traceable.

Certification
We have obtained a number of professional certifications and built our own professional testing laboratory.This ensures that every product we deliver to our customers meets the highest quality requirements.We conduct tests in strict accordance with procedures to ensure stable product quality and accurate parameters.To guarantee genuine original parts, we also cooperate with reliable third-party testing institutions for strict quality inspection.We always attach great importance to quality and fully comply with industry standards, relevant regulations, and ISO 9001:2015 requirements.