FAN7392N


600V high/low-side gate driver, 3A/3A, 3.3V logic, UVLO, shutdown, PDIP-14, Last Shipments

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Manufacturer Part:

FAN7392N

Package:

PDIP-14 (19.3 x 6.35 x 4.57 mm, 2.54mm pitch, through-hole)

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Description

The FAN7392N from onsemi (formerly Fairchild) is a monolithic high- and low-side gate drive IC in a 14-pin PDIP package capable of driving MOSFETs and IGBTs operating up to +600V. It features 3A/3A source/sink output current, 3.3V logic-compatible inputs, separate VDD logic supply (3.3V to 20V), under-voltage lockout for VCC and VBS, cycle-by-cycle edge-triggered shutdown, matched propagation delay for both channels, and common-mode dv/dt noise cancellation. Power dissipation 1.6W. Operating temperature -40C to +125C. Note: This product is in Last Shipments status.

The FAN7392N from onsemi (formerly Fairchild Semiconductor) is a monolithic high- and low-side gate drive IC in a 14-pin PDIP through-hole package. It can drive MOSFETs and IGBTs that operate up to +600V, making it suitable for half-bridge and full-bridge inverter applications. Note: This product is in Last Shipments status at onsemi, meaning it is approaching end-of-life and should not be designed into new products.

The FAN7392 provides independent high-side and low-side gate drive outputs (HO and LO), each capable of 3A source and 3A sink current. The buffered output stage uses all-NMOS transistors for high pulse current driving capability and minimum cross-conduction during switching transitions.

The high-side driver uses a bootstrap floating supply (VB-VS) that allows operation up to +600V. onsemi’s high-voltage process and common-mode noise canceling techniques provide stable operation under high dv/dt noise circumstances. The advanced level-shift circuit offers high-side gate driver operation down to VS = -9.8V (typical) for VBS = 15V, critical for motor drive applications where negative VS transients occur.

Logic inputs (HIN, LIN, SD) are compatible with standard CMOS or LSTTL output, down to 3.3V logic. A separate VDD logic supply pin (3.3V to 20V) allows direct interfacing with 3.3V microcontrollers without level translation. The SD (shutdown) pin provides cycle-by-cycle edge-triggered shutdown for both channels, useful for overcurrent protection.

The under-voltage lockout (UVLO) circuit prevents malfunction when VCC (low-side supply) and VBS (high-side supply) are below the specified threshold voltage, ensuring the MOSFETs/IGBTs are not driven into linear operation during power-up.

The propagation delay is matched for both channels (130 ns turn-on, 150 ns turn-off typical), enabling precise complementary switching in bridge configurations. The outputs are in-phase with the input signals (HIN=HIGH produces HO=HIGH).

The PDIP-14 package provides 1.6W power dissipation at 25C ambient with 75C/W thermal resistance. For surface-mount applications, the FAN7392MX (SOIC-16W) variant is also available but also in Last Shipments status.

For new designs, onsemi recommends the FAN7390 or NCP51530 as replacement devices.

**Bootstrap High-Side Drive:** The high-side driver is powered by a bootstrap capacitor connected between VB and VS. When the low-side MOSFET is on, VS is near ground, and the bootstrap capacitor charges through the bootstrap diode from VCC. When the high-side MOSFET turns on, VS rises to the bus voltage, and the bootstrap capacitor provides the floating supply for the high-side driver. This eliminates the need for an isolated power supply.

**Level Shifting:** The high-side driver is referenced to VS (the switch node), which swings between ground and the bus voltage at high dv/dt. The level-shift circuit translates the ground-referenced logic signals to the floating high-side domain. The common-mode dv/dt noise cancellation circuit prevents false triggering during these fast transitions.

**Cycle-by-Cycle Shutdown:** The SD (shutdown) pin provides an edge-triggered shutdown function. When a rising edge is detected on SD, both HO and LO are forced LOW for the remainder of the switching cycle. The outputs resume normal operation on the next HIN/LIN transition. This provides fast overcurrent protection without latching off the driver.

**UVLO Protection:** Both VCC and VBS are monitored by under-voltage lockout circuits. If VCC drops below the UVLO threshold (approximately 9.2V typical), the low-side output is disabled. If VBS drops below its UVLO threshold (approximately 8.6V typical), the high-side output is disabled. This prevents the MOSFETs from being driven with insufficient gate voltage, which would cause excessive conduction losses and potential device failure.

Pin Name Type Description
1 LO O Low-side gate drive output; connects to low-side MOSFET/IGBT gate; 3A source/3A sink; in-phase with LIN; driven from VCC supply
2 COM G Low-side return; connects to MOSFET source (ground); star-point ground for driver; separate from logic ground
3 VCC P Low-side supply; 10-20V; powers low-side driver and logic; decouple with 0.1uF + 1uF ceramic to COM; bootstrap diode anode connects here
5 VS I/O High-side floating supply return; connects to half-bridge switch node (junction of high-side source and low-side drain); swings 0 to bus voltage; must handle high dv/dt
6 VB P High-side floating supply; bootstrap capacitor positive terminal; connect bootstrap diode cathode and capacitor here; VBS = VB-VS = 10-20V
7 HO O High-side gate drive output; connects to high-side MOSFET/IGBT gate; 3A source/3A sink; in-phase with HIN; driven from bootstrap supply
9 VDD P Logic supply; 3.3V to 20V; powers input logic; allows direct 3.3V MCU interface; decouple with 0.1uF to VSS
10 HIN I High-side logic input; CMOS/LSTTL compatible; HIGH = HO HIGH; LOW = HO LOW; 3.3V logic compatible via VDD supply
11 SD I Shutdown input; edge-triggered; rising edge shuts down both outputs for remainder of cycle; connect to overcurrent comparator output; active-HIGH
12 LIN I Low-side logic input; CMOS/LSTTL compatible; HIGH = LO HIGH; LOW = LO LOW; 3.3V logic compatible via VDD supply
13 VSS G Logic ground; connect to PCB ground; reference for HIN, LIN, SD inputs; may differ from COM due to ground bounce
Application Description
Half-Bridge DC-DC Converter Drive high-side and low-side MOSFETs in synchronous buck/boost converters; 3A gate drive for low-RDS(on) MOSFETs; matched propagation delays prevent shoot-through; bootstrap operation eliminates isolated supply; UVLO prevents startup issues
Motor Drive Inverter Drive IGBT modules in 3-phase motor inverters; 600V rating for 400V bus systems; VS negative transient tolerance (-9.8V) handles IGBT switching transients; SD pin for overcurrent protection from current sensor
Server/Telecom Power Supply Drive MOSFETs in full-bridge or half-bridge telecom rectifiers; 3.3V logic interface with digital controller; high dv/dt noise immunity from integrated shielding; through-hole PDIP for prototyping
Model Manufacturer Compatibility Key Difference
NCP51530ADR2G onsemi Recommended Replacement 600V half-bridge driver; 4.5A/4.5A; SOIC-16W; Active status; higher drive current; wider VCC range; use for new designs
IR2110PBF Infineon Industry Standard 600V half-bridge driver; 2A/2A; PDIP-14; same pinout concept; different pinout; industry workhorse; widely available; lower drive current
FAN7390AN onsemi Same Family 600V half-bridge driver; 2A/2A; PDIP-14; lower drive current; Active status; use when 2A drive is sufficient
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Shipping & Payment

All electronic components we source from our partnered supply chains go through strict incoming inspections.Through careful testing, we ensure everything delivered to customers is genuine original parts and meets quality requirements.In addition, we keep complete inspection records to make the entire supply chain process clear and traceable.

Certification
We have obtained a number of professional certifications and built our own professional testing laboratory.This ensures that every product we deliver to our customers meets the highest quality requirements.We conduct tests in strict accordance with procedures to ensure stable product quality and accurate parameters.To guarantee genuine original parts, we also cooperate with reliable third-party testing institutions for strict quality inspection.We always attach great importance to quality and fully comply with industry standards, relevant regulations, and ISO 9001:2015 requirements.

Service & Packaging

All electronic components we source from our partnered supply chains go through strict incoming inspections.Through careful testing, we ensure everything delivered to customers is genuine original parts and meets quality requirements.In addition, we keep complete inspection records to make the entire supply chain process clear and traceable.

Certification
We have obtained a number of professional certifications and built our own professional testing laboratory.This ensures that every product we deliver to our customers meets the highest quality requirements.We conduct tests in strict accordance with procedures to ensure stable product quality and accurate parameters.To guarantee genuine original parts, we also cooperate with reliable third-party testing institutions for strict quality inspection.We always attach great importance to quality and fully comply with industry standards, relevant regulations, and ISO 9001:2015 requirements.