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Power management IC for mobile, QFN

品牌:

封装:

QFN (4.0 x 4.0 mm)
有库存:
8768pcs

货运周期:3~7 天
最低订购量为 1

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WiFi + Bluetooth combo module, 5.0 x 5.0 mm

品牌:

封装:

Module (5.0 x 5.0 x 1.0 mm, LGA)
有库存:
3491pcs

货运周期:3~7 天
最低订购量为 1

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