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LIS2DH12TR

3-Axis Accel, 2uA, +/-16g, I2C/SPI, LGA-12 2x2mm

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Manufacturer Part：

LIS2DH12TR

Package：

LGA-12 (2.0 x 2.0 x 1.0 mm)

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Description

Product Overview

The LIS2DH12TR from STMicroelectronics is an ultra-low-power 3-axis accelerometer with 16-bit data output, I2C/SPI interface, and 2x2x1mm LGA-12 package.

Key Specifications

Type Ultra-Low-Power 3-Axis MEMS Accelerometer
Full-Scale Range +/-2g / +/-4g / +/-8g / +/-16g
Resolution 16-bit data output; 12-bit actual
Output Data Rate 1 Hz to 5.376 kHz
Current Consumption 2 uA (low-power mode @ 1Hz)
Interface I2C (up to 400kHz) / SPI (up to 10MHz)
Built-in Functions Free-fall, motion, click/double-click detection
FIFO 32-level (10-bit) or 8-level (16-bit)
Supply Voltage 1.71V to 3.6V
Package LGA-12 (2 x 2 x 1.0 mm)
Operating Temperature -40C to +85C

Features

  • 2 uA ultra-low current at 1Hz ODR
  • Programmable +/-2g to +/-16g full-scale
  • 16-bit data output with 12-bit effective resolution
  • 32-level FIFO for batch data reading
  • Free-fall, motion, and click detection engines
  • 2x2mm ultra-compact LGA package

Applications

  • Wearable motion sensing
  • Smartphone screen rotation
  • IoT vibration monitoring
  • Industrial condition monitoring

The LIS2DH12TR from STMicroelectronics is an ultra-low-power 3-axis MEMS accelerometer in a 2 x 2 x 1.0 mm LGA-12 package. The device delivers 2 uA current consumption at 1 Hz output data rate in low-power mode, making it ideal for battery-powered wearable and IoT applications. The selectable +/-2g to +/-16g full-scale range accommodates both gentle motion detection and high-g shock sensing. The 16-bit data output (12-bit effective resolution) provides fine-grained acceleration measurements. The integrated FIFO buffer (32-level) reduces the frequency of MCU read operations, saving system power. Built-in detection engines for free-fall, motion, and click/double-click events offload processing from the host MCU. The dual I2C/SPI interface provides flexible connectivity options.

The LIS2DH12TR uses a capacitive MEMS (Micro-Electro-Mechanical System) sensing element. Each axis has a proof mass suspended by silicon springs that form a differential capacitor. When acceleration is applied, the proof mass displaces relative to fixed electrodes, changing the capacitance. The sigma-delta ADC converts this capacitance change to a digital value. The 12-bit ADC resolution provides 1 mg/LSB sensitivity at +/-2g full-scale. In normal mode, the full 12-bit resolution is maintained; in low-power mode, the resolution is reduced to 8-bit for lower current consumption (2 uA at 1 Hz). The built-in digital engines process the acceleration data to detect specific events: free-fall (all axes below threshold simultaneously), motion/wake-up (single axis exceeds threshold), and click/double-click (shock pattern recognition). The FIFO stores up to 32 samples, allowing the host MCU to read data in bursts rather than sample-by-sample, reducing I2C/SPI bus activity and system power.

Pin Name Type Function
1 VDD_IO Power I/O supply voltage (1.71-3.6V)
2 GND Power Ground
3 RES – Reserved (connect to GND)
4 SCL/SPC Input I2C clock / SPI clock
5 SDA/SDI/SDO I/O I2C data / SPI data in/out
6 SDO/SA0 I/O SPI data out / I2C address select
7 CS Input SPI chip select (LOW=SPI, HIGH=I2C)
8 INT1 Output Programmable interrupt 1
9 INT2/FIFO Output Programmable interrupt 2 / FIFO status
10-12 RES/GND – Reserved / Ground
  • Wearable fitness tracker with 2uA always-on step counting at 25Hz
  • Smartphone screen auto-rotation with 16-bit tilt sensing
  • IoT vibration monitor with FIFO batching and SPI read at 5.376kHz
  • Laptop free-fall detection with built-in engine triggering HDD head parking
Manufacturer Part Number Package Notes
ST LIS3DHTR LGA-16 Similar, larger 3x3mm package
Bosch BMA456 LGA-12 2x2mm, similar class
TDK InvenSense ICM-42670-P LGA-14 6-axis (accel+gyro), similar size
NXP MMA8452Q DFN-16 3x3mm, 12-bit, alternative
Analog Devices ADXL362BCCZ LGA-16 3x3mm, 300nA motion detect
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Quality is the core foundation of our long-term global cooperation. With over 20 years of experience in the electronic component industry, Materialparts has built a strict and standardized quality management system covering component sourcing, incoming inspection, full-batch testing, packaging and delivery. We are committed to delivering 100% genuine, high-reliability electronic components for industrial control, automotive electronics, consumer electronics and medical device industries, and fully safeguarding your production and R&D projects.

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Contact Information

Email: info@materialparts.com

Tel / WhatsApp: +86 13760382860

Service & Packaging

Materialparts is a professional electronic component supplier based in Shenzhen, China, with over 20 years of global trading experience. We integrate component procurement, quality inspection, technical support, customized packaging, and global delivery services to provide one-stop supply chain solutions. Our business covers industrial control, automotive electronics, consumer electronics, medical devices and other industries. We always adhere to genuine sources, stable supply and considerate after-sales service.

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Contact Information

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Tel / WhatsApp: +86 13760382860
Address: Room 2919, Guoli Building, Huaqiang North, Futian District, Shenzhen, Guangdong, China
 

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