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STM32F207ZET


120MHz ARM Cortex-M3 MCU, 512KB Flash, 128KB SRAM, Ethernet, USB OTG, LQFP-144

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Manufacturer Part:

STM32F207ZET

Package:

LQFP-144 (20 x 20 mm)

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Description

The STM32F207ZET is a high-performance ARM Cortex-M3 microcontroller from STMicroelectronics running at 120 MHz in an LQFP-144 (20×20 mm) package. It features 512 KB Flash, 128 KB SRAM, ART Accelerator for zero-wait-state Flash execution (150 DMIPS, 398 CoreMark). Peripherals: 3x 12-bit ADC (6 MSPS interleaved), 2x 12-bit DAC, 17 timers, 16-stream DMA, 10/100 Ethernet MAC (IEEE 1588v2), 2x USB OTG (HS+FS), 2x CAN, 3x I2C, 4x USART + 2x UART, 3x SPI/I2S, SDIO, camera interface, FSMC. Supply: 1.8-3.6V. Temperature: -40C to +85C. 114 GPIO (5V tolerant). Ideal for industrial automation, networking, and consumer applications requiring Ethernet and USB connectivity.

The STM32F207ZET is a high-performance 32-bit microcontroller from STMicroelectronics based on the ARM Cortex-M3 core operating at up to 120 MHz. It belongs to the STM32F2x7 connectivity line, which adds Ethernet MAC and camera interface capabilities over the STM32F205 base line. The device is housed in a 144-pin LQFP package providing up to 114 GPIO pins.

The STM32F207ZET features 512 Kbytes of Flash memory, 128 Kbytes of SRAM (112 KB main + 16 KB CCM), and 4 Kbytes of backup SRAM. The ART Accelerator (Adaptive Real-Time memory accelerator) enables zero-wait-state execution from Flash at 120 MHz, delivering 150 DMIPS (1.25 DMIPS/MHz, Dhrystone 2.1) and 398 CoreMark performance.

The device integrates an extensive peripheral set: three 12-bit ADCs (up to 6 MSPS in triple interleaved mode, 24 channels total), two 12-bit DACs, 17 timers (twelve 16-bit and two 32-bit general-purpose timers, plus basic timers), and 16-stream DMA controller with centralized FIFOs and burst support.

Connectivity is a key differentiator of the F207 line: it includes 10/100 Ethernet MAC with IEEE 1588v2 hardware support (MII/RMII), two USB OTG controllers (one HS with ULPI, one FS with on-chip PHY), two CAN 2.0B controllers, three I2C (SMBus/PMBus), four USARTs plus two UARTs (up to 7.5 Mbit/s), three SPI (30 Mbit/s, two with I2S and audio PLL), SDIO, and an 8-to-14-bit parallel camera interface (48 MB/s max).

The Flexible Static Memory Controller (FSMC) supports Compact Flash, SRAM, PSRAM, NOR, and NAND memories via the 144-pin packages external address/data bus. A true random number generator (RNG) and CRC calculation unit are also included.

The ZET suffix decodes as: Z = LQFP-144 package, E = 512 KB Flash, T = industrial temperature range (-40C to +85C). The STM32F207ZET6 variant (6 = tray packaging) is the standard ordering part number. Power supply range is 1.8V to 3.6V with dynamic voltage scaling, and low-power modes include Sleep, Stop, and Standby with VBAT supply for RTC and backup domain.

The device is pin-compatible with other STM32F20x LQFP-144 variants (STM32F205ZE, STM32F207ZG), enabling easy Flash density scaling from 256 KB to 1 MB on the same PCB layout.

The STM32F207ZET operates as a 32-bit ARM Cortex-M3 microcontroller with a sophisticated multi-bus architecture optimized for high throughput and deterministic real-time performance.

ARM Cortex-M3 Core: The Cortex-M3 processor features a 3-stage pipeline, hardware division (2-12 cycles), single-cycle multiply, bit-band support for atomic bit manipulation, and a Nested Vectored Interrupt Controller (NVIC) with up to 81 interrupt channels and 16 priority levels. The built-in Memory Protection Unit (MPU) allows privileged software to define memory regions with access permissions, enabling operating system implementations like RTOS to isolate tasks. The core supports two operating modes (Thread and Handler) and two privilege levels, providing a foundation for secure embedded software.

ART Accelerator: The ART Accelerator is a critical performance enabler. Flash memory access at 120 MHz normally requires wait states (3-4 cycles for 90nm Flash at 120 MHz). The ART Accelerator uses a 64-line instruction cache, an 8-line literal cache, and a 64-line branch cache (with branch folding) to hide Flash wait states. When the access pattern hits in the accelerator cache, the CPU sees zero-wait-state performance. ST benchmarks demonstrate 150 DMIPS and 398 CoreMark, which is the theoretical maximum for Cortex-M3 at 120 MHz. Without ART, the same CPU would deliver approximately 115 DMIPS due to Flash wait states.

Multi-AHB Bus Matrix: The STM32F207 employs an 8-master, 7-slave multi-AHB bus matrix connecting the CPU D-bus, I-bus, and S-bus, DMA1, DMA2, Ethernet DMA, USB HS DMA, and the DMA of the camera interface to memories and peripherals. The bus matrix allows concurrent accesses from multiple masters to different slaves (e.g., CPU fetching code from Flash while DMA reads SRAM), significantly increasing sustained throughput. The matrix runs at the full AHB frequency (120 MHz), providing 480 MB/s bandwidth per master port.

Memory Subsystem: The 512 KB Flash is organized as 2 KB sectors (4 KB for the first 4 sectors) supporting erase/program operations. The 128 KB SRAM is split into 112 KB main SRAM (0x20000000) accessible by all bus masters, and 16 KB Core-Coupled Memory (CCM, 0x10000000) accessible only by the CPU D-bus at full speed with zero-wait-state access. The CCM is ideal for time-critical data, stack, or ISR code. The 4 KB backup SRAM in the VBAT domain retains data even in Standby mode.

DMA Controller: The 16-stream DMA controller with dedicated FIFOs supports burst transfers (4/8/16 beats), circular mode, and double-buffer mode. Each stream can be configured with priority levels and supports memory-to-memory, memory-to-peripheral, and peripheral-to-memory transfers. The centralized FIFOs allow the DMA to absorb latency mismatches between source and destination, preventing data loss in high-speed peripherals like SPI at 30 Mbit/s.

Ethernet MAC: The 10/100 Ethernet MAC implements IEEE 802.3 with dedicated DMA and FIFO. The MII/RMII interface connects to an external PHY. IEEE 1588v2 hardware support provides sub-microsecond time stamping for precision time protocol (PTP) applications. The DMA descriptor ring architecture supports scatter-gather DMA, reducing CPU intervention in packet processing.

Power Management: The internal voltage regulator steps 1.8-3.6V VDD down to 1.2V for the core. Dynamic voltage scaling is not available on F2 (it is on F4), but the device supports Sleep (CPU halted, peripherals running), Stop (all clocks stopped, SRAM and register contents preserved), and Standby (only RTC and backup domain alive, SRAM lost) modes. VBAT supply (1.65-3.6V) maintains the RTC, 20 backup registers, and 4 KB backup SRAM when VDD is removed.

Pin Group Pin Count Type Key Functions
PA0-PA15 16 I/O (5V tolerant) ADC1/2 channels, USART2/6, TIM2/5, I2C1, SPI1, USB OTG FS, ETH_MII/RMII, JTCK/SWCLK, JTDI
PB0-PB15 16 I/O (5V tolerant) ADC1/2 channels, I2C1/2, SPI2/3, I2S2/3, CAN1/2, TIM1/3/4, SDIO, ETH_MII
PC0-PC15 16 I/O (5V tolerant) ADC1/2/3 channels, FSMC, SDIO, SPI2/3, USART3, I2S2/3, ETH_MII/RMII
PD0-PD15 16 I/O (5V tolerant) FSMC data/address, CAN1/2, USART2/3, UART4/5, SPI2/3, I2C2
PE0-PE15 16 I/O (5V tolerant) FSMC data/address/control, TIM1/9/10/11, UART4/5, FMC
PF0-PF15 16 I/O (5V tolerant) FSMC address/control, ADC3, TIM5/11
PG0-PG15 16 I/O (5V tolerant) FSMC chip select/control, ETH_MII, USART6
PH0-PH15 16 I/O (5V tolerant) OSC_IN/OUT, ETH_MII, TIM8, I2C3, OTG HS ULPI, Camera
PI0-PI11 12 I/O (5V tolerant) Camera, ETH_MII, SPI2/3, I2S2/3, TIM8, OTG HS ULPI
NRST 1 I System reset, active-low, with pull-up
BOOT0 1 I Boot mode selection (Main Flash / System Memory / SRAM)
VBAT 1 P Battery backup supply for RTC and backup domain (1.65-3.6V)
VDD (multiple) ~12 P Digital power supply, 1.8-3.6V, each must be connected
VSS (multiple) ~12 G Digital ground
VDDA/VSSA 2 P/G Analog supply/ground for ADC, DAC, reset, and RC oscillators
VREF+ 1 P ADC external reference voltage (optional, can tie to VDDA)
VCAP1/VCAP2 2 P Internal voltage regulator output, 2.2uF cap to GND each
Application Description
Industrial Automation Real-time motor control with advanced PWM timers, Ethernet-based industrial protocols (Profinet, EtherNet/IP), CAN bus for fieldbus communication, FSMC for external memory expansion
Networking and Communication IEEE 1588v2 precision time protocol for synchronized network nodes, dual CAN for gateway applications, 10/100 Ethernet MAC for embedded web servers and IoT connectivity
Consumer Electronics USB OTG for device/host dual-role, camera interface for imaging devices, audio I2S with dedicated PLL for HiFi audio playback, SDIO for storage
Medical Devices Multi-channel 12-bit ADC for vital sign monitoring, 17 timers for precise timing control, DMA for low-latency data acquisition, Ethernet for telemedicine connectivity
Building Automation CAN bus for HVAC and lighting control, Ethernet for BACnet/IP, low-power modes for battery-backed nodes, FSMC for large display interfaces
Model Manufacturer Compatibility Key Difference
STM32F207ZGT6 ST Pin-Compatible 1MB Flash (vs 512KB); same package, pinout, and peripherals; drop-in upgrade for more code space
STM32F205ZET6 ST Pin-Compatible No Ethernet MAC or camera interface; otherwise identical peripherals and memory; lower cost option
STM32F407ZET6 ST Pin-Compatible Cortex-M4F core with DSP and FPU; 168 MHz; pin-compatible LQFP-144; higher performance upgrade path
STM32F217ZET6 ST Pin-Compatible Same as F207 plus hardware crypto (AES 128/192/256, 3DES, MD5, SHA-1); for secure applications
NXP LPC1857 NXP Functionally Similar Cortex-M3 at 180 MHz, dual-bank Flash, Ethernet, USB; different peripheral mix and pinout
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All electronic components we source from our partnered supply chains go through strict incoming inspections.Through careful testing, we ensure everything delivered to customers is genuine original parts and meets quality requirements.In addition, we keep complete inspection records to make the entire supply chain process clear and traceable.

Certification
We have obtained a number of professional certifications and built our own professional testing laboratory.This ensures that every product we deliver to our customers meets the highest quality requirements.We conduct tests in strict accordance with procedures to ensure stable product quality and accurate parameters.To guarantee genuine original parts, we also cooperate with reliable third-party testing institutions for strict quality inspection.We always attach great importance to quality and fully comply with industry standards, relevant regulations, and ISO 9001:2015 requirements.

Service & Packaging

All electronic components we source from our partnered supply chains go through strict incoming inspections.Through careful testing, we ensure everything delivered to customers is genuine original parts and meets quality requirements.In addition, we keep complete inspection records to make the entire supply chain process clear and traceable.

Certification
We have obtained a number of professional certifications and built our own professional testing laboratory.This ensures that every product we deliver to our customers meets the highest quality requirements.We conduct tests in strict accordance with procedures to ensure stable product quality and accurate parameters.To guarantee genuine original parts, we also cooperate with reliable third-party testing institutions for strict quality inspection.We always attach great importance to quality and fully comply with industry standards, relevant regulations, and ISO 9001:2015 requirements.