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STM32F072CBT6


ARM Cortex-M0 48MHz, 128KB Flash, 16KB SRAM, 12-bit ADC+DAC, USB FS crystal-less, CAN, CEC, 4xUSART, 2xSPI/I2S, 2xI2C, touch sense, LQFP-48, 37 I/O, 2.0-3.6V, -40~85C

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Manufacturer Part:

STM32F072CBT6

Package:

LQFP-48 (7 x 7 x 1.4 mm, 0.5mm pitch)

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Description

The STM32F072CBT6 from STMicroelectronics is a mainstream ARM Cortex-M0 32-bit RISC microcontroller operating at up to 48 MHz in a 48-pin LQFP package (7 x 7 x 1.4 mm). Key specifications: 128 Kbytes Flash memory; 16 Kbytes SRAM with hardware parity; 37 fast I/O pins (most 5V tolerant, 19 with independent VDDIO2 supply). One 12-bit ADC with up to 16 external channels (1.0 us conversion time). One 12-bit DAC with 2 channels. Two fast low-power analog comparators with programmable input and output. Up to 24 capacitive sensing channels. 12 timers: one 16-bit advanced-control timer (6-channel PWM), one 32-bit timer, seven 16-bit timers, two watchdog timers, one SysTick timer. Communication interfaces: two I2C (Fast Mode Plus 1 Mbit/s), four USARTs (ISO 7816, LIN, IrDA, auto baud rate, modem control), two SPI (18 Mbit/s, 4-16 bit frames) with I2S multiplexed, one CAN 2.0B, one USB 2.0 full-speed device (crystal-less operation from internal 48 MHz oscillator with BCD and LPM support), one HDMI CEC. 7-channel DMA controller. CRC calculation unit. Calendar RTC with alarm and periodic wakeup. 96-bit unique ID. SWD debug. Operating voltage 2.0-3.6 V. Low-power modes: Sleep, Stop, Standby. VBAT for RTC and backup registers. Operating temperature -40 to +85 degrees C (T6 suffix) or -40 to +105 degrees C (T7 suffix). Ecopack2. Budgetary price $2.25 at 10K units.

The STM32F072CBT6 from STMicroelectronics is the flagship device of the STM32F0x2 USB line, offering the most complete peripheral set in the STM32F0 family within a compact 48-pin LQFP package. It combines an ARM Cortex-M0 core running at 48 MHz with an exceptionally rich set of communication interfaces including USB, CAN, and HDMI CEC, making it uniquely positioned for applications that require multiple wired connectivity options in a small form factor.

The STM32F072CBT6 belongs to the STM32F072xB sub-family, which features 128 KB Flash and 16 KB SRAM. The C suffix denotes a 48-pin package, the B suffix denotes 128 KB Flash, the T suffix denotes LQFP package, and the 6 suffix denotes the -40 to +85 degree C industrial temperature range. A T7 variant extends the temperature range to +105 degrees C.

The standout feature of the STM32F072 is the USB 2.0 full-speed device interface with crystal-less operation. The internal 48 MHz RC oscillator, trimmed by an automatic calibration mechanism synchronized to the USB Start-of-Frame (SOF) signal, eliminates the need for an external crystal for USB operation. This reduces BOM cost and board space significantly. The USB peripheral supports Battery Charging Detection (BCD) per the USB BC 1.2 specification and USB Link Power Management (LPM) per the USB 2.0 LPM ECN, enabling low-power USB device designs.

The CAN 2.0B interface is rare in the Cortex-M0 class and distinguishes the STM32F072 from competitors. It supports both standard (11-bit) and extended (29-bit) identifiers with three transmit mailboxes, two receive FIFOs, and loop-back/silent modes for diagnostics. This makes the STM32F072CBT6 ideal for industrial and automotive applications that require CAN bus connectivity without the cost of a Cortex-M3 or Cortex-M4 device.

The HDMI CEC (Consumer Electronics Control) interface enables the device to communicate with other CEC-enabled devices over the HDMI cable, a unique feature in this class of microcontroller. Combined with USB, this makes the STM32F072 particularly attractive for consumer electronics applications such as A/V receivers, digital TV adapters, and USB-C to HDMI adapters.

The dual-channel 12-bit DAC is another distinguishing feature. Most Cortex-M0 MCUs lack a DAC entirely, but the STM32F072 provides two independent DAC channels that can generate analog waveforms, audio signals, or control voltages. The DAC can be triggered by timers for precise waveform generation or by DMA for continuous signal generation without CPU intervention.

The capacitive sensing module supports up to 24 touch channels for touchkey, linear slider, and rotary sensor applications. This is implemented in hardware (not as a software library), reducing CPU overhead for touch sensing and enabling lower power consumption during touch detection in Stop mode.

The VDDIO2 independent I/O supply allows a subset of I/O pins to operate at a different voltage level (1.65 to 3.6 V) from the main VDD supply. This is useful for interfacing with 1.8 V logic devices without level shifters, or for mixed-voltage system designs.

Compared to the popular STM32F103C8T6 (Cortex-M3, 72 MHz, 64 KB Flash), the STM32F072CBT6 trades clock speed for a richer peripheral set at a lower price point. The STM32F072 offers USB, CAN, DAC, HDMI CEC, and capacitive sensing that the STM32F103C8T6 lacks, while the STM32F103 offers higher CPU performance and more Flash/SRAM.

The STM32F072CBT6 operates as a 32-bit ARM Cortex-M0 microcontroller with a multi-bus architecture connecting the CPU core to Flash, SRAM, and peripherals.

ARM Cortex-M0 Core: The Cortex-M0 implements the ARMv6-M architecture with a 3-stage pipeline (fetch, decode, execute). It executes a subset of the Thumb instruction set (56 instructions), providing efficient 32-bit code density using 16-bit Thumb instructions. The core includes the Nested Vectored Interrupt Controller (NVIC) supporting up to 32 maskable interrupt channels plus the non-maskable interrupt (NMI), with 4 programmable priority levels. The interrupt latency is deterministic at 15 cycles, enabling predictable real-time response.

Bus Architecture: The AHB bus matrix connects the Cortex-M0 core and the DMA controller to SRAM, Flash, and the two APB bridges (APB1 and APB2). The 7-channel DMA controller can transfer data between any combination of memory and peripherals without CPU intervention, supporting circular mode for continuous data acquisition and double-buffer mode for seamless ping-pong operation.

Flash Memory with Prefetch: The 128 KB Flash has access times that require wait states at 48 MHz (typically 1 wait state). The prefetch buffer improves linear code execution speed by fetching the next instruction ahead of the current one. The Flash also supports read-out protection (RDP) at Level 0 (no protection), Level 1 (debug access disabled, JTAG erased on unlock), and Level 2 (permanent lock, no debug access ever).

Clock System: The flexible clock tree supports multiple clock sources: HSI (8 MHz internal RC), HSI48 (48 MHz internal RC for USB), HSE (4-32 MHz external crystal), LSI (40 kHz internal RC for IWDG and RTC), and LSE (32.768 kHz crystal for RTC). The PLL can multiply HSI or HSE up to 48 MHz for the system clock. The HSI48 oscillator is automatically trimmed using the USB SOF signal for crystal-less USB operation, achieving the required plus or minus 0.25 percent frequency accuracy for USB full-speed compliance.

USB 2.0 Full-Speed Device: The USB peripheral includes dedicated packet buffer SRAM (1 KB), a CRC generator for data integrity, and double-buffered endpoints for higher throughput. The crystal-less mode uses the HSI48 oscillator with automatic trimming synchronized to the USB host SOF packets. When USB is not connected, the HSI48 can still be used as a 48 MHz system clock source (plus or minus 1 percent accuracy without USB SOF trimming). The BCD feature detects the charger type (SDP, CDP, DCP) for battery charging applications. The LPM support enables the device to enter L1 (sleep) state during USB idle periods, reducing USB power consumption.

DAC Operation: The two 12-bit DAC channels convert digital values to analog voltages with 8 us settling time. Each DAC has an output buffer that can drive external loads. The DAC output can be triggered by timer events for synchronized waveform generation, or by software for on-demand updates. DMA can supply continuous sample data to the DAC for audio or waveform generation without CPU overhead.

Capacitive Sensing: The hardware touch sensing module scans up to 24 channels autonomously, generating interrupts when a touch is detected. The module uses a charge-transfer acquisition principle, where a sensor capacitor is charged and discharged through a series resistor, and the time constant is measured to determine the capacitance change due to touch. This hardware implementation consumes less power than software-based touch scanning and can operate in Stop mode with wakeup on touch detection.

CAN 2.0B: The CAN peripheral implements the full CAN 2.0B specification with bit timing calculation, error management, and message filtering. The three transmit mailboxes allow queuing of multiple outgoing messages, while the two receive FIFOs can each hold up to three messages. The 28 filter banks provide flexible acceptance filtering, reducing CPU overhead for message handling.

Pin Name Type Description
1 VBAT Power Battery backup supply for RTC, backup registers; connect to VDD or battery; maintains timekeeping when main power removed; approximately 1 uA backup current
2 PC13/RTC_TAMP I/O Port C bit 13; alternate: RTC tamper detection, RTC timestamp, RTC calibration output, WKUP2; not 5V tolerant; limited output speed (2 MHz max); primarily for RTC functions
3-4 PC14-OSC32_IN / PC15-OSC32_OUT I/O Port C bits 14-15; alternate: 32.768 kHz LSE crystal pins; when LSE not used, available as GPIO with 2 MHz max speed; not 5V tolerant
5-6 PF0-OSC_IN / PF1-OSC_OUT I/O (FT) Port F bits 0-1; alternate: 4-32 MHz HSE crystal pins; when HSE not used, available as GPIO; 5V tolerant; in LQFP-48 these are the only Port F pins
7 NRST I/O (Reset) Active-low reset with internal pull-up; connect 100 nF cap to VSS and optional 10 k pull-up to VDD; reset sources include NRST pin, POR, PDR, WWDG, IWDG, SWD, and software
8-9 PC0-PC1 I/O (FT) Port C bits 0-1; alternate: ADC channels 10-11; 5V tolerant; commonly used for analog sensor inputs
10-17 PA0-PA7 I/O (FT) Port A bits 0-7; PA0=WKUP1/ADC_IN0/TIM2_CH1/USART2_CTS; PA1=ADC_IN1/TIM2_CH2/USART2_RTS; PA2=ADC_IN2/TIM2_CH3/USART2_TX; PA3=ADC_IN3/TIM2_CH4/USART2_RX; PA4=ADC_IN4/DAC1_OUT/SPI1_NSS; PA5=ADC_IN5/DAC2_OUT/SPI1_SCK; PA6=ADC_IN6/TIM3_CH1/SPI1_MISO; PA7=ADC_IN7/TIM3_CH2/SPI1_MOSI; all 5V tolerant
18 PC2-PC3 I/O (FT) Port C bits 2-3; alternate: ADC channels 12-13; 5V tolerant
19-20 VDD/VSS Power Main digital supply (2.0-3.6 V) and ground; bypass with 100 nF + 4.7 uF to VSS
21-28 PA8-PA15 I/O (FT) Port A bits 8-15; PA8=MCO/TIM1_CH1; PA9=USART1_TX/TIM1_CH2/I2C1_SCL(remap); PA10=USART1_RX/TIM1_CH3/I2C1_SDA(remap); PA11=USBDM/CAN_RX/TIM1_CH4; PA12=USBDP/CAN_TX/TIM1_ETR; PA13=SWDIO; PA14=SWCLK; PA15=SPI1_NSS(remap)/TIM2_CH1(remap); PA13/PA14 are debug pins by default
29-36 PB0-PB7 I/O (FT) Port B bits 0-7; PB0=ADC_IN8/TIM3_CH3; PB1=ADC_IN9/TIM3_CH4; PB2=BOOT1; PB3=SPI1_SCK(remap)/TIM2_CH2; PB4=SPI1_MISO(remap)/TIM3_CH1/NJTRST; PB5=SPI1_MOSI(remap)/I2C1_SMBA/TIM3_CH2; PB6=I2C1_SCL/TIM4_CH1/USART1_TX(remap); PB7=I2C1_SDA/TIM4_CH2/USART1_RX(remap); PB3/PB4 are JTAG pins by default
37 BOOT0 Input Boot mode select; LOW=Main Flash; HIGH=System Memory (bootloader for UART/USB DFU); connect 10 k pull-down with optional jumper to VDD for ISP
38-44 PB8-PB15 I/O (FT) Port B bits 8-15; PB8=TIM4_CH3/CAN_RX(remap)/I2C1_SCL(remap)/CEC; PB9=TIM4_CH4/CAN_TX(remap)/I2C1_SDA(remap); PB10=I2C2_SCL/CEC(remap); PB11=I2C2_SDA/USART3_RX; PB12=SPI2_NSS/TIM1_BKIN; PB13=SPI2_SCK/USART3_CTS/TIM1_CH1N; PB14=SPI2_MISO/USART3_RTS/TIM1_CH2N; PB15=SPI2_MOSI/TIM1_CH3N
45-46 PC4-PC5 I/O (FT) Port C bits 4-5; alternate: ADC channels 14-15; 5V tolerant
47 PC6-PC9 I/O (FT) Port C bits 6-9; alternate: TIM3_CH1-4, USART3/6, I2C(remap); 5V tolerant
48 VDDA/VSSA Power Analog supply for ADC/DAC/Comparator; must be connected even if analog peripherals are not used; bypass with 100 nF + 1 uF to VSSA; VDDA range 2.4-3.6 V; connect to VDD through ferrite bead for noise filtering
Application Description
USB-C Docking Station Controller USB FS device for data transfer and firmware updates; CAN for industrial bus interface; HDMI CEC for display control; DAC for audio output; capacitive touch for user interface; crystal-less USB reduces BOM; multiple USARTs for debug and auxiliary communication; VDDIO2 allows mixed-voltage interfacing
Industrial CAN Sensor Node CAN 2.0B for fieldbus communication; ADC for analog sensor acquisition; USART for Modbus RTU; DMA offloads data transfer; RTC timestamps sensor readings; Stop mode with CAN wakeup for low-power operation; 128 KB Flash stores protocol stacks and application logic; capacitive touch for local HMI
Consumer Audio/Video Peripheral USB for PC connection; HDMI CEC for TV control; DAC for audio output; I2S for digital audio; SPI for display driver; USART for IR remote control; capacitive touch buttons for user interface; crystal-less USB simplifies design
Medical Device Interface USB for PC data logging; ADC for biometric sensor acquisition; DAC for stimulation or calibration output; comparators for alarm detection; low-power Stop mode for battery operation; RTC for data timestamps; 128 KB Flash stores signal processing algorithms and USB stack
Smart Home Gateway CAN for building automation bus; USART for wireless module (Zigbee/Thread); I2C for environmental sensors; HDMI CEC for TV integration; USB for configuration and firmware updates; capacitive touch for local control; DAC for audio alerts
Model Manufacturer Compatibility Key Difference
STM32F072C8T6 ST Same Package, Less Flash Same LQFP-48 pinout and peripherals; 64 KB Flash instead of 128 KB; same 16 KB SRAM; use when 64 KB Flash is sufficient; lower cost; drop-in compatible
STM32F072RBT6 ST Larger Package, More I/O LQFP-64 (10×10 mm); 128 KB Flash, 16 KB SRAM; 51 I/O vs 37; exposes more ADC channels and Timer channels; same USB/CAN/CEC/DAC peripherals; use when more I/O pins are needed
STM32F042K6T6 ST Smaller, Lower Cost LQFP-32 (7×7 mm); 32 KB Flash, 6 KB SRAM; USB FS crystal-less; CAN; no DAC, no CEC, fewer timers; 25 I/O; lower cost; use for cost-sensitive USB/CAN applications with minimal peripheral needs
STM32F103C8T6 ST Higher Performance LQFP-48; Cortex-M3 at 72 MHz; 64 KB Flash, 20 KB SRAM; no USB (in all pin configs), no CAN (in LQFP48), no DAC, no CEC; higher CPU performance; use when raw processing power matters more than peripheral diversity
LPC11U37FBD48 NXP Competitive Alternative Cortex-M0 at 50 MHz; 128 KB Flash, 12 KB SRAM; USB FS; LQFP-48; no CAN, no DAC, no CEC; similar USB feature set but fewer communication interfaces; use as alternative for USB-centric designs
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Certification
We have obtained a number of professional certifications and built our own professional testing laboratory.This ensures that every product we deliver to our customers meets the highest quality requirements.We conduct tests in strict accordance with procedures to ensure stable product quality and accurate parameters.To guarantee genuine original parts, we also cooperate with reliable third-party testing institutions for strict quality inspection.We always attach great importance to quality and fully comply with industry standards, relevant regulations, and ISO 9001:2015 requirements.

Service & Packaging

All electronic components we source from our partnered supply chains go through strict incoming inspections.Through careful testing, we ensure everything delivered to customers is genuine original parts and meets quality requirements.In addition, we keep complete inspection records to make the entire supply chain process clear and traceable.

Certification
We have obtained a number of professional certifications and built our own professional testing laboratory.This ensures that every product we deliver to our customers meets the highest quality requirements.We conduct tests in strict accordance with procedures to ensure stable product quality and accurate parameters.To guarantee genuine original parts, we also cooperate with reliable third-party testing institutions for strict quality inspection.We always attach great importance to quality and fully comply with industry standards, relevant regulations, and ISO 9001:2015 requirements.