Global Tech News Roundup: Integrated Circuits

1. Infineon Announces New Round of Price Hikes, Semiconductor Chip Price Surge Spreads Globally

On April 26th, Infineon Technologies AG, a leading global semiconductor manufacturer based in Germany, officially sent price increase notices to its global clientele, stating that it will implement price adjustments for some of its product lines to ensure sustainable operations amid rising costs of raw materials, energy, and supply chain logistics. The move comes as a continuation of the global semiconductor price uptrend that has been gaining momentum since the end of last year, with industry giants taking the lead in adjusting their pricing strategies.

Prior to Infineon’s announcement, global foundry leaders including Taiwan Semiconductor Manufacturing Company (TSMC) and Samsung Electronics have gradually raised their foundry quotes, with price increases ranging from 5% to 12% depending on the process node. Meanwhile, integrated device manufacturers (IDMs) such as STMicroelectronics (ST) and Microchip Technology have also followed suit with phased price hikes according to their respective timetables. Notably, this round of price increases initially started in mature制程 (mature process nodes, typically 28nm and above), which are widely used in automotive electronics, industrial control, and consumer electronics. Currently, the price surge is spreading to advanced packaging and power device sectors, putting sustained cost pressure on downstream industries such as automotive, consumer electronics, and industrial equipment manufacturers worldwide. (Source: Cailian Press)

2. Jinghe Integrated Releases Q1 2026 Earnings Report, Plans Hong Kong IPO, and Announces 10% Wafer Price Hike from June

On April 26th, Jinghe Integrated Circuit Co., Ltd., a leading domestic wafer foundry in China, released its 2026 first-quarter financial report. The report showed that the company achieved a total revenue of 2.912 billion yuan (approximately $405 million), a year-on-year increase of 13.41%, driven by strong demand for mature process wafers in the automotive and industrial sectors. However, its net profit attributable to parent shareholders was about 50.66 million yuan (approximately $7 million), a year-on-year decrease of 62.61%, mainly due to rising production costs and increased R&D investment in advanced processes.

In addition to the earnings disclosure, Jinghe Integrated also announced its plan to issue H-shares and list on the Hong Kong Stock Exchange (HKEX), aiming to raise funds to expand its mature process production capacity and accelerate the R&D of 14nm FinFET technology. Simultaneously, the company stated that it will uniformly increase the price of newly produced wafers by 10% starting from June 1st, 2026, citing the continuous rise in raw material and energy costs. Following reports by media outlets such as the Economic Observer Network, the upward price trend in the global wafer foundry, chip design, and power device sectors has become further clear, with many international component buyers beginning to lock in long-term supply contracts to avoid further cost increases. (Sources: Economic Observer Network, Cailian Press)

3. U.S. Government Invests in Intel, Chip Act Reshapes Global Semiconductor Landscape

On April 26th, the U.S. government officially announced its direct investment in Intel Corporation through the CHIPS and Science Act, marking a key progress in the “government capital + private technology” collaborative model aimed at revitalizing the U.S. domestic semiconductor industry. While the specific investment amount has not been disclosed, industry insiders estimate that the investment will be in the billions of U.S. dollars, focusing on supporting Intel’s expansion of advanced process production capacity and R&D of cutting-edge chip technologies.

This move has sent ripples across the global semiconductor industry: it not only strengthens Intel’s position in the global chip market but also accelerates the adjustment of global semiconductor supply chains. For China’s semiconductor industry, the U.S. government’s investment in Intel has further prompted domestic enterprises to accelerate their focus on expanding mature process production capacity, as a key part of the domestic substitution strategy. Meanwhile, the localization process of semiconductor materials and equipment in China is advancing steadily. Data shows that in the first two months of 2026, China’s integrated circuit exports surged by 72.6% year-on-year, driven by strong demand for mature process chips from global markets, and the market share of domestic AI chips in China has reached 41%, reflecting significant progress in domestic chip R&D and production capabilities.

4. China’s First Integrated Circuit Facility Management College Established in Shanghai, Addressing Global Talent Gap

On April 26th, China’s first industry-education integration platform focusing on the semiconductor facility management field — the Integrated Circuit Facility Management College — was officially inaugurated in the Shanghai Lingang New Area. Led by Dr. Richard Chang (Zhang Rujing), a globally renowned semiconductor expert and founder of SMIC, the college is co-established with Shanghai Ocean University, aiming to address the severe shortage of professional talents in the global semiconductor facility management sector.

Semiconductor facility management, which covers clean room design, equipment maintenance, energy management, and environmental control, is a crucial backend support for chip manufacturing, and the global talent gap in this field has been widening in recent years as semiconductor production capacity expands worldwide. The establishment of the college will integrate industry resources and academic strength to cultivate professional talents with practical skills, providing much-needed backend support for the global semiconductor industry, especially for chip manufacturers in Asia, Europe, and North America. Industry analysts believe that this move will also help China strengthen its voice in the global semiconductor talent training field and promote international cooperation in semiconductor education and technology.