| Pin |
Nombre |
Descripción |
| 1 |
GND |
Ground reference and thermal pad connection |
| 2 |
VOUT |
Regulated 3.3 V output; connect 10 uF capacitor to GND |
| 3 |
VIN |
Unregulated input supply (4.3 V to 15 V) |
Package: DPAK (TO-252), 3 pins. The tab (pin 2) serves as both the output and primary thermal path to the PCB copper pour.
LD1117DT33CTR uses the DPAK (TO-252, SOT-428) surface-mount package with Pin 1 = GND/Adjust, Pin 2 = VOUT (tab), Pin 3 = VIN. The large tab underneath is electrically connected to VOUT (Pin 2) and must be soldered to a PCB copper pour for both electrical continuity and thermal dissipation. Unlike the LD1117DTTR fixed version, the DT33CTR variant has the 3.3V output voltage internally trimmed. The DPAK package provides superior thermal performance compared to SOT-223, with Rth(j-a) ≈ 50°C/W on FR-4 with 1oz copper. Input and output capacitors (10µF tantalum or ceramic) must be placed within 10mm of the device pins for stable operation.