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CYBT-343026-01

BT 5.0 dual-mode module, +12dBm, 512KB flash, Cortex-M3, 12x15.5mm

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Manufacturer Part：

CYBT-343026-01

Package：

Module (12.0 x 15.5 x 1.95 mm, 24 castellated pads)

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Description

Product Overview

The CYBT-343026-01 is an Infineon (Cypress) fully integrated Bluetooth 5.0 Smart Ready wireless module based on the CYW20706 silicon. It includes onboard crystal, passive components, 512KB flash, and integrated power amplifier for Class I/II operation. The module measures 12×15.5×1.95mm with 11 GPIOs, -30C to +85C.

Key Specifications

Bluetooth 5.0 Dual-Mode (BR/EDR + BLE)
TX Power (Classic) +12 dBm
TX Power (BLE) +9 dBm
RX Sensitivity (BLE) -96.5 dBm
Flash 512 KB onboard
Processor ARM Cortex-M3, 96 MHz

Features

  • Bluetooth 5.0 dual-mode (BR/EDR + BLE)
  • Integrated PA: +12dBm Classic, +9dBm BLE
  • 512KB onboard serial flash
  • ARM Cortex-M3 at 96 MHz
  • 11 GPIOs with ADC, PWM, I2C, SPI, UART
  • PCM/I2S audio interface
  • Fully certified (FCC, CE, MIC, ISED)
  • Deep sleep: 2.69uA

Applications

  • Bluetooth audio speakers and headsets
  • Point-of-sale terminals
  • Industrial automation
  • EV charging and asset tracking

The CYBT-343026-01 is an Infineon AIROC fully integrated Bluetooth 5.0 Smart Ready wireless module based on the CYW20706 silicon device. It integrates all RF components including crystal oscillator, passives, and 512KB serial flash memory for standalone operation. The integrated power amplifier achieves +12dBm for Bluetooth Classic (Class I) and +9dBm for Bluetooth Low Energy, providing up to 250m BLE range. The ARM Cortex-M3 processor at 96MHz runs the Bluetooth stack and application code. The module supports UART, I2C, SPI, PCM/I2S, ADC, and PWM interfaces with 11 GPIOs. Fully certified to FCC, ISED, MIC, SRRC, KC, NCC, ANATEL, and CE regulations, it eliminates the need for separate RF certification. Deep sleep current of 2.69uA extends battery life in always-advertising applications.

The CYBT-343026-01 module integrates the CYW20706 baseband processor with RF transceiver, power amplifier, and all passive components. The ARM Cortex-M3 core executes the Bluetooth stack and application firmware from the 512KB external serial flash. The 2.4GHz radio supports Basic Rate (1Mbps GFSK), Enhanced Data Rate (2/3Mbps), and Bluetooth Low Energy. The integrated PA drives the PCB trace or external u.FL antenna at up to +12dBm output power. The module handles all Bluetooth protocol functions (inquiry, paging, pairing, connection management) autonomously, with the host MCU communicating via HCI UART or through direct API calls on the embedded Cortex-M3. WICED Studio or ModusToolbox IDE provides the development environment.

24 castellated solder pads with key interfaces: VDD (2.3-3.6V), GND, HCI_UART_TX/RX/CTS/RTS, PUART_TX/RX, I2C_SCL/SDA, SPI_MOSI/MISO/CLK/CS, PCM_CLK/SYNC/IN/OUT, ADC inputs, PWM outputs, GPIOs (11 total), XRES (reset), and antenna connection. Refer to datasheet for complete 24-pad pin map.

  • Bluetooth audio speakers and headsets with BR/EDR A2DP and HFP profiles
  • Point-of-sale terminals with dual-mode BLE + Classic connectivity
  • Industrial automation wireless gateway with 250m BLE range at +9dBm
  • EV charging station communication with OTA firmware update support
Model Manufacturer Key Difference
CYBT-343026-02 Infineon Variant with u.FL antenna
CYBT-413034-02 Infineon BLE 5.2, longer range
BL654 Laird BLE 5.x module, Nordic
BT40 Silicon Labs BT dual-mode module
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Contact Information

Email: info@materialparts.com

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Service & Packaging

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Contact Information

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Address: Room 2919, Guoli Building, Huaqiang North, Futian District, Shenzhen, Guangdong, China
 

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