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AT45DB641E-SHN2B-T


64Mbit DataFlash, 1.7-3.6V SPI, 85MHz, dual SRAM buffer, SOIC-W T/R, industrial temp

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Manufacturer Part:

AT45DB641E-SHN2B-T

Package:

8-lead SOIC-W (5.18 x 7.70 mm, 1.27mm pitch, gull-wing, 0.208in wide)

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Description

The AT45DB641E-SHN2B-T from Renesas Electronics (formerly Atmel/Adesto) is a 64-Mbit DataFlash serial NOR Flash memory with an additional 2-Mbit extra array in an 8-lead SOIC-W package. It features a single 1.7V to 3.6V supply, SPI compatible interface (modes 0 and 3) up to 85 MHz, dual 256/264-byte SRAM buffers, configurable page size (256 or 264 bytes), and RapidS operation. The device supports flexible erase options (page/block/sector/chip), program/erase suspend-resume, individual sector protection and lockdown, a 128-byte OTP security register with 64-byte unique ID, and ultra-deep power-down mode (400 nA typical). Endurance is 100,000 program/erase cycles per page with 20-year data retention. Tape-and-reel packaging. Operating temperature range is -40C to +85C.

The AT45DB641E from Renesas Electronics is a 64-Mbit (8 MByte) DataFlash serial NOR Flash memory with an additional 2-Mbit extra array, designed for code and data storage applications that require sequential access, low pin count, and low power consumption. The AT45DB641E-SHN2B-T is the 8-lead SOIC-W tape-and-reel version.

The DataFlash architecture differs from standard SPI NOR Flash by incorporating two independent 256/264-byte SRAM data buffers. These buffers allow the device to receive data while simultaneously reprogramming the main memory array, enabling continuous data streaming for data logging applications. The buffers can also serve as scratch pad memory, and EEPROM emulation (bit or byte alterability) is supported through a self-contained read-modify-write operation.

The device operates from a single 1.7V to 3.6V supply, covering the full range of battery-powered and low-voltage systems. The SPI-compatible serial interface supports modes 0 and 3 with clock frequencies up to 85 MHz, providing fast data throughput. The RapidS serial interface mode is also supported for applications requiring very high speed operation.

The memory array is organized as 32,768 pages of 256 or 264 bytes each (user configurable, 264 bytes default). Flexible erase options include page erase (256/264 bytes), block erase (2 KB), sector erase (256 KB), and chip erase (64 Mbit). Program and erase operations are self-timed with suspend/resume capability, allowing the system to perform other operations during long erase cycles.

Security features include individual sector protection (prevent program/erase), individual sector lockdown (permanently read-only), and a 128-byte OTP security register with 64 bytes factory-programmed unique identifier and 64 bytes user-programmable space. JEDEC standard manufacturer and device ID read is supported.

The AT45DB641E offers excellent low-power performance: 400 nA ultra-deep power-down, 5 uA deep power-down, 25 uA standby, and 7 mA active read current (all typical). Endurance is rated at 100,000 program/erase cycles per page minimum with 20-year data retention.

Note: The AT45DB641E was originally designed by Atmel, later acquired by Adesto Technologies (2017), which was in turn acquired by Dialog Semiconductor (2020), and subsequently became part of Renesas Electronics (2021). The product is currently listed under Renesas with product longevity guaranteed through 2034.

**DataFlash Architecture:** Unlike standard SPI NOR Flash that uses random-access addressing, the AT45DB641E uses sequential (page-based) access. Data is first written to one of the two SRAM buffers, then the buffer contents are programmed into the main memory array. This buffer-to-main-memory transfer is self-timed and does not require external clocking.

**Dual SRAM Buffer Operation:** The two independent buffers (Buffer 1 and Buffer 2) enable continuous data streaming. While Buffer 1 is being programmed into the main array, Buffer 2 can receive new data from the SPI interface. Once Buffer 1 programming completes, the roles can swap, creating a ping-pong buffer arrangement that never loses data. This is critical for data logging applications where data arrives continuously.

**SPI Interface:** The 3-wire SPI interface (CS, SCK, SI/SO) reduces pin count compared to parallel Flash. Commands, addresses, and data are shifted in on SI on the rising edge of SCK; data is shifted out on SO on the falling edge. The device supports SPI modes 0 (CPOL=0, CPHA=0) and 3 (CPOL=1, CPHA=1).

**Configurable Page Size:** The page size can be set to 256 bytes (binary boundary, simplifies addressing calculations) or 264 bytes (default, includes 8 extra bytes for ECC or metadata). Factory pre-configuration to 256-byte mode is available.

**RapidS Mode:** In RapidS mode, the device eliminates the need to wait for the buffer-to-main-memory transfer before starting the next operation. This is achieved by automatically switching between buffers, maximizing throughput for continuous write operations.

Pin Name Type Description
1 SO O Serial Output; data clocked out on falling edge of SCK; high-impedance when CS is deasserted; connects to MCU SPI MISO
2 GND G Ground; connect to PCB ground plane
3 VCC P Supply voltage; 1.7V to 3.6V; decouple with 100nF + 10uF ceramic near pin
4 WP I Hardware write protect; active-low; when asserted, protects the sector protect register from being modified; does not prevent program/erase of already-protected sectors; pull HIGH for normal operation
5 SI I Serial Input; commands, addresses, and data latched on rising edge of SCK; ignored when CS is deasserted; connects to MCU SPI MOSI
6 SCK I Serial Clock; controls data flow to/from device; up to 85MHz; commands and addresses latched on rising edge; data output on falling edge
7 RESET I Hardware reset; active-low; when asserted, terminates all operations and resets internal state machine; does not affect sector protect/lockdown; connect to MCU GPIO with 10k pull-up
8 CS I Chip Select; active-low; high-to-low transition starts operation; low-to-high transition ends operation; must be deasserted after each command sequence; connects to MCU SPI CS
Application Description
Data Logging Continuous sensor data recording using dual SRAM buffer ping-pong operation; 64Mbit capacity stores weeks of timestamped data; low-power modes extend battery life; page/block erase enables efficient circular buffer management
Firmware Storage with OTA Update Store application firmware and receive over-the-air updates; dual buffer allows writing new firmware while current firmware runs from main array; sector protection prevents accidental corruption of boot loader; 20-year retention for deployed devices
Audio/Voice Recording Sequential write operation ideal for audio streaming; 85MHz SPI enables real-time audio capture; configurable page size (256 bytes) aligns with audio frame sizes; ultra-deep power-down between recording sessions saves battery
Model Manufacturer Compatibility Key Difference
AT45DB321E-SHN2B-T Renesas Lower Density 32Mbit (half density); same SOIC-W package and pinout; drop-in compatible for designs that need less storage; lower cost
AT45DB1282-SHN2B Renesas Higher Density 128Mbit (double density); same DataFlash architecture; different page size (1056 bytes); larger storage for data-intensive applications
W25Q64JVSSIQ Winbond Standard SPI NOR 64Mbit standard SPI NOR Flash; no SRAM buffers; random-access architecture; much lower cost; no DataFlash-specific features; use when buffer-based operation not needed
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Shipping & Payment

All electronic components we source from our partnered supply chains go through strict incoming inspections.Through careful testing, we ensure everything delivered to customers is genuine original parts and meets quality requirements.In addition, we keep complete inspection records to make the entire supply chain process clear and traceable.

Certification
We have obtained a number of professional certifications and built our own professional testing laboratory.This ensures that every product we deliver to our customers meets the highest quality requirements.We conduct tests in strict accordance with procedures to ensure stable product quality and accurate parameters.To guarantee genuine original parts, we also cooperate with reliable third-party testing institutions for strict quality inspection.We always attach great importance to quality and fully comply with industry standards, relevant regulations, and ISO 9001:2015 requirements.

Service & Packaging

All electronic components we source from our partnered supply chains go through strict incoming inspections.Through careful testing, we ensure everything delivered to customers is genuine original parts and meets quality requirements.In addition, we keep complete inspection records to make the entire supply chain process clear and traceable.

Certification
We have obtained a number of professional certifications and built our own professional testing laboratory.This ensures that every product we deliver to our customers meets the highest quality requirements.We conduct tests in strict accordance with procedures to ensure stable product quality and accurate parameters.To guarantee genuine original parts, we also cooperate with reliable third-party testing institutions for strict quality inspection.We always attach great importance to quality and fully comply with industry standards, relevant regulations, and ISO 9001:2015 requirements.