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LCMXO3LF-4300C-5BG400C

MachXO3 FPGA, 4400 LUTs, 96kb+distributed+32kb EBR, dual-boot, caBGA-400, 1.2V

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Manufacturer Part：

LCMXO3LF-4300C-5BG400C

Package：

caBGA-400 (15.00 x 15.00 x 1.21 mm, 0.8mm pitch)

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Description

Product Overview

The LCMXO3LF-4300C-5BG400C from Lattice Semiconductor is a MachXO3 low-power FPGA with 4400 LUTs, 96kb distributed RAM, and 32kb EBR in a caBGA-400 (15x15mm) package. With hardened I2C/SPI interface and dual-boot capability, it targets glue logic, bus bridging, and control applications.

Key Specifications

LUTs 4400
Distributed RAM 96 kb
EBR Block RAM 32 kb (2 x 18kb)
User I/O 286
PLLs 2
Configuration SPI Flash, dual-boot
Supply Voltage 1.2V core, 3.3V I/O
Operating Temperature 0C to +85C

Features

  • 4400 LUTs for control logic and bus bridging
  • Hardened I2C and SPI interfaces for configuration access
  • Dual-boot configuration for fail-safe firmware updates
  • 96kb distributed RAM and 32kb EBR block RAM
  • 2 PLLs for clock generation and management

Applications

  • System glue logic and board-level control
  • Bus bridging and protocol conversion
  • Power supply sequencing and monitoring
  • Display and sensor interface bridging

The LCMXO3LF-4300C-5BG400C from Lattice Semiconductor is a MachXO3 low-power FPGA with 4400 LUT4 logic elements, 96kb distributed RAM, 32kb EBR block RAM, and 2 PLLs in a caBGA-400 (15x15mm) package. The device provides up to 286 user I/O pins with support for LVCMOS, LVTTL, and LVDS I/O standards. Hardened I2C and SPI interfaces allow in-system configuration access without logic resources. The dual-boot feature enables fail-safe firmware updates by maintaining two configuration images. The device operates from a 1.2V core supply with 3.3V I/O, and is configured from external SPI flash. The MachXO3 family targets glue logic, bus bridging, and control applications where low power and instant-on capability are required.

The LCMXO3LF-4300C-5BG400C uses Lattice’s low-power FPGA architecture. (1) LUT4: Each logic element contains a 4-input look-up table (LUT4) and a flip-flop, implementing any 4-input combinational function plus sequential storage. (2) Distributed RAM: LUT4 elements can be configured as 16×1 distributed RAM for small memory requirements. (3) EBR: Embedded Block RAM provides 18kb per block of dual-port synchronous RAM for larger data buffers. (4) PLL: Two phase-locked loops multiply, divide, and phase-shift the input clock for system clock generation. (5) Configuration: The device loads its configuration from an external SPI flash on power-up. Dual-boot maintains two images and falls back to the previous image if the new image is corrupted. (6) Hardened Interfaces: Dedicated I2C and SPI controllers are accessible during configuration for system management without consuming LUT resources.

Pin Group Name Type Function
1-286 IO_Lxx I/O User I/O (LVCMOS/LVTTL/LVDS)
287 VCC Power 1.2V core supply
288 VCCIO Power I/O bank supply (3.3V)
289 GND Ground Ground
290 JTAG I/O TCK, TMS, TDI, TDO
291 SPI_CFG I/O SPI configuration interface
  • System glue logic and board-level control with instant-on capability
  • Bus bridging and protocol conversion with 286 I/O pins
  • Power supply sequencing and monitoring with hardened I2C
  • Display and sensor interface bridging with dual-boot fail-safe
Manufacturer Part Number Package Notes
Lattice LCMXO3LF-6900C-5BG484C caBGA-484 Larger device, 6900 LUTs
Lattice LCMXO2-7000HE-5TG144I TQFP-144 MachXO2, smaller package
AMD/Xilinx XC6SLX9-2TQG144C TQFP-144 Spartan-6, 9K LUTs
Intel 5M160ZE64I5N EQFP-64 MAX V CPLD, 160 macrocells
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Email: info@materialparts.com

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Service & Packaging

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Contact Information

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Tel / WhatsApp: +86 13760382860
Address: Room 2919, Guoli Building, Huaqiang North, Futian District, Shenzhen, Guangdong, China
 

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