Inicio > Circuitos integrados IC > XC6SLX150-3FGG676C

XC6SLX150-3FGG676C

Spartan-6 FPGA, 147K LC, 4.8Mbit RAM, 180 DSP, FBGA-676, Speed-3

567

Inventario efectivo

Ir a la consulta

Image for reference only

Pieza del fabricante：

XC6SLX150-3FGG676C

Paquete：

FBGA-676 (27 x 27 x 2.5 mm, 1.0mm pitch)

Descripción

Productos

The XC6SLX150-3FGG676C from Xilinx is a Spartan-6 FPGA with 147,443 logic cells, 4,824 Kbits block RAM, 180 DSP48A1 slices, and 498 I/O in a 676-pin FBGA package, speed grade -3.

Especificaciones

Tipo	Spartan-6 LX FPGA
Logic Cells	147,443
CLBs / Slices	11,519 CLBs / 23,038 slices
Block RAM	4,824 Kbits (134 x 18Kb)
DSP48A1 Slices	180
CMT (PLL/MMCM)	6
Maximum User I/O	498
Core Voltage	1.14 V to 1.26 V (1.2V nominal)
I/O Voltage	1.2 V to 3.3 V
Paquete	FBGA-676 (27 x 27 mm, 1.0mm pitch)
Grado de velocidad	-3 (highest performance)
Temperatura de funcionamiento	0C to +85C (commercial)

Características

147K logic cells for complex digital designs
4,824 Kbits distributed block RAM
180 DSP48A1 slices (18×18 multiplier + 48-bit accumulator)
6 Clock Management Tiles with PLL and DCM
Multi-standard I/O (LVDS, SSTL, HSTL, etc.)
Memory controller blocks for DDR/DDR2/DDR3

Aplicaciones

High-performance digital signal processing
Video and image processing
Communication protocol bridging
Embedded logic acceleration

Introducción del producto:XC6SLX150-3FGG676C Presentación del producto

The XC6SLX150-3FGG676C from Xilinx is the highest-density member of the Spartan-6 LX family, offering 147,443 logic cells, 4,824 Kbits of block RAM, and 180 DSP48A1 slices in a 676-pin FBGA package. The speed grade -3 provides the highest performance timing margins. The 180 DSP48A1 slices each contain an 18×18 hardware multiplier, 48-bit accumulator, and pattern detect logic, enabling efficient FIR filter and FFT implementations. Six Clock Management Tiles provide PLL and digital clock manager (DCM) functionality for flexible clock generation. The device supports multiple high-speed I/O standards including LVDS at up to 1.1 Gbps and memory interfaces for DDR/DDR2/DDR3 SDRAM.

Principio de funcionamiento:XC6SLX150-3FGG676C Principio de funcionamiento

The XC6SLX150-3FGG676C uses a 45nm low-power copper process SRAM-based FPGA architecture. The core consists of Configurable Logic Blocks (CLBs) each containing four 6-input LUTs (look-up tables) and eight flip-flops. The 6-input LUT can implement any 6-input Boolean function or be split into two 5-input LUTs with shared inputs. Carry chains between adjacent slices enable fast arithmetic operations. Block RAM (18 Kb each) can be configured as single/dual-port RAM, ROM, or FIFO in various width/depth combinations. DSP48A1 slices implement multiply-accumulate (MAC) operations in hardware: a 18×18 signed multiplier feeds a 48-bit accumulator with pipeline registers, pattern detection, and cascading capability. The 6 CMTs each contain a PLL (phase-locked loop) for frequency synthesis and a DCM (digital clock manager) for phase shifting and deskew. Configuration data is loaded from external flash at power-up via JTAG, SelectMAP, or serial interfaces.

Descripción de la clavija:XC6SLX150-3FGG676C Definición y funciones de las clavijas

Grupo Pin	Nombre	Tipo	Función
Múltiples	VCCINT	Potencia	Core supply (1.2V)
Múltiples	VCCAUX	Potencia	Auxiliary supply (2.5V)
Múltiples	VCCO	Potencia	I/O bank supply (1.2-3.3V)
Múltiples	GND	Suelo	Suelo
498 pins	IO	E/S	User-programmable I/O
Dedicado	MGTTXP/N	E/S	Multi-gigabit transceiver TX
Dedicado	MGTRXP/N	E/S	Multi-gigabit transceiver RX
Dedicado	CFG pins	E/S	Configuration and JTAG

Application Scenarios:In which products and applications isXC6SLX150-3FGG676C usado

1080p video scaling and color space conversion with 180 DSP slices
Multi-channel digital down-converter for SDR receiver
10GbE MAC with packet filtering and classification engine
Motor drive space vector PWM with 498 I/O for multi-axis control

Alternative Models:What chips are recommended as replacements for XC6SLX150-3FGG676C

Fabricante	Número de pieza	Paquete	Notas
Xilinx	XC6SLX150-3FGG900C	FBGA-900	More I/O (576), same die
Intel	EP4CE115F29I7N	FBGA-780	Cyclone IV E, 115K LE
Xilinx	XC7K160T-2FFG676C	FBGA-676	Kintex-7, 162K LC, Gen 3
Lattice	ECP5-85F-5BG381I	caBGA-381	84K LUTs, smaller package
Xilinx	XC6SLX100-3FGG676C	FBGA-676	101K LC, same package, lower cost