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BMI260

6-axis IMU, 16-bit accel/gyro, CRT self-cal, 685uA, dual SPI, LGA-14, pin-compatible BMI160

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Manufacturer Part：

BMI260

Package：

LGA-14 (2.50 x 3.00 x 0.83 mm)

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Description

Product Overview

The BMI260 from Bosch Sensortec is an ultra-low power 6-axis inertial measurement unit (IMU) combining a 16-bit triaxial gyroscope and 16-bit triaxial accelerometer in a 2.5 x 3.0 x 0.8mm LGA package. With self-calibrating gyroscope and CRT technology, it delivers post-soldering sensitivity errors within +/-0.4%.

Key Specifications

Accelerometer Range +/-2g to +/-16g (programmable)
Gyroscope Range +/-125dps to +/-2000dps (programmable)
Accel Noise Density 160 ug/sqrtHz
Gyro Noise Density 0.008 dps/sqrtHz
Current Consumption 685 uA (both sensors at full ODR)
Interface SPI / I2C (dual interface)
Operating Temperature -40C to +85C

Features

  • Self-calibrating gyroscope with CRT (Component Re-Trimming) for +/-0.4% post-solder accuracy
  • Pin-to-pin compatible with BMI160 for easy upgrade
  • Dual SPI interface for stereo/3D camera OIS and HMI
  • Hardware and TimeSync for precise multi-sensor timestamping
  • 160ug/sqrtHz accelerometer noise density for precise motion detection
  • 685uA total current at full ODR for power-efficient operation

Applications

  • Smartphone OIS/EIS image stabilization
  • Advanced gesture and activity recognition
  • Wearable fitness tracking and step counting
  • Drone and robotics inertial navigation

The BMI260 from Bosch Sensortec is an ultra-low power 6-axis inertial measurement unit combining a 16-bit triaxial gyroscope and a 16-bit triaxial accelerometer in a compact 2.5 x 3.0 x 0.83mm LGA-14 package. The device features the industry’s first self-calibrating gyroscope using Component Re-Trimming (CRT) functionality, which compensates for MEMS soldering drifts and ensures post-soldering sensitivity errors down to +/-0.4%. The accelerometer offers extremely low zero-g offset (+/-20mg), low sensitivity error (+/-0.4%), and low noise density (160ug/sqrtHz). Programmable measurement ranges cover +/-2g to +/-16g for the accelerometer and +/-125dps to +/-2000dps for the gyroscope. The dual SPI/I2C interface supports simultaneous OIS (optical image stabilization) and HMI (human-machine interface) functions on a single chip. Hardware and TimeSync features enable precise timestamping for multi-sensor fusion. The device is pin-to-pin compatible with the BMI160, enabling easy upgrade paths.

The BMI260 integrates MEMS sensing elements with a signal conditioning ASIC. (1) Accelerometer: A capacitive MEMS sensing element measures acceleration by detecting the displacement of a proof mass suspended by silicon springs. Capacitive fingers on the proof mass and fixed electrodes form a differential capacitor. Acceleration displaces the proof mass, changing the capacitance ratio, which is converted to a digital value by a sigma-delta ADC. (2) Gyroscope: A vibrating MEMS structure (Coriolis vibratory gyroscope) measures angular rate. When the structure vibrates and is rotated, the Coriolis effect causes a perpendicular deflection proportional to the angular rate. This deflection is sensed capacitively and converted to digital output. (3) CRT (Component Re-Trimming): The self-calibration feature applies electrical stimuli to the MEMS structure to measure and compensate for sensitivity changes caused by soldering. This reduces post-soldering sensitivity error from typical MEMS values of 1-3% down to +/-0.4%. (4) Dual Interface: The primary SPI/I2C interface provides full register access and data readout. A secondary OIS interface provides low-latency gyro and accel data directly to camera image stabilization controllers.

Pin Name Type Function
1 SDO I/O SPI data out / I2C address select
2 ASDx I/O Aux interface / OIS data
3 ASCx I/O Aux interface / OIS clock
4 INT1 Output Interrupt pin 1
5 VDDIO Power Digital I/O supply (1.2-3.6V)
6 GNDIO Ground I/O ground
7 GND Ground Analog/digital ground
8 VDD Power Analog/digital supply (1.71-3.6V)
9 INT2 Output Interrupt pin 2
10 OCSB I/O OIS chip select
11 OSDO I/O OIS SPI data out
12 CSB Input Primary SPI chip select (active low)
13 SCx Input SPI clock / I2C clock
14 SDx I/O SPI data in / I2C data
  • Smartphone OIS/EIS image stabilization with dual SPI and CRT self-calibration
  • Advanced gesture and activity recognition with 160ug/sqrtHz accel noise
  • Wearable fitness tracking and step counting at 685uA total current
  • Drone and robotics inertial navigation with +/-0.4% post-solder accuracy
Manufacturer Part Number Package Notes
Bosch BMI160 LGA-14 Previous gen, pin-compatible
Bosch BMI270 LGA-14 Wearable-focused, no OIS
ST LSM6DSOX LGA-14 6-axis IMU with ML core
InvenSense ICM-42688-P LGA-14 6-axis, high performance
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