{"id":7639,"date":"2026-06-26T07:03:26","date_gmt":"2026-06-26T07:03:26","guid":{"rendered":"https:\/\/materialparts.com\/mt29f1g01abafdsf-itf\/"},"modified":"2026-06-28T10:10:04","modified_gmt":"2026-06-28T10:10:04","slug":"mt29f1g01abafdsf-itf","status":"publish","type":"post","link":"https:\/\/materialparts.com\/zh\/mt29f1g01abafdsf-itf\/","title":{"rendered":"MT29F1G01ABAFDSF-IT:F"},"content":{"rendered":"

\u4ea7\u54c1\u6982\u89c8<\/h2>\n

The MT29F1G01ABAFDSF-IT:F from Micron is a 1Gb (128MB) SPI NAND Flash with x1\/x2\/x4 I\/O, 133MHz clock, and ECC in 24-ball WBGA.<\/p>\n

\u4e3b\u8981\u89c4\u683c<\/h2>\n\n\n\n\n\n\n\n\n\n\n\n\n
Density<\/td>\n1 Gb (128MB)<\/td>\n<\/tr>\n
Interface<\/td>\nSPI (x1\/x2\/x4)<\/td>\n<\/tr>\n
Max Clock<\/td>\n133 \u5146\u8d6b<\/td>\n<\/tr>\n
Page Size<\/td>\n2048 + 128 bytes (spare)<\/td>\n<\/tr>\n
Block Size<\/td>\n128KB (64 pages)<\/td>\n<\/tr>\n
Blocks<\/td>\n1024<\/td>\n<\/tr>\n
ECC<\/td>\nInternal ECC (4-bit\/512B)<\/td>\n<\/tr>\n
Endurance<\/td>\n3K P\/E cycles typical<\/td>\n<\/tr>\n
Supply<\/td>\n3.3V<\/td>\n<\/tr>\n
\u5305\u88c5<\/td>\n24-ball WBGA (6x8mm)<\/td>\n<\/tr>\n
\u5de5\u4f5c\u6e29\u5ea6<\/td>\n-40 to +85 C (IT)<\/td>\n<\/tr>\n<\/table>\n

\u7279\u70b9<\/h2>\n
    \n
  • SPI interface compatible with standard SPI controllers<\/li>\n
  • Internal 4-bit\/512B ECC for reliability<\/li>\n
  • Quad I\/O for 532Mbps throughput<\/li>\n
  • On-die ECC transparent to host<\/li>\n
  • Industrial temperature range<\/li>\n<\/ul>\n

    \u5e94\u7528<\/h2>\n
      \n
    • Embedded system mass storage<\/li>\n
    • IoT firmware and data logging<\/li>\n
    • Industrial data recorders<\/li>\n
    • Automotive infotainment storage<\/li>\n<\/ul>","protected":false},"excerpt":{"rendered":"

      Product Overview The MT29F1G01ABAFDSF-IT:F from Micron is a 1Gb (128MB) SPI NAND Flash with x1\/x2\/x4 I\/O, 133MHz clock, and ECC in 24-ball WBGA. Key Specifications Density 1 Gb (128MB) Interface SPI (x1\/x2\/x4) Max Clock 133 MHz Page Size 2048 + 128 bytes (spare) Block Size 128KB (64 pages) Blocks 1024 ECC Internal ECC (4-bit\/512B) Endurance […]<\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"open","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[13],"tags":[],"chip_brand":[3],"class_list":["post-7639","post","type-post","status-publish","format-standard","hentry","category-integrated-circuits-ics","chip_brand-micron"],"acf":{"brief_explanation":"1Gb SPI NAND Flash, x4 I\/O, internal ECC, WBGA-24","date_code":"","package_case":"24-ball WBGA (6.0 x 8.0 x 0.80 mm)","in_stock":6000,"datasheet":"https:\/\/www.micron.com\/~\/media\/documents\/products\/data-sheet\/nand-flash\/70-series\/m74a_1gb_3v_nand_spi.pdf","price":"$1.50 @ 1ku","product_introduction":"The MT29F1G01ABAFDSF-IT:F from Micron is a 1Gb (128MB) SPI NAND Flash memory in compact 24-ball WBGA package. It supports x1, x2, and x4 SPI modes with up to 133MHz clock for 532Mbps throughput in Quad I\/O mode. The on-die ECC (4-bit per 512 bytes) corrects bit errors transparently, simplifying host controller design. The IT suffix denotes industrial temperature range (-40 to +85C). The F suffix indicates tape and reel packaging.","working_principle":"The MT29F1G01ABAFDSF-IT:F operates as an SPI NAND Flash memory. (1) The SPI interface uses standard CS, SCK, SI, SO pins with optional IO2 and IO3 for Quad mode. The command set follows standard SPI NAND protocol with READ, PROGRAM, ERASE, and status register operations. At 133MHz Quad I\/O, the equivalent throughput reaches 532Mbps. (2) The internal page size is 2048+128 bytes (data+spare). The on-die ECC engine computes 4-bit error correction per 512 bytes during read operations, storing ECC parity in the spare area during program. This transparent ECC simplifies host software and meets the reliability requirements of 3K P\/E cycle NAND. (3) Memory is organized as 1024 blocks of 64 pages each. Block erase (128KB) is the minimum erase unit. Page program time is 300us typical, block erase 3ms typical. The 3K P\/E cycle endurance with internal ECC provides adequate reliability for code and data storage in embedded applications.","pin_description":"
      Pin<\/th>Name<\/th>Description<\/th><\/tr>
      1<\/td>CS<\/td>Chip select; active-low; SPI interface enable<\/td><\/tr>
      2<\/td>DO (IO1)<\/td>SPI data output \/ IO1 for Dual\/Quad I\/O; standard MISO function<\/td><\/tr>
      3<\/td>WP (IO2)<\/td>Write protect \/ IO2 for Quad I\/O; active-low write protection for status and lock registers<\/td><\/tr>
      4<\/td>VSS<\/td>Ground reference<\/td><\/tr>
      5<\/td>DI (IO0)<\/td>SPI data input \/ IO0 for Dual\/Quad I\/O; standard MOSI function<\/td><\/tr>
      6<\/td>SCK<\/td>SPI clock; supports Standard, Dual, and Quad SPI up to 133 MHz<\/td><\/tr>
      7<\/td>HOLD (IO3)<\/td>Hold \/ IO3 for Quad I\/O; pauses serial communication without deselecting<\/td><\/tr>
      8<\/td>VCC<\/td>Power supply (2.7 V to 3.6 V); 0.1 uF decoupling capacitor required<\/td><\/tr><\/table>

      Package: WSON-8 (6x5 mm with EP). Memory: 1 Gbit (128 MB). Page size: 2048 bytes. Erase: 128 KB block \/ 4 KB sub-sector. Endurance: 100,000 program\/erase cycles. Internal ECC. Industrial temperature: -40 C to +85 C (-IT suffix).<\/p>","application_scenarios":"

      • Embedded System Mass Storage:<\/strong> 128 MB SPI NAND Flash as primary non-volatile storage for embedded Linux root filesystems with internal ECC simplifying controller design<\/li>
      • IoT Data Logging:<\/strong> 1 Gbit capacity with 4 KB sub-sector erase for efficient circular buffer logging of sensor time-series data with 100K cycle endurance<\/li>
      • Industrial Data Recorders:<\/strong> High-reliability 1 Gbit storage with internal ECC and 20-year retention for flight data recorders, event loggers, and black box applications<\/li>
      • Automotive Infotainment:<\/strong> Quad I\/O SPI throughput for map database and multimedia content storage in navigation and infotainment head units<\/li>
      • Firmware OTA Staging:<\/strong> Large 128 MB capacity enabling A\/B firmware partition strategy for safe over-the-air updates in industrial gateways and edge devices<\/li><\/ul>","alternative_models":"\n
        Model<\/th>Manufacturer<\/th>Key Difference<\/th>Package<\/th>Density<\/th><\/tr>\n
        MT29F2G01ABAFDSF-IT:F<\/td>Micron<\/td>2Gb higher-density version with identical SPI NAND interface and internal ECC<\/td>WSON-8<\/td>2Gbit<\/td><\/tr>\n
        GD5F1GQ4UBYIG<\/td>GigaDevice<\/td>1Gb SPI NAND with comparable performance, internal ECC, and wide 2.7-3.6V supply<\/td>WSON-8<\/td>1Gbit<\/td><\/tr>\n
        W25N01GVZEIG<\/td>Winbond<\/td>1Gb SPI NAND in WSON-8 with continuous read mode and 3V supply for embedded systems<\/td>WSON-8<\/td>1Gbit<\/td><\/tr>\n
        MT29F4G01ABAFDSF-IT:F<\/td>Micron<\/td>4Gb higher-capacity version for data-intensive logging and media storage applications<\/td>WSON-8<\/td>4Gbit<\/td><\/tr>\n
        XM25QU128CIMR<\/td>XMC<\/td>1Gb SPI NAND with QPI mode and 3V supply as a cost-effective alternative source<\/td>WSON-8<\/td>1Gbit<\/td><\/tr>\n<\/table>\n

        The MT29F1G01ABAFDSF-IT:F is a 1Gb SPI NAND Flash with internal ECC, 3V supply, and -40 to +85C industrial temperature range (-IT suffix). The Micron SPI NAND family scales from 1Gb to 8Gb with identical pinout. Winbond W25N and GigaDevice GD5F series are pin-compatible alternatives with similar internal ECC architecture.<\/p>"},"_links":{"self":[{"href":"https:\/\/materialparts.com\/zh\/wp-json\/wp\/v2\/posts\/7639","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/materialparts.com\/zh\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/materialparts.com\/zh\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/materialparts.com\/zh\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/materialparts.com\/zh\/wp-json\/wp\/v2\/comments?post=7639"}],"version-history":[{"count":1,"href":"https:\/\/materialparts.com\/zh\/wp-json\/wp\/v2\/posts\/7639\/revisions"}],"predecessor-version":[{"id":7674,"href":"https:\/\/materialparts.com\/zh\/wp-json\/wp\/v2\/posts\/7639\/revisions\/7674"}],"wp:attachment":[{"href":"https:\/\/materialparts.com\/zh\/wp-json\/wp\/v2\/media?parent=7639"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/materialparts.com\/zh\/wp-json\/wp\/v2\/categories?post=7639"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/materialparts.com\/zh\/wp-json\/wp\/v2\/tags?post=7639"},{"taxonomy":"chip_brand","embeddable":true,"href":"https:\/\/materialparts.com\/zh\/wp-json\/wp\/v2\/chip_brand?post=7639"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}