{"id":7129,"date":"2026-06-23T03:57:57","date_gmt":"2026-06-23T03:57:57","guid":{"rendered":"https:\/\/materialparts.com\/lcmxo3lf-4300c-5bg400c\/"},"modified":"2026-06-23T03:57:57","modified_gmt":"2026-06-23T03:57:57","slug":"lcmxo3lf-4300c-5bg400c","status":"publish","type":"post","link":"https:\/\/materialparts.com\/zh\/lcmxo3lf-4300c-5bg400c\/","title":{"rendered":"LCMXO3LF-4300C-5BG400C"},"content":{"rendered":"<h2>\u4ea7\u54c1\u6982\u89c8<\/h2>\n<p>The LCMXO3LF-4300C-5BG400C from Lattice Semiconductor is a MachXO3 low-power FPGA with 4400 LUTs, 96kb distributed RAM, and 32kb EBR in a caBGA-400 (15x15mm) package. With hardened I2C\/SPI interface and dual-boot capability, it targets glue logic, bus bridging, and control applications.<\/p>\n<h2>\u4e3b\u8981\u89c4\u683c<\/h2>\n<table>\n<tr>\n<td>LUTs<\/td>\n<td>4400<\/td>\n<\/tr>\n<tr>\n<td>Distributed RAM<\/td>\n<td>96 kb<\/td>\n<\/tr>\n<tr>\n<td>EBR Block RAM<\/td>\n<td>32 kb (2 x 18kb)<\/td>\n<\/tr>\n<tr>\n<td>User I\/O<\/td>\n<td>286<\/td>\n<\/tr>\n<tr>\n<td>PLLs<\/td>\n<td>2<\/td>\n<\/tr>\n<tr>\n<td>\u914d\u7f6e<\/td>\n<td>SPI Flash, dual-boot<\/td>\n<\/tr>\n<tr>\n<td>\u7535\u6e90\u7535\u538b<\/td>\n<td>1.2V core, 3.3V I\/O<\/td>\n<\/tr>\n<tr>\n<td>\u5de5\u4f5c\u6e29\u5ea6<\/td>\n<td>0C to +85C<\/td>\n<\/tr>\n<\/table>\n<h2>\u7279\u70b9<\/h2>\n<ul>\n<li>4400 LUTs for control logic and bus bridging<\/li>\n<li>Hardened I2C and SPI interfaces for configuration access<\/li>\n<li>Dual-boot configuration for fail-safe firmware updates<\/li>\n<li>96kb distributed RAM and 32kb EBR block RAM<\/li>\n<li>2 PLLs for clock generation and management<\/li>\n<\/ul>\n<h2>\u5e94\u7528<\/h2>\n<ul>\n<li>System glue logic and board-level control<\/li>\n<li>Bus bridging and protocol conversion<\/li>\n<li>Power supply sequencing and monitoring<\/li>\n<li>Display and sensor interface bridging<\/li>\n<\/ul>","protected":false},"excerpt":{"rendered":"<p>Product Overview The LCMXO3LF-4300C-5BG400C from Lattice Semiconductor is a MachXO3 low-power FPGA with 4400 LUTs, 96kb distributed RAM, and 32kb EBR in a caBGA-400 (15x15mm) package. With hardened I2C\/SPI interface and dual-boot capability, it targets glue logic, bus bridging, and control applications. Key Specifications LUTs 4400 Distributed RAM 96 kb EBR Block RAM 32 kb [&hellip;]<\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"open","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[19,13],"tags":[],"chip_brand":[188],"class_list":["post-7129","post","type-post","status-publish","format-standard","hentry","category-analog-linear-ics","category-integrated-circuits-ics","chip_brand-lattice"],"acf":{"brief_explanation":"MachXO3 FPGA, 4400 LUTs, 96kb+distributed+32kb EBR, dual-boot, caBGA-400, 1.2V","date_code":"","package_case":"caBGA-400 (15.00 x 15.00 x 1.21 mm, 0.8mm pitch)","in_stock":14756,"datasheet":"https:\/\/www.latticesemi.com\/en\/Products\/FPGAandCPLD\/MachXO3","price":"$8.50 @ 1ku","product_introduction":"The LCMXO3LF-4300C-5BG400C from Lattice Semiconductor is a MachXO3 low-power FPGA with 4400 LUT4 logic elements, 96kb distributed RAM, 32kb EBR block RAM, and 2 PLLs in a caBGA-400 (15x15mm) package. The device provides up to 286 user I\/O pins with support for LVCMOS, LVTTL, and LVDS I\/O standards. Hardened I2C and SPI interfaces allow in-system configuration access without logic resources. The dual-boot feature enables fail-safe firmware updates by maintaining two configuration images. The device operates from a 1.2V core supply with 3.3V I\/O, and is configured from external SPI flash. The MachXO3 family targets glue logic, bus bridging, and control applications where low power and instant-on capability are required.","working_principle":"The LCMXO3LF-4300C-5BG400C uses Lattice's low-power FPGA architecture. (1) LUT4: Each logic element contains a 4-input look-up table (LUT4) and a flip-flop, implementing any 4-input combinational function plus sequential storage. (2) Distributed RAM: LUT4 elements can be configured as 16x1 distributed RAM for small memory requirements. (3) EBR: Embedded Block RAM provides 18kb per block of dual-port synchronous RAM for larger data buffers. (4) PLL: Two phase-locked loops multiply, divide, and phase-shift the input clock for system clock generation. (5) Configuration: The device loads its configuration from an external SPI flash on power-up. Dual-boot maintains two images and falls back to the previous image if the new image is corrupted. (6) Hardened Interfaces: Dedicated I2C and SPI controllers are accessible during configuration for system management without consuming LUT resources.","pin_description":"<table><tr><th>Pin Group<\/th><th>Name<\/th><th>Type<\/th><th>Function<\/th><\/tr><tr><td>1-286<\/td><td>IO_Lxx<\/td><td>I\/O<\/td><td>User I\/O (LVCMOS\/LVTTL\/LVDS)<\/td><\/tr><tr><td>287<\/td><td>VCC<\/td><td>Power<\/td><td>1.2V core supply<\/td><\/tr><tr><td>288<\/td><td>VCCIO<\/td><td>Power<\/td><td>I\/O bank supply (3.3V)<\/td><\/tr><tr><td>289<\/td><td>GND<\/td><td>Ground<\/td><td>Ground<\/td><\/tr><tr><td>290<\/td><td>JTAG<\/td><td>I\/O<\/td><td>TCK, TMS, TDI, TDO<\/td><\/tr><tr><td>291<\/td><td>SPI_CFG<\/td><td>I\/O<\/td><td>SPI configuration interface<\/td><\/tr><\/table>","application_scenarios":"<ul><li>System glue logic and board-level control with instant-on capability<\/li><li>Bus bridging and protocol conversion with 286 I\/O pins<\/li><li>Power supply sequencing and monitoring with hardened I2C<\/li><li>Display and sensor interface bridging with dual-boot fail-safe<\/li><\/ul>","alternative_models":"<table><tr><th>Manufacturer<\/th><th>Part Number<\/th><th>Package<\/th><th>Notes<\/th><\/tr><tr><td>Lattice<\/td><td>LCMXO3LF-6900C-5BG484C<\/td><td>caBGA-484<\/td><td>Larger device, 6900 LUTs<\/td><\/tr><tr><td>Lattice<\/td><td>LCMXO2-7000HE-5TG144I<\/td><td>TQFP-144<\/td><td>MachXO2, smaller package<\/td><\/tr><tr><td>AMD\/Xilinx<\/td><td>XC6SLX9-2TQG144C<\/td><td>TQFP-144<\/td><td>Spartan-6, 9K LUTs<\/td><\/tr><tr><td>Intel<\/td><td>5M160ZE64I5N<\/td><td>EQFP-64<\/td><td>MAX V CPLD, 160 macrocells<\/td><\/tr><\/table>"},"_links":{"self":[{"href":"https:\/\/materialparts.com\/zh\/wp-json\/wp\/v2\/posts\/7129","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/materialparts.com\/zh\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/materialparts.com\/zh\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/materialparts.com\/zh\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/materialparts.com\/zh\/wp-json\/wp\/v2\/comments?post=7129"}],"version-history":[{"count":0,"href":"https:\/\/materialparts.com\/zh\/wp-json\/wp\/v2\/posts\/7129\/revisions"}],"wp:attachment":[{"href":"https:\/\/materialparts.com\/zh\/wp-json\/wp\/v2\/media?parent=7129"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/materialparts.com\/zh\/wp-json\/wp\/v2\/categories?post=7129"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/materialparts.com\/zh\/wp-json\/wp\/v2\/tags?post=7129"},{"taxonomy":"chip_brand","embeddable":true,"href":"https:\/\/materialparts.com\/zh\/wp-json\/wp\/v2\/chip_brand?post=7129"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}