The TPS7A7001DDAR from Texas Instruments is a 2-A adjustable ultra-low-dropout (LDO) voltage regulator in an 8-pin HSOIC PowerPAD package (4.9 x 6.0 mm). It operates with input voltage as low as 1.425 V up to 6.5 V, with adjustable output from 0.5 V to 5 V set via external resistor divider. Maximum dropout is 380 mV at 2 A. The device features an enable pin with 1-\u00b5A shutdown quiescent current, 200 mV typical dropout at 1 A, 2% output accuracy, current limit and thermal shutdown protection. PSRR is 28 dB at 100 kHz. Operating temperature range is -40\u00b0C to +125\u00b0C. Target applications include telecom and networking cards, motherboard peripherals, set-top boxes, and battery-powered systems requiring very low VIN-to-VOUT differential at high current.<\/p>","protected":false},"excerpt":{"rendered":"
The TPS7A7001DDAR from Texas Instruments is a 2-A adjustable ultra-low-dropout (LDO) voltage regulator in an 8-pin HSOIC PowerPAD package (4.9 x 6.0 mm). It operates with input voltage as low as 1.425 V up to 6.5 V, with adjustable output from 0.5 V to 5 V set via external resistor divider. Maximum dropout is 380 […]<\/p>\n","protected":false},"author":2,"featured_media":2877,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[13,32],"tags":[],"chip_brand":[138],"class_list":["post-2045","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-integrated-circuits-ics","category-low-dropout-regulators-ldo","chip_brand-ti"],"acf":{"brief_explanation":"2A adjustable LDO, 1.425-6.5V in, 0.5-5V out, 200mV Vdo@1A, enable pin, HSOIC-8 PowerPAD, -40~125\u00b0C","date_code":"","package_case":"HSOIC-8 PowerPAD (DDA) (4.9 x 6.0 x 1.55 mm, 1.27mm pitch, exposed thermal pad)","in_stock":20860,"datasheet":"https:\/\/www.ti.com\/lit\/ds\/symlink\/tps7a7001.pdf","price":"$0.51 (1K+ pcs)","product_introduction":"The TPS7A7001 is a high-performance positive-voltage LDO regulator from TI designed for applications requiring very low input voltage and very low dropout at up to 2 A. The device operates with input voltage as low as 1.425 V, making it suitable for low-voltage rails derived from single-cell Li-ion or point-of-load converters. The output voltage is adjustable from 0.5 V using an external resistor divider, with a 0.5-V internal reference.\n\nThe ultra-low dropout voltage (200 mV typical at 1 A, 380 mV max at 2 A) enables efficient regulation where VOUT is close to VIN, minimizing power dissipation. The enable (EN) pin provides on\/off control with only 1-\u00b5A quiescent current in shutdown, suitable for power-sequencing and standby modes.\n\nThe HSOIC-8 PowerPAD package (DDA) provides a low thermal resistance of 46.4\u00b0C\/W junction-to-ambient when soldered to a PCB with thermal vias. This allows the device to dissipate up to 2 W in typical PCB configurations without overheating, sufficient for 2-A loads with up to 1 V of input-to-output differential.\n\nThe internal current limit and thermal shutdown protect the device during fault conditions. The 2% output accuracy over line, load, and temperature ensures stable supply rails for sensitive loads such as FPGAs, DSPs, and RF sections. The minimum 4.7-\u00b5F output capacitor (ceramic) ensures stability with low ESR.\n\nThe TPS7A7001 complements TI's lower-current LDO families (TPS736xx, TPS737xx) by providing higher output current while maintaining low dropout, filling the gap between 1-A LDOs and switching regulators for mid-power POL applications.","working_principle":"**Pass Transistor Regulation:** The TPS7A7001 uses a P-channel MOSFET pass transistor driven by an error amplifier. The error amplifier compares a fraction of the output voltage (via the external R1\/R2 divider) with the internal 0.5-V bandgap reference. When VOUT drops below the target, the error amplifier drives the PMOS gate harder, reducing RDS(on) and increasing output current. When VOUT rises above the target, the gate drive reduces, increasing RDS(on) and decreasing output current.\n\n**Dropout Operation:** In dropout, the PMOS pass transistor is fully enhanced (gate driven to near ground). The dropout voltage equals ID x RDS(on) of the fully-enhanced PMOS. The low 200-mV dropout at 1 A reflects the low channel resistance of the large PMOS device.\n\n**Enable and Shutdown:** The EN pin controls an internal bias circuit. When EN is below the threshold (~1.2 V), all internal bias is disabled, and the output is high-impedance. Ground current drops to 1 \u00b5A maximum. When EN is above the threshold, the regulator operates normally.\n\n**Protection Circuits:** The current limit circuit senses output current and clamps it to a safe level (typically 2.8 A) during overload. The thermal shutdown disables the output when junction temperature exceeds ~160\u00b0C, with ~20\u00b0C hysteresis to prevent oscillation.","pin_description":"
| Pin<\/th> | Name<\/th> | Type<\/th> | Description<\/th><\/tr><\/thead> | ||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 1<\/td> | NC<\/td> | -<\/td> | No internal connection; leave floating or connect to GND<\/td><\/tr> | ||||||||||||||||||||||||||||
| 2<\/td> | EN<\/td> | I<\/td> | Enable input; drive high (>1.2V) to enable regulator; drive low (<0.4V) to enter shutdown (1\u00b5A IQ); do not leave floating<\/td><\/tr> | ||||||||||||||||||||||||||||
| 3<\/td> | NC<\/td> | -<\/td> | No internal connection<\/td><\/tr> | ||||||||||||||||||||||||||||
| 4<\/td> | IN<\/td> | P<\/td> | Input supply; 1.425V to 6.5V; bypass with \u22654.7\u00b5F ceramic capacitor to GND<\/td><\/tr> | ||||||||||||||||||||||||||||
| 5<\/td> | OUT<\/td> | O<\/td> | Regulated output; connect external R1\/R2 divider to FB; bypass with \u22654.7\u00b5F ceramic; max load 2A<\/td><\/tr> | ||||||||||||||||||||||||||||
| 6<\/td> | FB<\/td> | I<\/td> | Feedback input; connect to R1\/R2 divider junction; VFB = 0.5V reference; output voltage = 0.5V x (1 + R1\/R2)<\/td><\/tr> | ||||||||||||||||||||||||||||
| 7<\/td> | GND<\/td> | G<\/td> | Ground; connect to PCB ground plane<\/td><\/tr> | ||||||||||||||||||||||||||||
| 8<\/td> | NC<\/td> | -<\/td> | No internal connection<\/td><\/tr> | ||||||||||||||||||||||||||||
| Pad<\/td> | PowerPAD<\/td> | G<\/td> | Exposed thermal pad; electrically GND; solder to PCB ground plane with thermal vias for heat dissipation<\/td><\/tr><\/tbody><\/table>","application_scenarios":"
|