{"id":9377,"date":"2026-07-03T06:18:01","date_gmt":"2026-07-03T06:18:01","guid":{"rendered":"https:\/\/materialparts.com\/xc3s1400a-4fgg484c\/"},"modified":"2026-07-03T07:37:39","modified_gmt":"2026-07-03T07:37:39","slug":"xc3s1400a-4fgg484c","status":"publish","type":"post","link":"https:\/\/materialparts.com\/es\/xc3s1400a-4fgg484c\/","title":{"rendered":"XC3S1400A-4FGG484C"},"content":{"rendered":"<h2>Productos<\/h2>\n<p>The XC3S1400A-4FGG484C is the largest Spartan-3A FPGA from AMD (formerly Xilinx), fabricated on a 90nm process. It features 1,400K system gates (25,344 logic cells), 1,098 Kb distributed RAM, 576 Kb block RAM, 32 dedicated 18&#215;18 multipliers, and up to 347 user I\/Os. Packaged in a 484-pin FineLine BGA (FGG484), the -4 speed grade is the fastest commercial variant for cost-sensitive, high-density applications.<\/p>\n<h2>Especificaciones<\/h2>\n<table>\n<tr>\n<td>System Gates<\/td>\n<td>1,400K<\/td>\n<\/tr>\n<tr>\n<td>Logic Cells<\/td>\n<td>25,344<\/td>\n<\/tr>\n<tr>\n<td>Distributed RAM<\/td>\n<td>1,098 Kb<\/td>\n<\/tr>\n<tr>\n<td>Block RAM<\/td>\n<td>576 Kb<\/td>\n<\/tr>\n<tr>\n<td>Dedicated Multipliers (18&#215;18)<\/td>\n<td>32<\/td>\n<\/tr>\n<tr>\n<td>DCMs<\/td>\n<td>8<\/td>\n<\/tr>\n<tr>\n<td>User I\/O<\/td>\n<td>347<\/td>\n<\/tr>\n<tr>\n<td>Process Technology<\/td>\n<td>90nm<\/td>\n<\/tr>\n<tr>\n<td>Core Voltage<\/td>\n<td>1.2V<\/td>\n<\/tr>\n<tr>\n<td>Paquete<\/td>\n<td>FGG484 (23&#215;23 mm)<\/td>\n<\/tr>\n<tr>\n<td>Grado de velocidad<\/td>\n<td>-4<\/td>\n<\/tr>\n<tr>\n<td>Temperatura de funcionamiento<\/td>\n<td>0C to +85C<\/td>\n<\/tr>\n<\/table>\n<h2>Caracter\u00edsticas<\/h2>\n<ul>\n<li>Largest Spartan-3A device with 1.4M system gates<\/li>\n<li>32 hardware 18&#215;18 multipliers for DSP coprocessing<\/li>\n<li>576 Kb dual-port block RAM for deep buffering<\/li>\n<li>8 DCMs for flexible clock management<\/li>\n<li>347 user I\/O supporting multiple standards<\/li>\n<li>MultiBoot configuration for field updates<\/li>\n<\/ul>\n<h2>Aplicaciones<\/h2>\n<ul>\n<li>High-density glue logic consolidation<\/li>\n<li>Video and image processing<\/li>\n<li>Networking bridging and packet processing<\/li>\n<li>Industrial automation controllers<\/li>\n<li>Medical equipment DSP coprocessing<\/li>\n<\/ul>","protected":false},"excerpt":{"rendered":"<p>Product Overview The XC3S1400A-4FGG484C is the largest Spartan-3A FPGA from AMD (formerly Xilinx), fabricated on a 90nm process. It features 1,400K system gates (25,344 logic cells), 1,098 Kb distributed RAM, 576 Kb block RAM, 32 dedicated 18&#215;18 multipliers, and up to 347 user I\/Os. Packaged in a 484-pin FineLine BGA (FGG484), the -4 speed grade [&hellip;]<\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"open","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[53,13],"tags":[523],"chip_brand":[287],"class_list":["post-9377","post","type-post","status-publish","format-standard","hentry","category-discrete-semiconductor-devices","category-integrated-circuits-ics","tag-xc3s1400a-4fgg484c","chip_brand-amd"],"acf":{"brief_explanation":"Spartan-3A FPGA, 1400K gates, 90nm, 32x 18x18 multipliers, 484-pin FBGA, commercial -4 speed grade","date_code":"25+","package_case":"FGG484 FineLine BGA (23x23 mm)","in_stock":12217,"datasheet":"https:\/\/www.amd.com\/content\/dam\/xilinx\/support\/documents\/data_sheets\/ds529.pdf","price":"$42.00 @ 1ku","product_introduction":"The XC3S1400A-4FGG484C is the largest device in AMD's Spartan-3A FPGA family, offering 1,400K system gates (25,344 logic cells) with 32 dedicated 18x18 multipliers and 576 Kb of block RAM in a 484-pin FBGA package. It provides the highest density and I\/O count in the Spartan-3A family, making it suitable for cost-sensitive applications that require significant logic capacity, DSP processing, and memory buffering. The -4 speed grade delivers the fastest performance in the commercial temperature range.","working_principle":"The XC3S1400A-4FGG484C operates as a high-density, cost-optimized FPGA on a 90nm process. The 25,344 logic cells are organized into Configurable Logic Blocks (CLBs) containing slices with 4-input LUTs, carry chains, and flip-flops. Each LUT can implement any 4-input combinational function or serve as 16-bit distributed RAM (SelectRAM+). The 32 DSP48A blocks provide dedicated 18x18-bit hardware multipliers with 48-bit accumulators for efficient DSP operations. Block RAM is organized as 18Kb dual-port memory blocks that can be configured as single\/dual-port RAM, ROM, or FIFO. Eight Digital Clock Managers (DCMs) provide clock deskew, frequency synthesis (multiply\/divide), and phase shifting using delay-locked loop (DLL) technology. MultiBoot allows multiple configuration bitstreams in a single flash device.","pin_description":"<table>\n<tr><th>Pin Group<\/th><th>Name<\/th><th>Type<\/th><th>Function<\/th><\/tr>\n<tr><td>Power<\/td><td>VCCINT, VCCAUX, VCCO<\/td><td>Power<\/td><td>Core 1.2V, Auxiliary 2.5V, I\/O 1.2-3.3V<\/td><\/tr>\n<tr><td>I\/O<\/td><td>IO_Lxx<\/td><td>Bidirectional<\/td><td>347 SelectIO pins (LVCMOS, LVTTL, LVDS, SSTL, HSTL)<\/td><\/tr>\n<tr><td>Configuration<\/td><td>TCK, TMS, TDI, TDO<\/td><td>JTAG<\/td><td>JTAG interface<\/td><\/tr>\n<tr><td>Clock<\/td><td>GCLK[0:7]<\/td><td>Input<\/td><td>8 global clock inputs<\/td><\/tr>\n<tr><td>Control<\/td><td>M[2:0], PROG_B, DONE<\/td><td>Control<\/td><td>Configuration mode and status<\/td><\/tr>\n<\/table>","application_scenarios":"<table>\n<tr><th>Application<\/th><th>Circuit Role<\/th><th>Key Requirement<\/th><\/tr>\n<tr><td>Video Processing<\/td><td>Scaling, color space conversion<\/td><td>576Kb BRAM, 32 multipliers, 347 I\/O<\/td><\/tr>\n<tr><td>Protocol Bridge<\/td><td>Multi-protocol conversion<\/td><td>1400K gates, 347 I\/O, DCM<\/td><\/tr>\n<tr><td>Industrial Control<\/td><td>PLC logic consolidation<\/td><td>25K LC, 8 DCM, 576Kb BRAM<\/td><\/tr>\n<tr><td>Networking<\/td><td>Packet buffering and routing<\/td><td>576Kb BRAM, 347 I\/O, 1400K gates<\/td><\/tr>\n<tr><td>Medical Imaging<\/td><td>Image pre-processing<\/td><td>32 multipliers, 576Kb BRAM<\/td><\/tr>\n<\/table>","alternative_models":"<table>\n<tr><th>Model<\/th><th>Manufacturer<\/th><th>Key Difference<\/th><\/tr>\n<tr><td>XC3S1400A-4FTG256C<\/td><td>AMD<\/td><td>Same die, smaller package (256-pin, fewer I\/O)<\/td><\/tr>\n<tr><td>XC3S700A-4FGG484C<\/td><td>AMD<\/td><td>Smaller Spartan-3A (700K gates)<\/td><\/tr>\n<tr><td>XC6SLX25-2FGG484C<\/td><td>AMD<\/td><td>Spartan-6, 28nm, 24K LC, newer generation<\/td><\/tr>\n<tr><td>XC6SLX45-2FGG484C<\/td><td>AMD<\/td><td>Spartan-6, 43K LC, more DSP<\/td><\/tr>\n<tr><td>XC7S50-1FGG484C<\/td><td>AMD<\/td><td>Spartan-7, 28nm, 52K LC<\/td><\/tr>\n<\/table>"},"_links":{"self":[{"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/posts\/9377","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/comments?post=9377"}],"version-history":[{"count":1,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/posts\/9377\/revisions"}],"predecessor-version":[{"id":9406,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/posts\/9377\/revisions\/9406"}],"wp:attachment":[{"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/media?parent=9377"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/categories?post=9377"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/tags?post=9377"},{"taxonomy":"chip_brand","embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/chip_brand?post=9377"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}