{"id":6880,"date":"2026-06-22T01:48:09","date_gmt":"2026-06-22T01:48:09","guid":{"rendered":"https:\/\/materialparts.com\/xc7a200t-2fbg484i-2\/"},"modified":"2026-06-22T01:48:09","modified_gmt":"2026-06-22T01:48:09","slug":"xc7a200t-2fbg484i-2","status":"publish","type":"post","link":"https:\/\/materialparts.com\/es\/xc7a200t-2fbg484i-2\/","title":{"rendered":"XC7A200T-2FBG484I"},"content":{"rendered":"

Productos<\/h2>\n

The XC7A200T-2FBG484I from Xilinx (AMD) is an Artix-7 FPGA with 215K logic cells, 740 DSP slices, 14.5Mb block RAM, and 16 transceivers at 6.6Gb\/s in an FBGA-484 industrial-grade package.<\/p>\n

Especificaciones<\/h2>\n\n\n\n\n\n\n\n\n\n\n\n\n\n
Tipo<\/td>\nArtix-7 FPGA (28nm)<\/td>\n<\/tr>\n
Logic Cells<\/td>\n215,360<\/td>\n<\/tr>\n
DSP Slices<\/td>\n740 (DSP48E1)<\/td>\n<\/tr>\n
Block RAM<\/td>\n14,560 Kbits (365 x 36Kb)<\/td>\n<\/tr>\n
Distributed RAM<\/td>\n2,888 Kbits<\/td>\n<\/tr>\n
I\/O Pins<\/td>\n285 (FBG484 package)<\/td>\n<\/tr>\n
Transceivers<\/td>\n16 (6.6 Gb\/s)<\/td>\n<\/tr>\n
CMT<\/td>\n10 (MMCM + PLL each)<\/td>\n<\/tr>\n
Core Voltage<\/td>\n1.0 V<\/td>\n<\/tr>\n
Grado de velocidad<\/td>\n-2 (medium performance)<\/td>\n<\/tr>\n
Paquete<\/td>\nFBGA-484 (23 x 23 mm)<\/td>\n<\/tr>\n
Temperatura de funcionamiento<\/td>\n-40C to +100C (Industrial)<\/td>\n<\/tr>\n<\/table>\n

Caracter\u00edsticas<\/h2>\n
    \n
  • 215,360 logic cells for high-density designs<\/li>\n
  • 740 DSP48E1 slices for signal processing<\/li>\n
  • 14.5 Mb block RAM with 365 BRAM36K1<\/li>\n
  • 16 multi-gigabit transceivers at 6.6 Gb\/s<\/li>\n
  • 10 CMT blocks (MMCM + PLL)<\/li>\n
  • 28nm low-power process technology<\/li>\n
  • Industrial temperature range<\/li>\n<\/ul>\n

    Aplicaciones<\/h2>\n
      \n
    • Software-defined radio and DSP<\/li>\n
    • High-speed data acquisition<\/li>\n
    • Medical imaging systems<\/li>\n
    • Industrial vision and control<\/li>\n<\/ul>","protected":false},"excerpt":{"rendered":"

      Product Overview The XC7A200T-2FBG484I from Xilinx (AMD) is an Artix-7 FPGA with 215K logic cells, 740 DSP slices, 14.5Mb block RAM, and 16 transceivers at 6.6Gb\/s in an FBGA-484 industrial-grade package. Key Specifications Type Artix-7 FPGA (28nm) Logic Cells 215,360 DSP Slices 740 (DSP48E1) Block RAM 14,560 Kbits (365 x 36Kb) Distributed RAM 2,888 Kbits […]<\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"open","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[13,25],"tags":[],"chip_brand":[175],"class_list":["post-6880","post","type-post","status-publish","format-standard","hentry","category-integrated-circuits-ics","category-microcontrollers-mcu","chip_brand-xilinx"],"acf":{"brief_explanation":"Artix-7 FPGA, 215K LC, 740 DSP, 16x 6.6Gbps, FBGA-484 Industrial","date_code":"","package_case":"FBGA-484 (23 x 23 x 1.7 mm, 1.0mm pitch)","in_stock":234,"datasheet":"https:\/\/docs.amd.com\/v\/u\/en-US\/ds181_Artix_7_Data_Sheet","price":"$85.00 @ 1ku","product_introduction":"The XC7A200T-2FBG484I from Xilinx (AMD) is the largest density device in the Artix-7 FPGA family, offering 215,360 logic cells, 740 DSP48E1 slices, and 14,560 Kbits of block RAM in a 28nm low-power process. The device is optimized for high serial bandwidth and DSP compute density, featuring 16 multi-gigabit transceivers operating at up to 6.6 Gb\/s for protocols including PCIe, SATA, CPRI, and Aurora. The 740 DSP48E1 slices provide massive parallel multiply-accumulate capability for FIR filters, FFTs, and other signal processing functions. Each DSP slice contains a 25x18 multiplier, a 48-bit accumulator, and pattern detect logic. The 10 Clock Management Tiles (CMTs) each contain a Mixed-Mode Clock Manager (MMCM) and a Phase-Locked Loop (PLL) for flexible clock generation. The -2 speed grade provides medium performance with industrial temperature range (-40C to +100C). The FBGA-484 package offers 285 user I\/O pins with support for 1.2V to 3.3V I\/O standards.","working_principle":"The XC7A200T-2FBG484I is built on a 28nm high-K metal gate (HKMG) low-power process optimized for cost and power efficiency. The FPGA fabric consists of a two-dimensional grid of Configurable Logic Blocks (CLBs) interconnected by a programmable routing matrix. Each CLB contains two slices, with each slice having four 6-input LUTs (Look-Up Tables) that can implement any 6-input Boolean function or be configured as distributed RAM or shift registers. The DSP48E1 slices provide hardened 25x18 multipliers with 48-bit accumulators, running at the full DSP clock rate (up to 628 MHz in -2 speed grade). The block RAM (BRAM36K1) provides 36Kbit dual-port memory blocks that can be configured as 36Kx1, 18Kx2, or cascaded for wider\/deeper memories. The GTP transceivers implement the physical layer for high-speed serial protocols, with built-in 8b\/10b and 64b\/66b encoding, comma detection, and equalization. Configuration is loaded via JTAG, SelectMAP, or serial SPI Flash.","pin_description":"
      Pin Group<\/th>Name<\/th>Type<\/th>Function<\/th><\/tr>
      Multiple<\/td>IO_Lxx_y_z<\/td>I\/O<\/td>285 user I\/O with selectable standards<\/td><\/tr>
      Dedicated<\/td>MGTxP\/MGTxN<\/td>Analog<\/td>16 transceiver TX\/RX differential pairs<\/td><\/tr>
      Dedicated<\/td>VCCINT<\/td>Power<\/td>1.0V core supply<\/td><\/tr>
      Dedicated<\/td>VCCAUX<\/td>Power<\/td>1.8V auxiliary supply<\/td><\/tr>
      Dedicated<\/td>VCCO_#<\/td>Power<\/td>I\/O bank supply (1.2-3.3V)<\/td><\/tr>
      Dedicated<\/td>VCCBAT<\/td>Power<\/td>Battery backup for AES key<\/td><\/tr>
      Dedicated<\/td>TCK\/TDI\/TDO\/TMS<\/td>JTAG<\/td>JTAG configuration pins<\/td><\/tr><\/table>","application_scenarios":"
      • Software-defined radio with 16x 6.6Gbps CPRI links and 740 DSP slices for baseband processing<\/li>
      • Medical ultrasound beamformer with 285 I\/O channels and BRAM for delay lines<\/li>
      • Industrial machine vision with Camera Link and PCIe Gen2 via transceivers<\/li>
      • Multi-axis motor controller with 740 DSP slices for FOC and 16 serial links<\/li><\/ul>","alternative_models":"
        Manufacturer<\/th>Part Number<\/th>Package<\/th>Notes<\/th><\/tr>
        Xilinx<\/td>XC7A200T-2FBG484E<\/td>FBGA-484<\/td>Extended temperature version<\/td><\/tr>
        Xilinx<\/td>XC7K160T-2FFG676E<\/td>FBGA-676<\/td>Kintex-7, higher performance<\/td><\/tr>
        Intel<\/td>5CGXFC7C7F23I7N<\/td>FBGA-484<\/td>Cyclone V GX, similar class<\/td><\/tr>
        Lattice<\/td>LFE5U-85F-8BG381I<\/td>caBGA-381<\/td>ECP5, lower density, lower cost<\/td><\/tr>
        Xilinx<\/td>XC7A100T-2FGG484I<\/td>FBGA-484<\/td>Artix-7, 100K LC, lower cost<\/td><\/tr><\/table>"},"_links":{"self":[{"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/posts\/6880","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/comments?post=6880"}],"version-history":[{"count":0,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/posts\/6880\/revisions"}],"wp:attachment":[{"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/media?parent=6880"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/categories?post=6880"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/tags?post=6880"},{"taxonomy":"chip_brand","embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/chip_brand?post=6880"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}