{"id":6248,"date":"2026-06-12T10:10:51","date_gmt":"2026-06-12T10:10:51","guid":{"rendered":"https:\/\/materialparts.com\/10m08sce144i7g\/"},"modified":"2026-06-12T10:10:51","modified_gmt":"2026-06-12T10:10:51","slug":"10m08sce144i7g","status":"publish","type":"post","link":"https:\/\/materialparts.com\/es\/10m08sce144i7g\/","title":{"rendered":"10M08SCE144I7G"},"content":{"rendered":"

Productos<\/h2>\n

The 10M08SCE144I7G from Intel is a MAX 10 FPGA featuring 8000 logic elements, 378 Kbits of embedded memory, and 101 I\/O pins in a 144-EQFP (20x20mm) package. Built on 55nm TSMC embedded flash process, it offers instant-on configuration with integrated dual configuration flash memory and supports industrial temperature range.<\/p>\n

Especificaciones<\/h2>\n\n\n\n\n\n\n\n\n\n\n\n
Logic Elements<\/td>\n8,000<\/td>\n<\/tr>\n
LABs\/CLBs<\/td>\n500<\/td>\n<\/tr>\n
Total RAM Bits<\/td>\n387,072 (378 Kbits)<\/td>\n<\/tr>\n
User Flash Memory<\/td>\nYes<\/td>\n<\/tr>\n
Maximum I\/O<\/td>\n101<\/td>\n<\/tr>\n
Core Voltage<\/td>\n1.2V (1.15-1.25V)<\/td>\n<\/tr>\n
I\/O Supply Voltage<\/td>\n2.85V to 3.465V<\/td>\n<\/tr>\n
Grado de velocidad<\/td>\n-I7 (Industrial)<\/td>\n<\/tr>\n
Temperatura de funcionamiento<\/td>\n-40 to 100 C (TJ)<\/td>\n<\/tr>\n
Paquete<\/td>\n144-EQFP (20x20mm, Exposed Pad)<\/td>\n<\/tr>\n<\/table>\n

Caracter\u00edsticas<\/h2>\n
    \n
  • 55nm TSMC embedded flash technology for instant-on configuration<\/li>\n
  • Integrated dual configuration flash memory (configuration in less than 10ms)<\/li>\n
  • On-chip ADC available in select variants<\/li>\n
  • User flash memory (UFM) for non-volatile storage<\/li>\n
  • Support for Nios II soft processor core<\/li>\n<\/ul>\n

    Aplicaciones<\/h2>\n
      \n
    • Control industrial y automatizaci\u00f3n<\/li>\n
    • Automotive infotainment systems<\/li>\n
    • Communication protocol bridging<\/li>\n
    • Video and image processing<\/li>\n
    • Custom logic and glue logic replacement<\/li>\n<\/ul>","protected":false},"excerpt":{"rendered":"

      Product Overview The 10M08SCE144I7G from Intel is a MAX 10 FPGA featuring 8000 logic elements, 378 Kbits of embedded memory, and 101 I\/O pins in a 144-EQFP (20x20mm) package. Built on 55nm TSMC embedded flash process, it offers instant-on configuration with integrated dual configuration flash memory and supports industrial temperature range. Key Specifications Logic Elements […]<\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[13,25],"tags":[],"chip_brand":[196],"class_list":["post-6248","post","type-post","status-publish","format-standard","hentry","category-integrated-circuits-ics","category-microcontrollers-mcu","chip_brand-intel"],"acf":{"brief_explanation":"MAX 10 FPGA with 8000 LEs, 378Kbit RAM, 101 I\/O, 144-EQFP, instant-on flash config","date_code":"","package_case":"144-EQFP Exposed Pad (20 x 20 x 1.55mm)","in_stock":10813,"datasheet":"https:\/\/www.intel.com\/programmable\/technical-pdfs\/max10-handbook.pdf","price":"$28.19 @ 100ku","product_introduction":"The 10M08SCE144I7G is a member of Intel's MAX 10 FPGA family, built on 55nm TSMC embedded flash technology. With 8000 logic elements, 378 Kbits of embedded M9K memory blocks, and up to 101 user I\/O pins, it provides a cost-effective solution for designs requiring both programmable logic and non-volatile configuration storage. The integrated dual configuration flash memory enables instant-on operation with configuration times under 10ms, eliminating the need for external configuration devices. The industrial-grade -I7 speed grade supports operation from -40 to 100 C junction temperature.","working_principle":"The 10M08SCE144I7G operates as a flash-based FPGA combining programmable logic with non-volatile configuration storage. **Configuration Subsystem**: Unlike SRAM-based FPGAs that require external configuration devices, MAX 10 stores its configuration bitstream in on-chip flash memory. The dual-flash architecture allows background programming of one flash sector while the device operates from the other, enabling live updates. Configuration completes in under 10ms after power-up. **Logic Subsystem**: 500 Logic Array Blocks (LABs) each contain 10 Logic Elements (LEs) with 4-input look-up tables (LUTs), carry chains, and register packing. LABs are interconnected through a multi-level routing hierarchy. **Memory Subsystem**: M9K embedded memory blocks support single-port, dual-port, ROM, and FIFO configurations. User Flash Memory (UFM) provides non-volatile storage for calibration data, serial numbers, or user parameters. **I\/O Subsystem**: Programmable I\/O elements support multiple I\/O standards including 3.3V, 2.5V, and 1.8V LVCMOS\/LVTTL.","pin_description":"
      Pin Group<\/th>Name<\/th>Description<\/th><\/tr>
      Power<\/td>VCCINT<\/td>1.2V core supply<\/td><\/tr>
      Power<\/td>VCCIO1-8<\/td>I\/O bank supply (2.85-3.465V)<\/td><\/tr>
      Power<\/td>VCCA<\/td>Analog supply for PLL\/ADC<\/td><\/tr>
      Ground<\/td>GND<\/td>Ground reference<\/td><\/tr>
      Config<\/td>TMS\/TCK\/TDI\/TDO<\/td>JTAG configuration interface<\/td><\/tr>
      Config<\/td>nCONFIG\/nSTATUS\/CONF_DONE<\/td>Configuration control pins<\/td><\/tr>
      Clock<\/td>CLK0-CLK3<\/td>Dedicated global clock inputs<\/td><\/tr>
      I\/O<\/td>IO_0 to IO_100<\/td>101 general-purpose I\/O pins<\/td><\/tr>
      Thermal<\/td>Exposed Pad<\/td>Thermal pad, connect to GND<\/td><\/tr><\/table>","application_scenarios":"
      • Industrial Control: Custom protocol bridging between legacy interfaces and modern communication standards<\/li>
      • Automotive: Infotainment system logic integration with instant-on capability for fast boot requirements<\/li>
      • Communication: Multi-protocol bridging between I2C, SPI, UART, and parallel interfaces<\/li>
      • Video Processing: Low-resolution video scaling and format conversion with integrated memory buffers<\/li>
      • Glue Logic: Replacement of discrete CPLDs and custom ASICs with reprogrammable flash-based logic<\/li><\/ul>","alternative_models":"
        Model<\/th>Manufacturer<\/th>Key Difference<\/th><\/tr>
        10M08SAE144C8G<\/td>Intel<\/td>Commercial grade, -C8 speed, non-ADC version<\/td><\/tr>
        EPM2210F324I5N<\/td>Intel<\/td>MAX II CPLD, 2210 LEs, flash-based<\/td><\/tr>
        ICE40HX1K-VQ100<\/td>Lattice<\/td>iCE40, 1280 LEs, SPI flash config<\/td><\/tr>
        ECP5-12E5TN144I<\/td>Lattice<\/td>ECP5, 12K LUTs, DDR3 support<\/td><\/tr>
        XC6SLX9-2TQG144I<\/td>Xilinx<\/td>Spartan-6, 9152 logic cells, SRAM-based<\/td><\/tr><\/table>"},"_links":{"self":[{"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/posts\/6248","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/comments?post=6248"}],"version-history":[{"count":0,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/posts\/6248\/revisions"}],"wp:attachment":[{"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/media?parent=6248"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/categories?post=6248"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/tags?post=6248"},{"taxonomy":"chip_brand","embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/chip_brand?post=6248"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}