{"id":3540,"date":"2026-06-06T10:01:40","date_gmt":"2026-06-06T10:01:40","guid":{"rendered":"https:\/\/materialparts.com\/lpc1768fbd100551\/"},"modified":"2026-06-06T10:01:40","modified_gmt":"2026-06-06T10:01:40","slug":"lpc1768fbd100551","status":"publish","type":"post","link":"https:\/\/materialparts.com\/es\/lpc1768fbd100551\/","title":{"rendered":"LPC1768FBD100,551"},"content":{"rendered":"

Productos<\/h2>\n

The LPC1768FBD100,551 from NXP Semiconductors is an ARM Cortex-M3 MCU running at 100 MHz with 512KB Flash and 64KB SRAM. It features Ethernet MAC, USB 2.0 Host\/Device\/OTG, dual CAN 2.0B, 8-channel DMA, 12-bit ADC, 10-bit DAC, and motor control PWM in an LQFP-100 package. This is the mbed-enabled revision 551 variant.<\/p>\n

Especificaciones<\/h2>\n\n\n\n\n\n\n\n\n\n\n\n\n
N\u00facleo<\/td>\nARM Cortex-M3<\/td>\n<\/tr>\n
Max Clock<\/td>\n100 MHz<\/td>\n<\/tr>\n
Flash<\/td>\n512 KB<\/td>\n<\/tr>\n
SRAM<\/td>\n64 KB<\/td>\n<\/tr>\n
Ethernet<\/td>\n10\/100 MAC (MII\/RMII)<\/td>\n<\/tr>\n
USB<\/td>\n2.0 Host\/Device\/OTG (Full-Speed)<\/td>\n<\/tr>\n
CAN<\/td>\n2 x CAN 2.0B<\/td>\n<\/tr>\n
ADC<\/td>\n12-bit, 8-channel<\/td>\n<\/tr>\n
Tensi\u00f3n de alimentaci\u00f3n<\/td>\n3.0V – 3.6V<\/td>\n<\/tr>\n
Paquete<\/td>\nLQFP-100 (14 x 14 mm)<\/td>\n<\/tr>\n
Temperatura de funcionamiento<\/td>\n-40 to 85 C<\/td>\n<\/tr>\n<\/table>\n

Caracter\u00edsticas<\/h2>\n
    \n
  • ARM Cortex-M3 with NVIC and hardware divide (2 cycles)<\/li>\n
  • 512KB Flash with in-application programming<\/li>\n
  • 64KB SRAM including 32KB AHB SRAM for DMA<\/li>\n
  • Integrated 10\/100 Ethernet MAC with DMA<\/li>\n
  • USB 2.0 Full-Speed host, device, and OTG<\/li>\n
  • Dual CAN 2.0B controllers with acceptance filtering<\/li>\n
  • 12-bit ADC, 10-bit DAC, motor control PWM<\/li>\n
  • 4 low-power modes including Deep power-down<\/li>\n<\/ul>\n

    Aplicaciones<\/h2>\n
      \n
    • Industrial Ethernet and USB gateways<\/li>\n
    • Motor control and power conversion<\/li>\n
    • Embedded networking applications<\/li>\n
    • Medical devices with USB\/Ethernet connectivity<\/li>\n
    • mbed rapid prototyping and education<\/li>\n<\/ul>","protected":false},"excerpt":{"rendered":"

      Product Overview The LPC1768FBD100,551 from NXP Semiconductors is an ARM Cortex-M3 MCU running at 100 MHz with 512KB Flash and 64KB SRAM. It features Ethernet MAC, USB 2.0 Host\/Device\/OTG, dual CAN 2.0B, 8-channel DMA, 12-bit ADC, 10-bit DAC, and motor control PWM in an LQFP-100 package. This is the mbed-enabled revision 551 variant. Key Specifications […]<\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[13,25],"tags":[],"chip_brand":[168],"class_list":["post-3540","post","type-post","status-publish","format-standard","hentry","category-integrated-circuits-ics","category-microcontrollers-mcu","chip_brand-nxp"],"acf":{"brief_explanation":"ARM Cortex-M3 MCU, 100MHz, 512KB Flash, 64KB RAM, Ethernet, USB, CAN, LQFP-100","date_code":"","package_case":"LQFP-100 (14 x 14 x 1.4 mm)","in_stock":2520,"datasheet":"https:\/\/www.nxp.com\/docs\/en\/data-sheet\/LPC1769_68_67_66_65_64_63.pdf","price":"$8.50 @ 1ku","product_introduction":"The LPC1768FBD100,551 from NXP Semiconductors is a high-performance ARM Cortex-M3 microcontroller running at 100 MHz with 512KB Flash and 64KB SRAM. It integrates comprehensive connectivity including 10\/100 Ethernet MAC, USB 2.0 full-speed host\/device\/OTG, and dual CAN 2.0B controllers. The device also features a 12-bit ADC, 10-bit DAC, motor control PWM, and 4 DMA channels. The ,551 suffix indicates revision 551 silicon. This device powers the popular mbed LPC1768 development platform for rapid prototyping and IoT education.","working_principle":"The LPC1768FBD100,551 operates on the ARM Cortex-M3 core with a 3-stage pipeline and hardware divide in 2 cycles. The Nested Vectored Interrupt Controller (NVIC) supports up to 33 interrupt sources with configurable priorities. The internal bus matrix connects the core to Flash, SRAM, and peripherals through separate AHB and APB buses. The 32KB AHB SRAM supports Ethernet and USB DMA transfers without CPU intervention. Dual CAN controllers include full acceptance filtering to reduce CPU overhead. In-application programming allows firmware updates while the device is running.","pin_description":"
      Pin<\/th>Name<\/th>Type<\/th>Function<\/th><\/tr>
      P0-P4<\/td>~70<\/td>I\/O<\/td>General-purpose I\/O (5V tolerant)<\/td><\/tr>
      VDD(3V3)<\/td>4<\/td>Power<\/td>3.3V digital supply<\/td><\/tr>
      VSSA\/VDDA<\/td>2<\/td>Power<\/td>Analog supply and ground<\/td><\/tr>
      VBAT<\/td>1<\/td>Power<\/td>Battery backup for RTC<\/td><\/tr>
      RESET<\/td>1<\/td>Input<\/td>Active low system reset<\/td><\/tr>
      XTAL1\/2<\/td>2<\/td>I\/O<\/td>External oscillator pins<\/td><\/tr>
      USB D+\/D-<\/td>2<\/td>I\/O<\/td>USB data pins<\/td><\/tr>
      ADC<\/td>8<\/td>Input<\/td>12-bit analog inputs<\/td><\/tr>
      DAC<\/td>1<\/td>Output<\/td>10-bit analog output<\/td><\/tr><\/table>","application_scenarios":"
      • Industrial Ethernet and USB communication gateways<\/li>
      • Motor control and power conversion systems<\/li>
      • Embedded networking and IoT edge devices<\/li>
      • Medical devices requiring USB and Ethernet connectivity<\/li>
      • Education and rapid prototyping (mbed platform)<\/li><\/ul>","alternative_models":"
        Manufacturer<\/th>Part Number<\/th>Package<\/th>Notes<\/th><\/tr>
        NXP<\/td>LPC1769FBD100<\/td>LQFP-100<\/td>120MHz, pin-compatible upgrade<\/td><\/tr>
        ST<\/td>STM32F107VCT6<\/td>LQFP-100<\/td>Cortex-M3, Ethernet, USB OTG<\/td><\/tr>
        TI<\/td>TM4C1294NCPDT<\/td>TQFP-128<\/td>Cortex-M4, 120MHz, Ethernet<\/td><\/tr>
        Microchip<\/td>SAME70Q21A<\/td>LQFP-144<\/td>Cortex-M7, Ethernet, CAN<\/td><\/tr><\/table>"},"_links":{"self":[{"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/posts\/3540","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/comments?post=3540"}],"version-history":[{"count":0,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/posts\/3540\/revisions"}],"wp:attachment":[{"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/media?parent=3540"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/categories?post=3540"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/tags?post=3540"},{"taxonomy":"chip_brand","embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/chip_brand?post=3540"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}