{"id":2739,"date":"2026-05-25T02:06:00","date_gmt":"2026-05-25T02:06:00","guid":{"rendered":"https:\/\/materialparts.com\/mtfc4gmwdq-3m-ait\/"},"modified":"2026-05-25T02:06:00","modified_gmt":"2026-05-25T02:06:00","slug":"mtfc4gmwdq-3m-ait","status":"publish","type":"post","link":"https:\/\/materialparts.com\/es\/mtfc4gmwdq-3m-ait\/","title":{"rendered":"MTFC4GMWDQ-3M AIT"},"content":{"rendered":"<h2>Productos<\/h2>\n<p>The MTFC4GMWDQ-3M AIT from Micron is a 4GB (32Gb) eMMC 5.1 embedded NAND flash memory in a 153-ball VFBGA package. Featuring HS400 mode for high-speed embedded storage, it integrates the NAND controller and TLC\/QLC flash in a single BGA package.<\/p>\n<h2>Especificaciones<\/h2>\n<table>\n<tr>\n<td>Densidad<\/td>\n<td>4GB (32Gb)<\/td>\n<\/tr>\n<tr>\n<td>Interface<\/td>\n<td>eMMC 5.1<\/td>\n<\/tr>\n<tr>\n<td>Max Read Speed<\/td>\n<td>Up to 300MB\/s (HS400)<\/td>\n<\/tr>\n<tr>\n<td>Max Write Speed<\/td>\n<td>Up to 150MB\/s<\/td>\n<\/tr>\n<tr>\n<td>HS400 Mode<\/td>\n<td>Yes (DDR at 200MHz)<\/td>\n<\/tr>\n<tr>\n<td>Write Endurance<\/td>\n<td>Program\/Erase cycles per JEDEC<\/td>\n<\/tr>\n<tr>\n<td>Paquete<\/td>\n<td>153-VFBGA (11.5 x 13.0mm)<\/td>\n<\/tr>\n<tr>\n<td>Temperatura de funcionamiento<\/td>\n<td>-25\u00b0C to +85\u00b0C (AIT grade)<\/td>\n<\/tr>\n<\/table>\n<h2>Caracter\u00edsticas<\/h2>\n<ul>\n<li>eMMC 5.1 compliant with HS400 support<\/li>\n<li>Integrated NAND controller with ECC and wear leveling<\/li>\n<li>Command queuing for improved random I\/O performance<\/li>\n<li>Field firmware update (FFU) capability<\/li>\n<li>Built-in power-fail protection and refresh<\/li>\n<li>Auto-standby and auto-sleep power modes<\/li>\n<\/ul>\n<h2>Aplicaciones<\/h2>\n<ul>\n<li>Embedded system boot and storage<\/li>\n<li>IoT device primary storage<\/li>\n<li>Automotive infotainment systems<\/li>\n<li>Industrial control storage<\/li>\n<li>Smart TV and set-top box storage<\/li>\n<\/ul>","protected":false},"excerpt":{"rendered":"<p>Product Overview The MTFC4GMWDQ-3M AIT from Micron is a 4GB (32Gb) eMMC 5.1 embedded NAND flash memory in a 153-ball VFBGA package. Featuring HS400 mode for high-speed embedded storage, it integrates the NAND controller and TLC\/QLC flash in a single BGA package. Key Specifications Density 4GB (32Gb) Interface eMMC 5.1 Max Read Speed Up to [&hellip;]<\/p>\n","protected":false},"author":2,"featured_media":2759,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[13],"tags":[],"chip_brand":[3],"class_list":["post-2739","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-integrated-circuits-ics","chip_brand-micron"],"acf":{"brief_explanation":"4GB eMMC 5.1, HS400, 153-VFBGA, integrated controller, industrial temp","date_code":"","package_case":"153-VFBGA (11.5 x 13.0 x 1.0 mm)","in_stock":11847,"datasheet":"https:\/\/www.micron.com\/products\/managed-nand\/emmc","price":"$4.50 @ 1ku","product_introduction":"The MTFC4GMWDQ-3M AIT from Micron Technology is a 4GB eMMC 5.1 embedded NAND flash memory in a 153-ball VFBGA package. It integrates the NAND flash memory and controller in a single package, providing a complete managed storage solution. The eMMC 5.1 interface supports HS400 mode for up to 300MB\/s read bandwidth. The integrated controller handles ECC, wear leveling, bad block management, and power-fail protection transparently. The AIT temperature grade supports -25C to +85C operation. Command queuing improves random I\/O performance over legacy eMMC versions.","working_principle":"The MTFC4GMWDQ-3M AIT integrates a NAND flash memory array with an on-die controller. The controller manages all flash operations including ECC (error correction code), wear leveling across all blocks, bad block detection and replacement, and power-fail recovery. The eMMC interface uses an 8-bit parallel bus with CMD\/CLK\/DAT signals. In HS400 mode, data is clocked on both rising and falling edges (DDR) at 200MHz, achieving 400MB\/s raw bandwidth. The controller maps logical block addresses (LBAs) to physical flash pages, hiding the complexity of NAND management from the host.","pin_description":"<table><tr><th>Pin Group<\/th><th>Name<\/th><th>Type<\/th><th>Function<\/th><\/tr><tr><td>1<\/td><td>CMD<\/td><td>I\/O<\/td><td>Command\/response bus<\/td><\/tr><tr><td>2<\/td><td>CLK<\/td><td>Input<\/td><td>Clock (up to 200MHz)<\/td><\/tr><tr><td>3-10<\/td><td>DAT0-DAT7<\/td><td>I\/O<\/td><td>8-bit data bus<\/td><\/tr><tr><td>11<\/td><td>RST_n<\/td><td>Input<\/td><td>Hardware reset (active low)<\/td><\/tr><tr><td>12<\/td><td>VCC<\/td><td>Power<\/td><td>Core\/IO supply (1.8V\/3.3V)<\/td><\/tr><tr><td>13<\/td><td>VCCQ<\/td><td>Power<\/td><td>I\/O supply voltage<\/td><\/tr><\/table>","application_scenarios":"<ul><li>Embedded Linux\/Android boot and application storage<\/li><li>IoT gateway and edge device primary storage<\/li><li>Automotive infotainment system map and media storage<\/li><li>Industrial PLC and HMI data logging<\/li><li>Smart TV and set-top box firmware storage<\/li><\/ul>","alternative_models":"<table><tr><th>Manufacturer<\/th><th>Part Number<\/th><th>Package<\/th><th>Notes<\/th><\/tr><tr><td>Micron<\/td><td>MTFC8GAKAHQ-4M AIT<\/td><td>153-VFBGA<\/td><td>8GB upgrade, eMMC 5.1<\/td><\/tr><tr><td>Samsung<\/td><td>KLMBG2JETD-B041<\/td><td>153-VFBGA<\/td><td>4GB eMMC 5.1, equivalent<\/td><\/tr><tr><td>SKhynix<\/td><td>H26M41204HPR<\/td><td>153-VFBGA<\/td><td>4GB eMMC 5.1 alternative<\/td><\/tr><tr><td>Western Digital<\/td><td>SDINBDG4-16G<\/td><td>153-VFBGA<\/td><td>16GB iNAND, higher density<\/td><\/tr><\/table>"},"_links":{"self":[{"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/posts\/2739","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/comments?post=2739"}],"version-history":[{"count":0,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/posts\/2739\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/media\/2759"}],"wp:attachment":[{"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/media?parent=2739"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/categories?post=2739"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/tags?post=2739"},{"taxonomy":"chip_brand","embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/chip_brand?post=2739"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}