{"id":2037,"date":"2026-05-13T12:20:17","date_gmt":"2026-05-13T12:20:17","guid":{"rendered":"https:\/\/materialparts.com\/w25q256fvfig\/"},"modified":"2026-05-13T12:20:17","modified_gmt":"2026-05-13T12:20:17","slug":"w25q256fvfig","status":"publish","type":"post","link":"https:\/\/materialparts.com\/es\/w25q256fvfig\/","title":{"rendered":"W25Q256FVFIG"},"content":{"rendered":"<p>La W25Q256FVFIG de Winbond es una memoria SPI NOR Flash de 256 Mbit (32 MByte) en un encapsulado SOIC-300 de 16 patillas. Soporta interfaces SPI est\u00e1ndar, Dual SPI y Quad SPI con frecuencias de reloj de hasta 104 MHz, alcanzando tasas equivalentes de 208 MHz (Dual I\/O) y 416 MHz (Quad I\/O) para una transferencia de datos continua de 50-MB\/s. El dispositivo funciona de 2,7 V a 3,6 V con una corriente activa de 4 mA y una corriente de apagado inferior a 1 \u00b5A. La memoria est\u00e1 organizada en 131.072 p\u00e1ginas de 256 bytes con opciones de sector de 4 KB, bloque de 32 KB\/64 KB y borrado de chip. Entre sus caracter\u00edsticas se incluyen direccionamiento de 3\/4 bytes, modo QPI, suspensi\u00f3n\/reanudaci\u00f3n, registros de seguridad con bloqueo OTP, ID \u00fanico de 64 bits y SFDP. Nota: esta generaci\u00f3n de FV est\u00e1 descatalogada; la serie JV es el sustituto recomendado.<\/p>","protected":false},"excerpt":{"rendered":"<p>The W25Q256FVFIG from Winbond is a 256-Mbit (32-MByte) SPI NOR Flash memory in a 16-pin SOIC-300 package. It supports standard SPI, Dual SPI, and Quad SPI interfaces with clock frequencies up to 104 MHz, achieving equivalent rates of 208 MHz (Dual I\/O) and 416 MHz (Quad I\/O) for 50-MB\/s continuous data transfer. The device operates [&hellip;]<\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[39,13],"tags":[],"chip_brand":[157],"class_list":["post-2037","post","type-post","status-publish","format-standard","hentry","category-flash-memory-nand-nor-flash","category-integrated-circuits-ics","chip_brand-winbond"],"acf":{"brief_explanation":"256Mbit SPI NOR Flash, Quad SPI 104MHz, 50MB\/s, 4KB sector, 3\/4-byte addr, SOIC-16, -40~85\u00b0C, OBSOLETE","date_code":"","package_case":"SOIC-16 (300-mil, 10.3 x 7.5 x 2.35 mm, 1.27mm pitch)","in_stock":2000,"datasheet":"https:\/\/www.winbond.com\/resource-files\/w25q256fv.pdf","price":"$4.13 (1K+ pcs)","product_introduction":"The W25Q256FVFIG is a 256-Mbit (32-MByte) serial NOR Flash memory from Winbond's SpiFlash family, housed in a 16-pin SOIC-300 package with an additional \/RESET pin. It provides high-density non-volatile storage for code shadowing, execute-in-place (XIP), and data logging applications.\n\nThe device supports four SPI modes: standard SPI (1-bit serial), Dual Output SPI, Dual I\/O SPI, and Quad I\/O SPI. At 104 MHz clock, Quad I\/O achieves an effective 416 MHz data rate (50 MB\/s), outperforming many parallel Flash memories while using only 6 pins. The QPI (Quad Peripheral Interface) mode enables all four data pins for both command and address phases, reducing instruction overhead to just 8 clock cycles for true XIP operation.\n\nThe 256-Mbit density requires 3-byte or 4-byte addressing. The device supports both modes for backward compatibility (3-byte) and full address space access (4-byte). The 16-pin SOIC package provides a dedicated \/RESET pin (pin 9) that is not available on 8-pin packages, enabling hardware reset without SPI commands.\n\nMemory organization includes 131,072 programmable pages of 256 bytes, 8,192 erasable 4-KB sectors, and 512 erasable 64-KB blocks. The 4-KB sector size supports fine-grained data management. Erase\/program suspend and resume allows interrupting a long erase operation to read or program a different area, reducing system latency.\n\nSecurity features include software\/hardware write protection, power-supply lock-down, individual sector\/block protection, three 256-byte security registers with OTP locks, a 64-bit unique serial number, and an SFDP (Serial Flash Discoverable Parameters) register for auto-detection.\n\nThe W25Q256FVFIG is part of the FV generation which is now discontinued. Winbond recommends migrating to the W25Q256JV series (JVFIQ or JVFIM suffixes), which offers the same functionality with improved performance and continued production support.","working_principle":"**SPI Interface:** The W25Q256FV uses a standard SPI interface with \/CS (chip select), CLK (serial clock), DI\/IO0 (data in), DO\/IO1 (data out), \/WP\/IO2, and \/HOLD\/IO3 pins. In standard SPI mode, DI carries command\/address\/data and DO returns data. In Quad SPI mode, all four I\/O pins carry address and data in parallel, quadrupling throughput. QPI mode extends quad operation to the command phase as well.\n\n**3\/4-Byte Addressing:** The 256-Mbit density exceeds the 128-Mbit boundary of 24-bit (3-byte) addressing. The device defaults to 3-byte addressing for compatibility and can switch to 4-byte addressing via the Enter 4-Byte Address Mode instruction. In 3-byte mode, only the lower 128 Mbit is accessible. In 4-byte mode, all 256 Mbit is accessible with a 32-bit address.\n\n**Page Program and Erase:** Programming loads up to 256 bytes into an internal buffer, then writes the entire page in approximately 3 ms (typical). Sectors (4 KB) erase in approximately 400 ms, blocks (32\/64 KB) in 800 ms\/2 s, and the entire chip in approximately 200 s. The suspend\/resume feature allows reading from non-suspended areas during long erase operations.\n\n**Status and Protection:** Two status registers (SR1, SR2) control write protection, quad enable, and address mode. Block protect bits in SR1 define protected address ranges. The SR2 Quad Enable bit must be set before using Quad SPI instructions. Write protection can be enhanced with the \/WP pin (active low) which locks the status register when asserted.","pin_description":"<table><thead><tr><th>Pin<\/th><th>Name<\/th><th>Type<\/th><th>Description<\/th><\/tr><\/thead><tbody><tr><td>1<\/td><th>\/CS<\/th><th>I<\/td><th>Chip select (active low); must be driven high between commands; internal pull-up; going high terminates partial commands<\/td><\/tr><tr><td>2<\/td><th>DO\/IO1<\/td><th>I\/O<\/td><th>Data output in standard SPI; I\/O1 in Dual\/Quad SPI; serial data out during read operations<\/td><\/tr><tr><td>3<\/td><th>\/WP\/IO2<\/td><th>I\/O<\/td><th>Write protect (active low) in standard SPI; I\/O2 in Quad SPI; when SR2 bit 1=0, \/WP low locks status register bits<\/td><\/tr><tr><td>4<\/td><th>GND<\/td><th>G<\/td><th>Ground<\/td><\/tr><tr><td>5<\/td><th>DI\/IO0<\/td><th>I\/O<\/td><th>Data input in standard SPI; I\/O0 in Dual\/Quad SPI; serial command\/address\/data input<\/td><\/tr><tr><td>6<\/td><th>CLK<\/td><th>I<\/td><th>Serial clock; all shifts and sampling occur on CLK edges; polarity and phase per SPI mode 0 or 3<\/td><\/tr><tr><td>7<\/td><th>\/HOLD\/IO3<\/td><th>I\/O<\/td><th>Hold (active low) pauses serial communication without deselecting; I\/O3 in Quad SPI; allows sharing SPI bus with other devices<\/td><\/tr><tr><td>8<\/td><th>VCC<\/td><th>P<\/td><th>Supply voltage 2.7-3.6V; bypass with 0.1\u00b5F ceramic to GND close to pin<\/td><\/tr><tr><td>9<\/td><th>\/RESET<\/td><th>I<\/td><th>Hardware reset (active low); resets internal state machine and volatile registers; does not affect non-volatile data; unique to SOIC-16 package<\/td><\/tr><tr><td>10<\/td><th>GND<\/td><th>G<\/td><th>Ground (additional); connect to PCB ground plane<\/td><\/tr><tr><td>11-16<\/td><th>NC<\/td><th>-<\/td><th>No connect; leave floating or tie to GND; no internal connection<\/td><\/tr><\/tbody><\/table>","application_scenarios":"<table><thead><tr><th>Application<\/th><th>Description<\/th><\/tr><\/thead><tbody><tr><td>Embedded System XIP Boot Flash<\/td><th>Store MCU\/SoC firmware for execute-in-place boot; Quad I\/O at 104MHz provides 50MB\/s read throughput; QPI mode minimizes instruction overhead; \/RESET pin enables hardware watchdog reset; 4KB sectors support OTA firmware updates with A\/B partitioning<\/td><\/tr><tr><td>Data Logging Storage<\/td><th>Log sensor data in 32MB non-volatile array; 4KB sector erase supports circular buffer with fine granularity; suspend\/resume allows read-back during active logging; 100K erase cycles provide years of operation with wear leveling<\/td><\/tr><tr><td>FPGA Configuration Flash<\/td><th>Store FPGA bitstream for master SPI configuration; 256Mbit supports large FPGAs; Quad SPI reduces configuration time; \/RESET synchronizes with FPGA INIT pin; SOIC-16 footprint compatible with standard PCB assembly<\/td><\/tr><\/tbody><\/table>","alternative_models":"<table><thead><tr><th>Model<\/th><th>Manufacturer<\/th><th>Compatibility<\/th><th>Key Difference<\/th><\/tr><\/thead><tbody><tr><td>W25Q256JVFIQ<\/td><th>Winbond<\/td><th>Pin-Compatible Direct Sub<\/td><th>JV generation (current production); same SOIC-16 pinout; same 256Mbit density; improved erase performance; recommended migration path from FV<\/td><\/tr><tr><td>W25Q256JVFIM<\/td><th>Winbond<\/td><th>Pin-Compatible Direct Sub<\/td><th>JV generation in WSON-8x6mm package; smaller footprint; no \/RESET pin; same SPI\/QSPI interface; use for space-constrained designs<\/td><\/tr><tr><td>MX25L25635FMI-10G<\/td><th>Macronix<\/td><th>Pin-Compatible Alternative<\/td><th>256Mbit SPI NOR Flash; SOIC-16; 104MHz; similar feature set; Macronix second source; use for supply chain diversification<\/td><\/tr><tr><td>S25FL256LAGMFI01<\/td><th>Infineon<\/td><th>Functional Equivalent<\/td><th>256Mbit SPI NOR; SOIC-16; 108MHz; different sector architecture (uniform 256KB); use when Infineon preferred vendor<\/td><\/tr><\/tbody><\/table>"},"_links":{"self":[{"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/posts\/2037","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/comments?post=2037"}],"version-history":[{"count":0,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/posts\/2037\/revisions"}],"wp:attachment":[{"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/media?parent=2037"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/categories?post=2037"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/tags?post=2037"},{"taxonomy":"chip_brand","embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/chip_brand?post=2037"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}