{"id":20,"date":"2026-04-15T09:57:40","date_gmt":"2026-04-15T09:57:40","guid":{"rendered":"https:\/\/materialparts.com\/?p=20"},"modified":"2026-05-12T03:03:23","modified_gmt":"2026-05-12T03:03:23","slug":"mt60b1g16hc-52bg","status":"publish","type":"post","link":"https:\/\/materialparts.com\/es\/mt60b1g16hc-52bg\/","title":{"rendered":"MT60B1G16HC-52B:G"},"content":{"rendered":"<p class=\"wp-block-paragraph\"><strong>MT60B1G16HC-52B:G<\/strong> es de alta velocidad <strong>Componente SDRAM DDR5 de 16 Gb (2 GB)<\/strong> de Micron, configurado como \u00d716 bits de ancho, funcionando a <strong>5200 MT\/s<\/strong> (DDR5-5200). Dise\u00f1ada para la inform\u00e1tica de alto rendimiento, cuenta con integridad de se\u00f1al avanzada, fiabilidad en chip y funcionamiento de bajo consumo, ideal para UDIMM, SODIMM, RDIMM y m\u00f3dulos de memoria de servidor.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Fabricante<\/strong>: Tecnolog\u00eda Micron<\/li>\n\n\n\n<li><strong>N\u00famero de pieza<\/strong>: MT60B1G16HC-52B:G<\/li>\n\n\n\n<li><strong>Densidad<\/strong>: 16Gb (1G \u00d7 16)<\/li>\n\n\n\n<li><strong>Tipo de memoria<\/strong>: SDRAM DDR5<\/li>\n\n\n\n<li><strong>Grado de velocidad<\/strong>: DDR5-5200 (5200 MT\/s)<\/li>\n\n\n\n<li><strong>Latencia CAS<\/strong>: CL-52<\/li>\n\n\n\n<li><strong>Paquete<\/strong>: VFBGA de 102 bolas (7,5 \u00d7 14,0 \u00d7 1,0 mm)<\/li>\n\n\n\n<li><strong>Tensi\u00f3n<\/strong>: VDD\/VDDQ = 1,1V; VPP = 1,8V<\/li>\n\n\n\n<li><strong>Temperatura de funcionamiento<\/strong>: 0\u00b0C a +95\u00b0C<\/li>\n\n\n\n<li><strong>Revisi\u00f3n<\/strong>: Muere Rev G<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Arquitectura de prefetch de 16n bits<\/strong> para un gran ancho de banda<\/li>\n\n\n\n<li><strong>16 bancos internos (4 grupos \u00d7 4 bancos)<\/strong> para acceso paralelo<\/li>\n\n\n\n<li><strong>ECC en chip<\/strong> (C\u00f3digo de correcci\u00f3n de errores) con depuraci\u00f3n de errores<\/li>\n\n\n\n<li><strong>DFE (ecualizaci\u00f3n por realimentaci\u00f3n de decisiones)<\/strong> &amp; <strong>ODT (Terminaci\u00f3n en el troquel)<\/strong><\/li>\n\n\n\n<li><strong>Escritura CRC, m\u00e1scara de datos (DM), formaci\u00f3n CA, formaci\u00f3n DQ VREF<\/strong><\/li>\n\n\n\n<li><strong>Actualizaci\u00f3n autom\u00e1tica<\/strong>: 32ms (\u226485\u00b0C) \/ 16ms (85-95\u00b0C)<\/li>\n\n\n\n<li><strong>Mando Polivalente (MPC)<\/strong>, Apagado, MPSM (Modo de reposo multipuerto)<\/li>\n\n\n\n<li><strong>Conforme a RoHS<\/strong>, Paquete verde<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Memoria para ordenadores de sobremesa, port\u00e1tiles y estaciones de trabajo (UDIMM\/SODIMM)<\/li>\n\n\n\n<li>Plataformas de servidores y computaci\u00f3n en nube<\/li>\n\n\n\n<li>Sistemas integrados de alto rendimiento<\/li>\n\n\n\n<li>Tarjetas de red y aceleradores<\/li>\n<\/ul>","protected":false},"excerpt":{"rendered":"<p>MT60B1G16HC-52B:G is a high-speed 16Gb (2GB) DDR5 SDRAM component from Micron, configured as \u00d716 bit width, operating at 5200 MT\/s (DDR5-5200). Designed for high-performance computing, it features advanced signal integrity, on-chip reliability, and low-power operation, ideal for UDIMM, SODIMM, RDIMM, and server memory modules.<\/p>","protected":false},"author":1,"featured_media":21,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[4],"tags":[],"chip_brand":[3],"class_list":["post-20","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-memory-chips","chip_brand-micron"],"acf":{"brief_explanation":"Micron 16Gb DDR5 SDRAM memory chip","date_code":"","package_case":" FBGA","in_stock":1530,"datasheet":"https:\/\/www.farnell.com\/datasheets\/3704816.pdf","price":"Contact manufacturer","product_introduction":"MT60B1G16HC-52B:G is a 1Gb\u00d716 DDR5 SDRAM memory chip from Micron, with a data rate up to 5200MT\/s. It adopts 1.1V low-voltage design, integrates on-die ECC, ODT and high-speed signal training functions, featuring high stability, low power consumption and large bandwidth. The device is packaged in FBGA, suitable for industrial control, embedded equipment, IoT terminals, consumer electronics and other high-performance memory application scenarios.","working_principle":"Working Principle(Within 200 Words)","pin_description":"<div>MT60B1G16HC-52B:G is a <strong>102-ball FBGA packaged DDR5 SDRAM<\/strong>. Pins are grouped into <strong>power, clock, command\/address, data, control, and test<\/strong> categories, with key definitions and functions as below.<\/div>\r\n<div><\/div>\r\n\r\n<hr \/>\r\n\r\n<div><\/div>\r\n<h2>1. Power Pins<\/h2>\r\n<div>\r\n<div>\r\n<div>\r\n<div tabindex=\"0\" aria-describedby=\"immt9mo\"><\/div>\r\n<\/div>\r\n<\/div>\r\n<div>\r\n<div>\r\n<div>\r\n<table>\r\n<thead>\r\n<tr>\r\n<th>Pin Name<\/th>\r\n<th>Function<\/th>\r\n<\/tr>\r\n<\/thead>\r\n<tbody>\r\n<tr>\r\n<td>VDD<\/td>\r\n<td>Core power (1.1V, nominal)<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>VDDQ<\/td>\r\n<td>I\/O power (1.1V, nominal)<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>VPP<\/td>\r\n<td>Activation power (1.8V, nominal)<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>VSS<\/td>\r\n<td>Ground (core)<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>VSSQ<\/td>\r\n<td>Ground (I\/O)<\/td>\r\n<\/tr>\r\n<\/tbody>\r\n<\/table>\r\n<\/div>\r\n<\/div>\r\n<\/div>\r\n<\/div>\r\n<div><\/div>\r\n<h2>2. Clock Pins<\/h2>\r\n<div>\r\n<div>\r\n<div>\r\n<div tabindex=\"0\" aria-describedby=\"36kpy38\"><\/div>\r\n<\/div>\r\n<\/div>\r\n<div>\r\n<div>\r\n<div>\r\n<table>\r\n<thead>\r\n<tr>\r\n<th>Pin Name<\/th>\r\n<th>Function<\/th>\r\n<\/tr>\r\n<\/thead>\r\n<tbody>\r\n<tr>\r\n<td>CK_t \/ CK_c<\/td>\r\n<td>Differential clock (true\/complement); synchronizes all operations<\/td>\r\n<\/tr>\r\n<\/tbody>\r\n<\/table>\r\n<\/div>\r\n<\/div>\r\n<\/div>\r\n<\/div>\r\n<div><\/div>\r\n<h2>3. Command\/Address (CA) Pins<\/h2>\r\n<div>\r\n<div>\r\n<div>\r\n<div>\r\n<table>\r\n<thead>\r\n<tr>\r\n<th>Pin Name<\/th>\r\n<th>Function<\/th>\r\n<\/tr>\r\n<\/thead>\r\n<tbody>\r\n<tr>\r\n<td>CA0\u2013CA13<\/td>\r\n<td>Command\/address inputs; carry addresses, commands, and bank\/BA signals<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>CS_n<\/td>\r\n<td>Chip select (active LOW); enables\/disables the device<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>CA_ODT<\/td>\r\n<td>ODT control input; configures on-die termination<\/td>\r\n<\/tr>\r\n<\/tbody>\r\n<\/table>\r\n<\/div>\r\n<\/div>\r\n<\/div>\r\n<\/div>\r\n<div><\/div>\r\n<h2>4. Data Pins<\/h2>\r\n<div>\r\n<div>\r\n<div>\r\n<div tabindex=\"0\" aria-describedby=\"aeft2pt\"><\/div>\r\n<\/div>\r\n<\/div>\r\n<div>\r\n<div>\r\n<div>\r\n<table>\r\n<thead>\r\n<tr>\r\n<th>Pin Name<\/th>\r\n<th>Function<\/th>\r\n<\/tr>\r\n<\/thead>\r\n<tbody>\r\n<tr>\r\n<td>DQ0\u2013DQ15<\/td>\r\n<td>16-bit data I\/O; transmits\/receives data<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>DQS_t \/ DQS_c<\/td>\r\n<td>Differential data strobe (true\/complement); aligns data sampling<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>DM_n \/ TDQS<\/td>\r\n<td>Data mask (write) \/ TDQS (read); masks invalid data<\/td>\r\n<\/tr>\r\n<\/tbody>\r\n<\/table>\r\n<\/div>\r\n<\/div>\r\n<\/div>\r\n<\/div>\r\n<div><\/div>\r\n<h2>5. Control &amp; Status Pins<\/h2>\r\n<div>\r\n<div>\r\n<div>\r\n<div>\r\n<table>\r\n<thead>\r\n<tr>\r\n<th>Pin Name<\/th>\r\n<th>Function<\/th>\r\n<\/tr>\r\n<\/thead>\r\n<tbody>\r\n<tr>\r\n<td>RESET_n<\/td>\r\n<td>Reset (active LOW); initializes the device<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>ALERT_n<\/td>\r\n<td>Alert (active LOW); indicates errors (e.g., ECC)<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>ZQ<\/td>\r\n<td>Calibration pin; for ODT and driver strength calibration<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>MIR<\/td>\r\n<td>Mirror pin; configures address mirroring<\/td>\r\n<\/tr>\r\n<\/tbody>\r\n<\/table>\r\n<\/div>\r\n<\/div>\r\n<\/div>\r\n<\/div>\r\n<div><\/div>\r\n<h2>6. Test &amp; Reserved Pins<\/h2>\r\n<div>\r\n<div>\r\n<div>\r\n<div>\r\n<table>\r\n<thead>\r\n<tr>\r\n<th>Pin Name<\/th>\r\n<th>Function<\/th>\r\n<\/tr>\r\n<\/thead>\r\n<tbody>\r\n<tr>\r\n<td>TEN<\/td>\r\n<td>Test enable; enters test mode<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>DNU<\/td>\r\n<td>Do not use; leave unconnected<\/td>\r\n<\/tr>\r\n<\/tbody>\r\n<\/table>\r\n<\/div>\r\n<\/div>\r\n<\/div>\r\n<\/div>\r\n<div><\/div>\r\n<h3>Key Notes<\/h3>\r\n<ul>\r\n \t<li><strong>Differential Signaling<\/strong>: CK\/CK_c and DQS\/DQS_c use differential pairs for noise immunity at 5200MT\/s.<\/li>\r\n \t<li><strong>On-die Termination (ODT)<\/strong>: Controlled via CA_ODT and ZQ calibration to optimize signal integrity.<\/li>\r\n \t<li><strong>16-bit Interface<\/strong>: DQ0\u2013DQ15 enable high-bandwidth data transfer for DDR5-5200.<\/li>\r\n<\/ul>","application_scenarios":"<div>This <strong>MT60B1G16HC-52B:G<\/strong> is a Micron DDR5 1G\u00d716 high-speed SDRAM memory chip with 5200MT\/s bandwidth, low power consumption and industrial-grade stability. It is widely adopted in the following product and application fields:<\/div>\r\n<div><\/div>\r\n<ol>\r\n \t<li>\r\n<div><strong>Embedded Industrial Control Equipment<\/strong>\r\n<div><\/div>\r\nIndustrial motherboards, industrial touch screens, PLC control systems, industrial gateway and edge computing terminals.<\/div>\r\n<div><\/div><\/li>\r\n \t<li>\r\n<div><strong>Consumer Electronic Products<\/strong>\r\n<div><\/div>\r\nSmart TV, high-end set-top boxes, smart home central control hosts, and multimedia playback devices.<\/div>\r\n<div><\/div><\/li>\r\n \t<li>\r\n<div><strong>Network Communication Devices<\/strong>\r\n<div><\/div>\r\n5G small base stations, routers, optical modems, network switches and communication transmission equipment.<\/div>\r\n<div><\/div><\/li>\r\n \t<li>\r\n<div><strong>AIoT &amp; Artificial Intelligence Hardware<\/strong>\r\n<div><\/div>\r\nEdge AI computing boxes, intelligent recognition terminals, vision analysis equipment and IoT intelligent terminals.<\/div>\r\n<div><\/div><\/li>\r\n \t<li>\r\n<div><strong>Automotive &amp; Smart Cockpit<\/strong>\r\n<div><\/div>\r\nVehicle central control screen, car navigation, smart cockpit host and on-board multimedia system (supporting wide temperature stable operation).<\/div>\r\n<div><\/div><\/li>\r\n \t<li>\r\n<div><strong>Medical &amp; Precision Instrumentation<\/strong>\r\n<div><\/div>\r\nMedical diagnostic equipment, laboratory analytical instruments and high-precision testing instruments that require high stability and high bandwidth memory.<\/div><\/li>\r\n<\/ol>","alternative_models":"<div>Below are <strong>pin-to-pin compatible, performance-matched, and upgraded alternatives<\/strong> for the Micron <strong>MT60B1G16HC-52B:G (16Gb, 1G\u00d716, DDR5-5200, 102-ball FBGA)<\/strong>\u00a0suitable as drop-in replacements or upgrades.<\/div>\r\n<div><\/div>\r\n\r\n<hr \/>\r\n\r\n<div><\/div>\r\n<h2>1. Micron Direct Replacements (Same Form\/Fit\/Function)<\/h2>\r\n<div>\r\n<div>\r\n<div>\r\n<div tabindex=\"0\" aria-describedby=\"ndjsige\"><\/div>\r\n<\/div>\r\n<\/div>\r\n<div>\r\n<div>\r\n<div>\r\n<table>\r\n<thead>\r\n<tr>\r\n<th>Part Number<\/th>\r\n<th>Key Specs<\/th>\r\n<th>Compatibility<\/th>\r\n<th>Remarks<\/th>\r\n<\/tr>\r\n<\/thead>\r\n<tbody>\r\n<tr>\r\n<td><strong>MT60B1G16HC-52B:H<\/strong><\/td>\r\n<td>16Gb, 1G\u00d716, DDR5-5200, 102-ball FBGA, Die Rev H<\/td>\r\n<td>Full pin-to-pin<\/td>\r\n<td>Updated die revision, better stability, production statusMicron Technology<\/td>\r\n<\/tr>\r\n<tr>\r\n<td><strong>MT60B1G16HC-56B:G<\/strong><\/td>\r\n<td>16Gb, 1G\u00d716, DDR5-5600 (faster), 102-ball FBGA<\/td>\r\n<td>Pin-compatible<\/td>\r\n<td>Higher speed grade, same package, easy upgrade<\/td>\r\n<\/tr>\r\n<tr>\r\n<td><strong>MT60B1G16HD-64B:H<\/strong><\/td>\r\n<td>16Gb, 1G\u00d716, DDR5-6400, 102-ball FBGA<\/td>\r\n<td>Pin-compatible<\/td>\r\n<td>Top-speed Micron alternative, JEDEC-compliant<\/td>\r\n<\/tr>\r\n<\/tbody>\r\n<\/table>\r\n<\/div>\r\n<\/div>\r\n<\/div>\r\n<\/div>\r\n<div><\/div>\r\n<div><\/div>\r\n<h2>2. Micron Equivalent Density (Different Width, Same Capacity)<\/h2>\r\n<div>\r\n<div>\r\n<div>\r\n<div tabindex=\"0\" aria-describedby=\"mzd08io\"><\/div>\r\n<\/div>\r\n<\/div>\r\n<div>\r\n<div>\r\n<div>\r\n<table>\r\n<thead>\r\n<tr>\r\n<th>Part Number<\/th>\r\n<th>Key Specs<\/th>\r\n<th>Use Case<\/th>\r\n<\/tr>\r\n<\/thead>\r\n<tbody>\r\n<tr>\r\n<td><strong>MT60B2G8HB-52B:G<\/strong><\/td>\r\n<td>16Gb, 2G\u00d78, DDR5-5200, 82-ball FBGA<\/td>\r\n<td>Same density, \u00d78 width, smaller package (for board redesign)\u7f8e\u5149\u79d1\u6280<\/td>\r\n<\/tr>\r\n<\/tbody>\r\n<\/table>\r\n<\/div>\r\n<\/div>\r\n<\/div>\r\n<\/div>\r\n<div><\/div>\r\n\r\n<hr \/>\r\n\r\n<div><\/div>\r\n<h2>3. Cross-Brand Compatible Alternatives (DDR5-5200, 1G\u00d716, 102-ball FBGA)<\/h2>\r\n<div>\r\n<div>\r\n<div>\r\n<div>\r\n<table>\r\n<thead>\r\n<tr>\r\n<th>Brand<\/th>\r\n<th>Part Number<\/th>\r\n<th>Key Specs<\/th>\r\n<th>Compatibility<\/th>\r\n<\/tr>\r\n<\/thead>\r\n<tbody>\r\n<tr>\r\n<td>Samsung<\/td>\r\n<td><strong>K4L1G165ZM-HC52<\/strong><\/td>\r\n<td>16Gb, 1G\u00d716, DDR5-5200, 102-ball FBGA<\/td>\r\n<td>JEDEC-compliant, pin-compatible<\/td>\r\n<\/tr>\r\n<tr>\r\n<td>SK Hynix<\/td>\r\n<td><strong>H5AN1G6NCJ-VKC<\/strong><\/td>\r\n<td>16Gb, 1G\u00d716, DDR5-5200, 102-ball FBGA<\/td>\r\n<td>Industrial-grade, low power, compatible<\/td>\r\n<\/tr>\r\n<\/tbody>\r\n<\/table>\r\n<\/div>\r\n<\/div>\r\n<\/div>\r\n<\/div>\r\n<div><\/div>\r\n\r\n<hr \/>\r\n\r\n<div><\/div>\r\n<h2>4. Key Selection Notes<\/h2>\r\n<ul>\r\n \t<li><strong>Drop-in Swap<\/strong>: Prefer <strong>MT60B1G16HC-52B:H<\/strong> (same speed, updated die) for zero redesignMicron Technology.<\/li>\r\n \t<li><strong>Performance Upgrade<\/strong>: Choose <strong>MT60B1G16HC-56B:G<\/strong> (DDR5-5600) for higher bandwidth without layout changes.<\/li>\r\n \t<li><strong>Cross-Brand<\/strong>: Samsung\/SK Hynix parts offer equivalent specs and are JEDEC-compliant for broad compatibility.<\/li>\r\n<\/ul>"},"_links":{"self":[{"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/posts\/20","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/comments?post=20"}],"version-history":[{"count":0,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/posts\/20\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/media\/21"}],"wp:attachment":[{"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/media?parent=20"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/categories?post=20"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/tags?post=20"},{"taxonomy":"chip_brand","embeddable":true,"href":"https:\/\/materialparts.com\/es\/wp-json\/wp\/v2\/chip_brand?post=20"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}