{"id":3522,"date":"2026-06-06T09:19:39","date_gmt":"2026-06-06T09:19:39","guid":{"rendered":"https:\/\/materialparts.com\/ep4ce30f23i7n\/"},"modified":"2026-06-06T09:19:39","modified_gmt":"2026-06-06T09:19:39","slug":"ep4ce30f23i7n","status":"publish","type":"post","link":"https:\/\/materialparts.com\/ar\/ep4ce30f23i7n\/","title":{"rendered":"EP4CE30F23I7N"},"content":{"rendered":"

\u0646\u0638\u0631\u0629 \u0639\u0627\u0645\u0629 \u0639\u0644\u0649 \u0627\u0644\u0645\u0646\u062a\u062c<\/h2>\n

The EP4CE30F23I7N is a Cyclone IV E series FPGA manufactured by Intel (formerly Altera), featuring 28,848 logic elements, 594 Kbit of embedded memory, 66 embedded 18×18 multipliers, and 4 PLLs. Housed in a 484-ball FBGA package (23 mm x 23 mm), it delivers cost-optimized programmable logic for mid-density applications in communications, industrial, and consumer electronics.<\/p>\n

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Logic Elements<\/td>\n28,848<\/td>\n<\/tr>\n
Embedded Memory<\/td>\n594 Kbit (66 M9K blocks)<\/td>\n<\/tr>\n
Embedded Multipliers (18×18)<\/td>\n66<\/td>\n<\/tr>\n
PLLs<\/td>\n4<\/td>\n<\/tr>\n
Maximum User I\/O<\/td>\n328<\/td>\n<\/tr>\n
Core Voltage<\/td>\n1.15 V to 1.25 V<\/td>\n<\/tr>\n
I\/O Voltage Support<\/td>\n1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, 3.3 V<\/td>\n<\/tr>\n
\u0627\u0644\u062d\u0632\u0645\u0629<\/td>\n484-FBGA (23 x 23 mm)<\/td>\n<\/tr>\n
\u062f\u0631\u062c\u0629 \u062d\u0631\u0627\u0631\u0629 \u0627\u0644\u062a\u0634\u063a\u064a\u0644<\/td>\n-40\u00b0C to +100\u00b0C (Industrial)<\/td>\n<\/tr>\n
Speed Grade<\/td>\nI7<\/td>\n<\/tr>\n
\u0627\u0644\u062a\u0643\u0648\u064a\u0646<\/td>\nSRAM-based (external flash required)<\/td>\n<\/tr>\n<\/table>\n

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    \n
  • Cost-optimized Cyclone IV E architecture with low static power consumption<\/li>\n
  • 66 M9K embedded memory blocks supporting dual-port RAM, ROM, and FIFO<\/li>\n
  • 66 embedded 18×18 hardware multipliers for DSP acceleration (FIR, FFT)<\/li>\n
  • 4 PLLs with clock multiplication, division, and phase shifting<\/li>\n
  • Support for LVDS, RSDS, and differential SSTL I\/O standards<\/li>\n
  • On-chip termination (OCT) for signal integrity<\/li>\n
  • Compatible with Intel Quartus Prime design software<\/li>\n
  • Hot-socketing support and power-down mode<\/li>\n<\/ul>\n

    \u0627\u0644\u062a\u0637\u0628\u064a\u0642\u0627\u062a<\/h2>\n
      \n
    • Protocol bridging and interface conversion in communication systems<\/li>\n
    • Industrial control and automation logic acceleration<\/li>\n
    • Automotive ADAS and infotainment signal processing<\/li>\n
    • Medical imaging and diagnostic equipment<\/li>\n
    • Test and measurement instruments (oscilloscopes, logic analyzers)<\/li>\n
    • Consumer electronics multimedia processing<\/li>\n<\/ul>","protected":false},"excerpt":{"rendered":"

      Product Overview The EP4CE30F23I7N is a Cyclone IV E series FPGA manufactured by Intel (formerly Altera), featuring 28,848 logic elements, 594 Kbit of embedded memory, 66 embedded 18×18 multipliers, and 4 PLLs. Housed in a 484-ball FBGA package (23 mm x 23 mm), it delivers cost-optimized programmable logic for mid-density applications in communications, industrial, and […]<\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[13],"tags":[],"chip_brand":[196],"class_list":["post-3522","post","type-post","status-publish","format-standard","hentry","category-integrated-circuits-ics","chip_brand-intel"],"acf":{"brief_explanation":"Cyclone IV E FPGA, 28848 LE, 594 Kbit RAM, 66 multipliers, 4 PLLs, 328 I\/O, 484-FBGA","date_code":"","package_case":"484-FBGA (23 x 23 mm)","in_stock":11800,"datasheet":"https:\/\/www.intel.com\/content\/dam\/www\/programmable\/us\/en\/pdfs\/literature\/hb\/cyclone-iv\/cyiv-53001.pdf","price":"$18.50 @ 1ku","product_introduction":"The EP4CE30F23I7N is a member of the Intel Cyclone IV E FPGA family, delivering 28,848 logic elements with cost-optimized performance for mid-density applications. The device integrates 66 M9K embedded memory blocks (594 Kbit total), 66 embedded 18x18 hardware multipliers for DSP-intensive operations, and 4 phase-locked loops (PLLs) for flexible clock management. With up to 328 user I\/O pins and support for multiple I\/O voltage standards (1.2V to 3.3V), it offers versatile connectivity for diverse system designs. The SRAM-based configuration architecture enables in-system reprogramming, while the industrial temperature range (-40\u00b0C to +100\u00b0C) ensures reliable operation in harsh environments. Design support is provided through Intel Quartus Prime software, ModelSim simulation, and SignalTap II embedded logic analysis.","working_principle":"The EP4CE30F23I7N operates on a SRAM-based FPGA architecture consisting of three primary subsystems: (1) Logic Array \u2014 The core fabric is organized into Logic Array Blocks (LABs), each containing 16 Logic Elements (LEs). Each LE includes a 4-input look-up table (LUT), a programmable register, and carry chain logic for efficient arithmetic implementation. (2) Embedded Memory \u2014 66 M9K memory blocks provide dual-port SRAM that can be configured as RAM, ROM, FIFO buffers, or shift registers, each block offering 9,216 bits of storage with independent read and write ports. (3) Clock Network \u2014 A hierarchical clock structure with 4 PLLs distributes low-skew clock signals across the device. Each PLL supports clock multiplication, division, and programmable phase shifting. The device configures from external flash (EPCS\/EPCQ) upon power-up, loading the SRAM configuration data to define the logic function.","pin_description":"\n
      Pin Group<\/th>Function<\/th>Voltage<\/th>Description<\/th><\/tr>\n
      VCCINT<\/td>Core Power<\/td>1.2 V<\/td>Internal logic core supply voltage<\/td><\/tr>\n
      VCCIO<\/td>I\/O Bank Power<\/td>1.2-3.3 V<\/td>Per-bank I\/O supply, 8 independent banks<\/td><\/tr>\n
      GND<\/td>Ground<\/td>0 V<\/td>Common ground reference<\/td><\/tr>\n
      I\/O Pins<\/td>User I\/O<\/td>VCCIO<\/td>Up to 328 general-purpose I\/O with programmable standards<\/td><\/tr>\n
      CLK<\/td>Dedicated Clock<\/td>VCCIO<\/td>Global clock input pins with low-skew distribution<\/td><\/tr>\n
      CONF_DONE<\/td>Configuration Status<\/td>VCCIO<\/td>Indicates successful device configuration<\/td><\/tr>\n
      nCONFIG<\/td>Configuration Control<\/td>VCCIO<\/td>Active-low reset for device reconfiguration<\/td><\/tr>\n
      DCLK<\/td>Configuration Clock<\/td>VCCIO<\/td>Serial configuration clock input<\/td><\/tr>\n
      DATA0<\/td>Configuration Data<\/td>VCCIO<\/td>Serial configuration data input<\/td><\/tr>\n
      JTAG (TCK\/TMS\/TDI\/TDO)<\/td>Debug\/Programming<\/td>VCCIO<\/td>IEEE 1149.1 JTAG boundary scan interface<\/td><\/tr>\n<\/table>","application_scenarios":"
        \n
      • Protocol bridging and data path conversion in routers, switches, and base stations<\/li>\n
      • Industrial automation: real-time logic control, motor drive feedback loops, sensor fusion<\/li>\n
      • Automotive: ADAS signal preprocessing, infotainment display controllers, sensor module integration<\/li>\n
      • Medical imaging: front-end signal filtering, data acquisition, and image processing pipelines<\/li>\n
      • Test and measurement: high-speed data capture, pattern generation, and digital logic analysis<\/li>\n<\/ul>","alternative_models":"\n
        Manufacturer<\/th>Part Number<\/th>Package<\/th>Notes<\/th><\/tr>\n
        Intel\/Altera<\/td>EP4CE40F23I7N<\/td>484-FBGA<\/td>Higher density, 39,600 LE, pin-compatible<\/td><\/tr>\n
        Intel\/Altera<\/td>EP4CE22F17I7N<\/td>256-FBGA<\/td>Lower density, 22,320 LE, smaller package<\/td><\/tr>\n
        Xilinx<\/td>XC6SLX25-2FTG256C<\/td>256-BGA<\/td>Spartan-6, 24,051 LE, similar mid-range<\/td><\/tr>\n
        Xilinx<\/td>XC7A35T-1CPG236C<\/td>236-BGA<\/td>Artix-7, 33,280 LE, newer architecture<\/td><\/tr>\n
        Lattice<\/td>LFE3-35EA-6FN484C<\/td>484-BGA<\/td>ECP3, 33,000 LE, comparable density<\/td><\/tr>\n
        Intel\/Altera<\/td>10M30DAF484C6GES<\/td>484-BGA<\/td>MAX 10, 30,208 LE, non-volatile config<\/td><\/tr>\n<\/table>"},"_links":{"self":[{"href":"https:\/\/materialparts.com\/ar\/wp-json\/wp\/v2\/posts\/3522","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/materialparts.com\/ar\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/materialparts.com\/ar\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/materialparts.com\/ar\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/materialparts.com\/ar\/wp-json\/wp\/v2\/comments?post=3522"}],"version-history":[{"count":0,"href":"https:\/\/materialparts.com\/ar\/wp-json\/wp\/v2\/posts\/3522\/revisions"}],"wp:attachment":[{"href":"https:\/\/materialparts.com\/ar\/wp-json\/wp\/v2\/media?parent=3522"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/materialparts.com\/ar\/wp-json\/wp\/v2\/categories?post=3522"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/materialparts.com\/ar\/wp-json\/wp\/v2\/tags?post=3522"},{"taxonomy":"chip_brand","embeddable":true,"href":"https:\/\/materialparts.com\/ar\/wp-json\/wp\/v2\/chip_brand?post=3522"}],"curies":[{"name":"\u062f\u0628\u0644\u064a\u0648 \u0628\u064a","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}